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Ixia Launches the First Software Solution Specifically Designed for Pre-silicon Testing (2016.11.02)
Ixia announced the availability of IxVerify, the first software solution specifically architected to work in an emulation-based verification flow. IxVerify, combined with the Veloce Virtual Network (VN) App, accelerates the pre-silicon verification of complex networking chips |
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Average PC DRAM Contract Price Jumped Over 20% Sequentially in October (2016.11.02)
DRAMeXchange, a division of TrendForce, reports the average contract price of 4GB PC DRAM modules increased over 20% between September and October from US$14.5 to US$17.5 as DRAM suppliers completed their fourth-quarter contract negotiations with first-tier PC-OEMs |
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ASUS: Will Introduce AR, VR, and MR Products (2016.11.02)
TAIPEI, Taiwan - Asus Chairman Jonny Shih yesterday said that Asus’ Virtual Reality (VR) product strategy will begin from gaming applications and later develop in the direction of Augmented Reality (AR) and Mixed Reality (MR) and then be integrated with robots |
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AURIX MCU TC3xx Family of Infineon for Automotive (2016.11.02)
Serving the requirements of automated cars and electric vehicles Infineon Technologies AG launched the next generation of its AURIX microcontroller family. The TC3xx microcontrollers offer the highest level of integration on the market and real-time performance that is three times higher than that available today |
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Microsemi Adds New Entry-Level RAID Solutions to Adaptec Series for Server Storage (2016.11.02)
Microsemi Corporation announced two new adapters in its award-winning Microsemi Adaptec Series 8 product family. The 8405E and 8805E offer server storage customers entry-level systems with redundant array of independent disks (RAID) devices that deliver accelerated performance with built-in cache and uncompromised reliability |
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Innolux’s New 8.6-Gen LCD Panel Plant to Enter Mass production in the Q1 2017 (2016.11.01)
TAIPEI, Taiwan - Taiwanese LCD panel maker Innolux’s 8.6 generation LCD panel plant has already been installed and is expected to go mass production in the first quarter of next year, mainly for the production of 45-inch and 58-inch LCD TV panels |
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Sensors for smartphones Are Hot Selling Items (2016.11.01)
(圖一) The number of mobile phone sensors used
Smartphone manufacturers are continuing to increase the number of build-in sensors on high-end mobile phones and are making the actually not that smart of phones more and more worthy of the name “smart phones |
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NOR Flash May Be in Short Supply Next Year, Macronix Says (2016.11.01)
TAIPEI, Taiwan - Taiwanese memory manufacturer Macronix last week stated that the phenomenon of a NOR Flash Memory shortage may materialize next year.
Macronix is one of Taiwan’s main NOR Flash Memory suppliers and currently occupies the second biggest proportion of the global market at 23% |
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Vishay’s Ultra-Precision Thin Film Chip Resistor with Low TCR of ± 2 ppm/°C (2016.11.01)
Vishay Intertechnology introduced a new ultra-precision thin film chip resistor that offers a dramatic improvement in TCR and tolerance over previous-generation devices. Available in five case sizes from 0603 to 2512, the Vishay Dale Thin Film PLTU offers a tight TCR of ± 2 ppm/°C and tolerance of ± 0 |
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Thunderboard Sense Kit from Silicon Labs Inspires IoT Developers (2016.11.01)
Silicon Labs has introduced a complete sensor-to-cloud development kit that provides all the hardware and software developers need to create battery-powered wireless sensor nodes for the Internet of Things (IoT).
Silicon Labs’ new feature-packed Thunderboard Sense “inspiration kit” includes six onboard sensors |
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TI Unveils the Industry's First Single-chip 60-V eFuse with Reverse Polarity Protection (2016.11.01)
Texas Instruments (TI) introduced the first single-chip eFuse with back-to-back FETs, providing the industry's highest rating of protection at up to 60 V.
Offering on-chip advanced features including reverse polarity protection and reverse current blocking, the TPS2660 is the most integrated eFuse on the power management market for 24-V and 48-V rail applications in industrial, automotive and communication infrastructure designs |
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Toshiba New Stepping Motor Driver IC Lowers Motor Noise and Vibration (2016.10.31)
Toshiba Corporation's Storage & Electronic Devices Solutions Company today announced the launch of “TB67S209FTG”, a stepping motor driver with an architecture that lowers noise and vibration during motor operation. Mass production is slated to begin at the end of December |
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OPPO Tops the Chinese Smartphone Market, IDC Says (2016.10.31)
According to IDC, the China smartphone market grew 5.8% YoY and 3.6% QoQ in the third quarter of 2016, with OPPO and vivo overtaking Huawei for the first time in the market.
OPPO and vivo rose because the Chinese market has evolved beyond operator and online driven channels over to an offline structure that dovetails with OPPO and vivo’s strengths |
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ARM Launches the Mali-V61 and Mali-G51 for Mobile VR and 4K Streaming (2016.10.31)
ARM has launched two new products designed to address Generation Z and mainstream demands for more immersive and interactive visual content on mobile devices. The two new products are; the Mali-V61 video processing unit (VPU) for real-time 4K120 video performance with efficiency and scalability and the Mali-G51 graphics processing unit (GPU) |
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Axiomtek's High-performance Fanless Embedded System with Flexible Expansion (2016.10.31)
Axiomtek is announcing the eBOX670-891-FL, a fanless embedded system supporting the 6th generation Intel Core i7/i5/i3 and Celeron processors (formally codename: Skylake) with flexible I/O configurations.
This embedded box PC is equipped with dual DDR4-2133 SO-DIMM slots with system memory up to 32 GB |
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Murata and Sony Sign Definitive Agreement for the Transfer of Battery Business (2016.10.31)
Murata Manufacturing Co., Ltd. and Sony Corporation today announced that they have signed a binding definitive agreement to transfer the Sony Group's battery business to the Murata Group.
Under the definitive agreement, Sony will transfer to Murata the battery business conducted by Sony Energy Devices Corporation |
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Imec Reports Breakthrough Work that Advances Path for Nanoscale Spin-Wave Majority Gates (2016.10.31)
At the Annual Conference on Magnetism and Magnetic Materials, imec presented breakthrough results supporting the building of technology-relevant majority gates based on spin waves.
Reporting two industry-first achievements that are crucial for ultralow-power beyond-CMOS technology |
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Acer to Extend its VR Offering by Support-ing the Windows Holographic Platform in Q1 2017 (2016.10.31)
TAIPEI, Taiwan - Acer announces that it will offer VR Head-Mounted Displays (HMDs) capable of mixed reality through the Windows 10 Creators Update in 2017.
Adding to the current portfolio comprising of the professional and location-based entertain-ment StarVR developed jointly with Starbreeze |
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iST Signs a Formal Cooperation Agreement with FAW Tier 2 (2016.10.28)
iST announced today that together with DEKRA, it has signed a formal cooperation agreement with FAW Second Tier Management Company (FAW Tier 2), a subsidiary of FAW Group. Take effect on November 1, 2016, this transformation and upgrading consulting program of selected maintenance centers and spare parts management will officially be a new stage of this trilateral cooperation |
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Advantech Hands with ARM to Popularize Global IoTs Platform (2016.10.28)
TAIPEI, Taiwan - At the Embedded IoT Partner Summit Partner Conference, Taiwanese intelligent systems provider Advantech announced that it will work with ARM on the ARM mbed Cloud and the mbed IoT Device Platform. Advantech will use ARM mbed OS and ARM mbed Cloud on its M2 |
One wants to meet different market needs of general-purpose interface Bus standards, can continue to upgrade transmission speeds and greater bandwidth, to achieve speed, capacity, quality and other multivariate integration, enhance the effectiveness of desire?