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CTIMES / Electronics industry
Science and Technology
Allusion
Microsoft's rise

Microsoft in 1975, jointly established by the buddy Paul Allen and Bill Gates, 1981, Bill Gates completed the first version of MS-DOS and IBM's first PC sync to launch, through the success of MS-DOS, Microsoft rolled out a lot of popular software, in addition to focusing on compatibility between products, attention to long-term goals of the policy on in software development, this is the reason why Microsoft continues to retain market.
NEC Develops Data Processing Technology that Accelerates the Execution of Machine Learning (2017.07.03)
NEC Corporation announced that it has developed data processing technology that accelerates the execution of machine learning on vector computers by more than 50 times in comparison to Spark technologies. This newly developed data processing utilizes computing and communications technologies that leverage "sparse matrix" data structures in order to significantly accelerate the performance of vector computers in machine learning
Toshiba Launches CMOS Operational Amplifier with Leading Low Noise (2017.07.03)
Toshiba Corporation’s Storage & Electronic Devices Solutions Company today announced the launch of “TC75S67TU,” a new operational amplifier that realizes industry-leading low noise. Sample shipments start today with mass production scheduled for August
Taiwanese LCD Manufacturer, CPT, Becomes Supplier for German Car (2017.07.03)
TAIPEI, Taiwan - Taiwanese LDC manufacturer, Chunghwa Picture Tubes, Ltd. (CPT) specializes in markets for small to medium sized LCDs and LCDs for use in automobiles, and they announced that for the first time this year they will be entering supply chains for front-line German automobile manufacturers and providing dashboard display panels
Microsemi Announces the Engineering Samples of its PolarFire FPGAs (2017.07.03)
Microsemi Corporation, today announced its PolarFire field programmable gate array (FPGA) engineering samples (ES) are available for ordering. The PolarFire FPGA family provides the lowest power, cost-optimized mid-range devices spanning from 100K logic elements (LEs) to 500K LEs
Micro LED to Become Mainstream for Mobile Display Panels (2017.06.29)
TAIPEI, Taiwan - Taiwan's Photonics Industry & Technology Development Association (PIDA) pointed out that because Micro LED display technologies led by Japanese manufacturers are gradually being used in small and medium-sized display panels, they will become another next generation mobile phone display panel solution other than AMOLED
Taiwanese Server Shipment Volume Expected to Grow 10% YoY in 2H (2017.06.29)
Shipment volume of the Taiwanese server system industry at full system and /barebone and board levels is forecast to reach 2.11 million and 2.69 million units, respectively, in second half of 2017, growing 10% year-on-year, according to Taipei-based research institute MIC (Market Intelligence and Consulting Institute)
New MCU Software Eliminates an FPGA to Achieve a Sub-1 µs Current Loop in Industrial Systems (2017.06.29)
Texas Instruments introduced DesignDRIVE Fast Current Loop software that makes C2000 microcontrollers (MCUs) the first devices to push current-loop performance to less than 1 microsecond. Together, TI's C2000™ MCU portfolio and DesignDRIVE software delivers system-on-chip (SOC) functionality which simplifies drive control system development
Winbond Introduces First Very-Low-Voltage Flash Memories (2017.06.29)
TAICHUNG, Taiwan - Winbond Electronics Corporation today announced a dramatic expansion of its flash product portfolio with the introduction of its lowest-voltage SpiFlash memories to date. At 1.2 and 1.5V – the industry’s lowest NOR Flash voltages – and in 8-pin packages
Chinese TV Makers’ Panel Demand Expected to Raise in Q3 (2017.06.28)
Panel demand from South Korean and Chinese TV makers is expected to pick up in the third quarter of 2017, after recording lower-than-planned panel purchases in the second quarter, according to IHS Markit. According to the latest report from IHS Markit
TI Introduces a Three-phase, GaN-based Inverter Reference Design (2017.06.28)
Texas Instruments (TI) introduced an innovative three-phase, gallium nitride (GaN)-based inverter reference design that helps engineers build 200-V, 2-kW AC servo motor drives and next-generation industrial robotics with fast current-loop control, higher efficiency, more accurate speed, and torque control
Industry’s First CAN Flexible Data-rate and CAN Partial Networking Transceiver Family (2017.06.28)
The industry’s first family of Controller Area Network (CAN) transceivers including various automotive Grade 0 qualified parts is now available from Microchip Technology. The ATA65XX family adds six new devices to Microchip’s CAN portfolio
Toshiba Memory to Invest in Manufacturing Facilities for Fab 6 at Yokkaichi Operations (2017.06.28)
Toshiba Corporation today announced that its board of directors, meeting today, has agreed upon a FY2017 investment program for its wholly owned subsidiary, Toshiba Memory Corporation (TMC), that will channel approximately 180 billion yen into Fab 6 at Yokkaichi Operations, TMC’s Flash memory facility
Seoul Semiconductor and Toshiba Materials Develop Natural Spectrum LED (2017.06.28)
Seoul Semiconductor announced at a press conference in Frankfurt, Germany on June 26, 2017, the new SunLike Series natural spectrum LED technology was co-developed by Seoul Semiconductor and Toshiba Materials. The SunLike Series LED technology closely matches the spectrum of natural sunlight that human have enjoyed for thousands of years
Chinese ODMs Have Rapidly Risen to Prominence as Competition for Panel Supply Becomes Critical (2017.06.27)
This year's top four LCD TV ODMs by their target shipments in order will be TCL, TPV, Foxconn and BOE Vision-Electronic Technology (BOEVT), according to the preliminary estimation by WitsView, a division of TrendForce. The fourth-place BOEVT in particular has emerged as a major pure ODM by taking advantage of the vast panel supply provided by its group company BOE Technology (BOE)
China Mobile and NTT DOCOMO Develop World's First Multi-Vendor eSIM System for IoT (2017.06.27)
China Mobile Communications Corporation and NTT DOCOMO, INC. announced today that they have jointly developed the world's first multi-vendor embedded subscriber identity module (eSIM) system within their commercial environments based on the GSMA's Remote Provisioning Architecture for Embedded UICC3
20V, 4MHz, Synchronous Dual 6A Step-Down Regulator in a Compact 4mm x 5mm QFN (2017.06.27)
Analog Devices, Inc., which recently acquired Linear Technology Corporation, announces the LTC3636 and LTC3636-1 are high efficiency, 4MHz synchronous dual output buck regulators that incorporate a unique constant frequency/controlled on-time, current mode control scheme with phase lockable switching frequency
HOLTEK New HT16E07 Electrophoretic Electronic Paper 120-Segment Driver (2017.06.27)
Holtek announce its new HT16E07 electrophoretic electronic paper (EPD) 120-segment driver device. EPD is implemented using a bi-stable display technique which has the advantages of good readability, is environmentally friendly and offers good power saving characteristics
ZF, HELLA, NVIDIA Partner to Increase Safety of Self-Driving Vehicles (2017.06.27)
NVIDIA today announced it has formed a strategic partnership with ZF and HELLA to deliver AI technology with the New Car Assessment Program (NCAP) safety certification for the mass deployment of self-driving vehicles. The agreement is non-exclusive
Innolux and NEXT Biometrics Produce the World's First Thermal-Inductive Flexible Fingerprint Sensor (2017.06.27)
TAIPEI, Taiwan - Taiwanese LCD manufacturer Innolux Corporation in cooperation with NEXT Biometrics ASA is producing the world's first thermal-inductive flexible fingerprint sensor in the third quarter of this year. With the increasing risk of security issues there has been a corresponding increase in demand for biometric identification technology
Bosch Announces High-performance MEMS Acceleration Sensors for Wearables (2017.06.26)
Bosch Sensortec announced a new family of MEMS acceleration sensors for wearable devices, offering high performance and ease of integration in compact packages: The BMA456 and BMA423 are specifically designed for motion and fitness tracking in wearables

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