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New NAND Flash Memory Products From Toshiba for Embedded Applications (2015.10.21)
Toshiba Corporation launched a new line-up of NAND flash memory products for embedded applications that are compatible with the widely used Serial Peripheral Interface (SPI). Wide ranging applications for the new “Serial Interface NAND” include such consumer applications as flat-screen TVs, printers and wearable devices, and industrial applications, including robots |
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Indium’s Hisert Explains How to Select the Proper Solder Preform (2015.10.21)
Indium Corporation announces the release of its newest informational video that guides the audience on the proper steps for selecting a solder preform. This brief video features Indium Corporation’s Jim Hisert, Manufacturing Engineer, and SMT expert Phil Zarrow, President and Principal Consultant for ITM Consulting, discussing the process of selecting the appropriate solder preform for various applications |
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Renesas’ Third Generation Single-Chip Powerline Modem (2015.10.21)
Renesas Electronics Corporation announced the launch of the third generation of its frequency division multiplexing (OFDM) powerline communication (PLC) modem solution.
The new solution is based on a modem system-on-chip (SoC), the R9A06G037, integrating a high-performance digital signal processor (DSP) and large-capacity SRAM, which realizes drastic improvement in communication software processing performance |
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Advanced Curve Tracer Packages for Electronics Equipment Manufacturers (2015.10.21)
Keysight Technologies today introduced three advanced curve tracer packages for its B1506A Power Device Analyzer. Designed to provide power device and power electronics equipment manufacturers with a low-cost curve tracer equivalent solution, the packages deliver capabilities that exceed those available with traditional curve tracers at a comparable price |
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SEMI: Silicon Shipment Volumes Contine to Grow By 2017 (2015.10.21)
TAIPEI, Taiwan - SEMI forecasted that total wafer shipments this year are expected to exceed the market high set in 2014 and are forecast to continue shipping at record levels in 2016 and 2017.
SEMI recently completed its annual silicon shipment forecast for the semiconductor industry |
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BOE Jumps to No. 4 in Ranking of TV Panel Suppliers, Says TrendForce (2015.10.21)
The latest large-size panel shipment report by WitsView, a division of TrendForce, reports that TV panel shipments totaled 24.47 million units in September, representing a monthly increase of 9.9% and a year-on-year increase of 13 |
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Toshiba, SanDisk Start Equipment Installation at Yokkaichi's New Fab 2 (2015.10.21)
Toshiba Corporation and SanDisk Corporation today announced the start of equipment installation in the New Fab 2 facility at Yokkaichi Operations. New Fab 2 is primarily intended to provide the clean room space necessary to transition a significant portion of the current Yokkaichi 2D NAND capacity to 3D flash memory |
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Intel to Expand Production of 3D NAND in Dalian China (2015.10.21)
Intel announced plans to increase its investment in non-volatile memory technology to better serve customer needs and keep pace with the strong demand for Intel Solid State Drive solutions.
Projecting the SSD technology will become a main driving force of Intel’s core computing business, and a key part of Intel’s strategy to be a foundational supplier of the infrastructure that powers the smart, connected world |
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Silver Nanowires Revolutionizing the CE/Human Interface (2015.10.21)
Our hands, wrists and shoulders are not hard or flat & rectangular. They're soft, pliable and pressure-sensitive. But the current personal electronics gadgets we're carrying around are still hard, flat and pretty rigid. All this will change as portable/wearable devices move into mass market acceptance |
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New A12S and A9SE Camera SoCs Deliver FHD and 4K Video Image (2015.10.20)
Ambarella announced the addition of A12S and A9SE to its range of camera solutions for drones, or flying cameras. The Full HD A12S SoC family enables a new generation of entry-level flying cameras, including small form factor designs and racing drones; while the 4K Ultra HD A9SE SoC family is ideal for midrange designs |
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Industry's First Commercial Silicon Support for New VDSL2 35b and G.fast Bonding Standards (2015.10.20)
Broadcom Corporation announced VDSL2 35b and G.fast bonding support for two new protocols under development in the International Telecommunication Union (ITU). With support for these new standards, Broadcom is enabling DSL network operators with a long-term roadmap for competitive high-bandwidth services with minimal investment to their physical plants |
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New Single-Chip PON OLT Device for New XGPON-1 and NGPON-2 Protocols (2015.10.20)
Broadcom Corporation today introduced the industry's most comprehensive universal passive optical network (PON) device for optical line terminals (OLTs). The new chip gives OEMs and operators the greatest flexibility in deployment, promoting broader fiber services around the world |
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Capacitive Sensing with World's Only Noise-immune Solution (2015.10.20)
Texas Instruments (TI) today introduced a capacitive sensing integrated circuit (IC) family that is immune to environmental noise from sources such as radios, power supplies, lights and motors.
The FDC2214 family offers 60x better performance in the presence of noise than existing capacitive-sensing solutions, enabling low-cost capacitive-based human body and object sensing in any environment |
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Micron Announces New NOR Flash memory, Winbond Licensed First (2015.10.20)
Micron Technology today announced XTRMFlash memory, a faster NOR flash solution designed to revolutionize the way the electronics industry develops systems to meet the demand for "instant-on" performance and fast system responsiveness in automotive, industrial and consumer applications |
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UL Establishes PCB Performance Testing services Lab in Taiwan (2015.10.20)
TAIPEI, Taiwan － UL today offically opened its printed circuit board performance testing services laboratory in Taipei. With the UL746 and UL796 safety certification, UL is going to provide a more complete product specification testing and inspection services for the local printed circuit board firms |
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China and AMD Form Chips Assembly & Testing Joint Venture (2015.10.20)
TAIPEI, Taiwan － Chinese Nantong Fujitsu Microelectronics Co., Ltd. announced the acquisition of two Advanced Micro Devices（AMD）foundries located in Suzhou and Penang, Malaysia, paying for $370 million. They will finish the transaction in the first half of 2016 and create a joint venture of semiconductor assembly and test |
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Major Foundries Ready to Battle for a Share of China’s Fast-Growing IC Market (2015.10.20)
According to global market research firm TrendForce, Chinese IC design houses have benefitted from generous government subsidies in recent years. Moreover, Chinese OEM vendors are extending their overall share of the downstream system market worldwide |
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Mentor Graphics Veloce VirtuaLAB Adds Next-Generation Protocols (2015.10.20)
CALIFORNIA, USA — Mentor Graphics Corp., on Octorber 19 announced the Veloce VirtuaLAB Ethernet environment with support for 25G, 50G and 100G Ethernet. This support enables highly efficient, emulation-based verification for the massive Ethernet-based designs being created today |
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New Si32x8x Single and Dual ProSLIC Family (2015.10.20)
Silicon Labs introduced a new family of subscriber line interface circuits (SLICs) offering the lowest power consumption, smallest footprint, and highest levels of integration and programmability for the voice-over-IP (VoIP) gateway market |
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200mm Wafer Fab Capacity Forecast to 5.4 Million wspm in 2018 (2015.10.20)
According to a lastest report, from SEMI, worldwide 200mm semiconductor wafer fab capacity is forecast at 5.2 million wafer starts per month (wspm) in 2015 and expanding to 5.4 million wspm in 2018.
Based on the rapidly increasing number of internet-enabled mobile devices and the emergence of the IoT (Internet of Things), demand for sensors, MEMS, analog, power and related semiconductor devices is growing |
The highly integrated chipset, but only in recent years happened, if the CPU is the brain of the computer, Chipsets can be regarded as the heart of the computer.