 |
CyanogenMod, New opportunities for Taiwan SMEs (2015.07.17)
Care to get your handset’s operating sysytem (OS) customized? Here comes the CyanogenMod (CM), which is all the rage for the reason it’s aiming at replacing Google’s Android. William Liang, former Senior Director at innovation Digital System Business Group (iDSBG) System Software Division Operating System Department of Hon Hai Technology |
 |
16 MP CMOS Image Sensor for Smartphones and Tablets (2015.07.17)
Toshiba Corporation announced the launch of “T4KC3”, a 16 megapixel(MP) BSI CMOS image sensor. Sample shipments are scheduled to start in September this year.
In the mobile device market, manufacturers constantly target a small form factor; a thinner final product |
 |
SEMI Forecasts Three Years of Growth in Chip Equipment Spending (2015.07.17)
TAIPEI, Taiwan – SEMI projects three consecutive years of growth in worldwide semiconductor equipment sales according to the mid-year edition of the SEM Capital Equipment Forecast. SEMI forecasts that the total semiconductor equipment market will grow 7 percent in 2015 (reaching $40 |
|
TSMC Reports 2Q EPS of NT$3.06, Revenue Growth YoY of 12.2% (2015.07.16)
HSINCHU, Taiwan － TSMC today announced consolidated revenue of NT$205.44 billion, net income of NT$79.42 billion, and diluted earnings per share of NT$3.06 (US$0.50 per ADR unit) for the second quarter ended June 30, 2015.
Year-over-year, second quarter revenue increased 12 |
|
ZTE and KT Sign Strategic Partnership on 5G in Korea (2015.07.16)
ZTE has signed a strategic cooperation agreement with KT Corporation on research and commercialization of 5G technology.
Under the memorandum of understanding (MOU), ZTE and KT will launch 5G Test Bed construction in Seoul, and jointly develop, present, and design the future 5G network architecture based on the Test Bed |
|
The Smallest Development Kit in R-Car History (2015.07.16)
Renesas Electronics introduced the smallest R-Car-based development kit to date—the ADAS Starter Kit—based on Renesas' high-end R-Car H2 System on Chip (SoC) and developed to help simplify and speed up the development of advanced driver assistance systems (ADAS) applications |
|
LED Lighting Market in South Korea to Grow at a CAGR of 22.99% (2015.07.16)
According to the Research and Markets, the LED lighting market in South Korea to grow at a CAGR of 22.99% over the period 2014-2019.
Research and Markets pointed that LED lighting is gaining acceptance because of its efficiency and low cost |
|
TSMC: 16nm to Surpass 20nm in Sales Revenue in 2016 (2015.07.16)
TAIPEI, Taiwan — Taiwan Semiconductor Manufacturing Company (TSMC) held its second quarter earnings conference on July 16, announced consolidated revenue of NT$205.44 billion, net income of NT$79.42 billion, and diluted earnings per share of NT$3 |
|
Reflowable, Low Impedance Chip-Type Capacitor (2015.07.16)
Seiko Instruments Inc. (SII) announcedthat it is expanding its lineup of chip-type Electric Double Layer Capacitor (EDLC). The products are CPX10080C104F (hereinafter, “CPX104”), CPZ10080C104F (hereinafter, “CPZ104”) , and CPX10080C402F (hereinafter, “CPX402”) |
|
Wearable Systems to Boost Total IoT Sales in 2015 (2015.07.16)
Market revenues associated with network communications, sensing, and control functions in subsystems and objects attached to the Internet of Things (IoT) are forecast to grow 29% in 2015 to $62.4 billion after increasing 21% in 2014 to about $48 |
|
Let’s Touch Taiwan in August (2015.07.15)
TAIPEI, Taiwan — “Touch Taiwan” is the only UFI-certified touch panel and optical film exhibition in the world. Co-organized by Taiwan Display Union Association (TDUA), Taiwan TFT LCD Association (TTLA), Taiwan Flat Panel Display Materials and Devices Association (TDMDA), Taiwan Electronic Equipment Industry Association (TEEIA) and Chan Chao Int'l Co |
|
Hon Hai to Invest in Czech (2015.07.15)
TAIPEI, Taiwan — After an invest plan in India, Hon Hai Precision Industry Co. is reportedly to sign a memorandum in collaboration with the Czech Republic later this month related to an investment in a research and design center in that nation |
|
Taiwan Tops Fab Spending ─ Driving Anticipation for SEMICON Taiwan 2015 (2015.07.15)
TAIPEI, Taiwan – In 2015, Taiwan is projected to have the highest capex for semiconductor manufacturing worldwide. Taiwan’s aggressive semiconductor factory plans are bringing exhibitors and attendees to SEMICON Taiwan 2015 on September 2-4 at the TWTC Nangang Exhibition Hall |
|
ASUS Announces World’s First TV Tablet "ZenPad" with 4GB RAM (2015.07.15)
TAIPEI, Taiwan － Asus unveiled yesterday a new series of tablet named “Asus ZenPad”, to be available in Taiwan today. The new tablet, featuring 4GB RAM, high-end TV level GPU, HD IPS display, ASUS Tru2Life visual enhancement technology and DTS-HD Premium Sound, aims to satisfy the eagerness for high-quality mobile video |
|
1.8V~5.5V Low Voltage Flash MCUs for LED/LCD Display (2015.07.15)
Holtek wishes to reveal the release of its new 1.8V~5.5V low voltage A/D type Flash devices, the HT66F317/318/319 series. With the special characteristic of a low 1.8V operating voltage and high-speed 16MHz at 3.3V operation, these new devices will find excellent use in battery powered applications or consumer electronic products which have incorporate an LED/LCD display |
|
Monolithic CMOS DDR3L SDRAM With 8Gb Density (2015.07.15)
Alliance Memory introduced a new monolithic high-speed, low-voltage CMOS double data rate 3 synchronous DRAM (DDR3L SDRAM) with an 8-Gb density in the 96-ball, 9-mm by 14-mm, lead (Pb)-free FBGA package. Featuring state-of-the art silicon provided by Micron Technology, the AS4C512M16D3L (512M x 16) offers a double data rate architecture for extremely fast transfer rates of up to 1600 Mbps/pin and clock rates of 800 MHz |
|
HP, NEC Collaborate to Advance Adoption of Network Functions Virtualization (2015.07.15)
At Mobile World Congress Shanghai, HP and NEC announced the two companies will collaborate to accelerate communications service provider (CSP) adoption of network functions virtualization (NFV) technology.
NFV offers a new way for CSPs to design, deploy, and manage networking services |
|
Imec, SPTS Collaborate on Critical Processes for 3D IC Wafer Stacking (2015.07.15)
imec and SPTS Technologies, an Orbotech company and supplier of advanced wafer processing solutions for the global semiconductor and related industries, announced at SEMICON West that they are jointly developing a highly accurate, short cycle-time dry silicon removal and low temperature passivation solution for through-silicon via-middle processing and thinning of the top-wafer in wafer-to-wafer bonding |
|
External Sales of LED Chips Reached $4.35B in 2014 (2015.07.14)
The global market value from the external sales of LED chips grew 18% from US$3.677 billion in 2013 to US$4.35 billion in 2014, according to LEDinside, a division of TrendForce. The share of Chinese companies in the external sales market also rose from 27% in 2013 to 36% in 2014 |
|
Industry’s First 22nm FD-SOI Technology Platform (2015.07.14)
GLOBALFOUNDRIES today launched a new semiconductor technology developed specifically to meet the ultra-low-power requirements of the next generation of connected devices. The “22FDX” platform delivers FinFET-like performance and energy-efficiency at a cost comparable to 28nm planar technologies, providing an optimal solution for the rapidly evolving mainstream mobile, Internet-of-Things (IoT), RF connectivity and networking markets |
If the supply of the computer's power supply is not normal interrupt or current unstable, uninterruptible power supply UPS (Uninterruptible Power Supply) will assume the function of the temporary emergency power supply, so that the computer will not be forced to the loss of data due to power outage, or causedamage.