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Imec and Tokyo Electron Demonstrate Electrical Advantages of Direct Cu Etch Scheme (2015.05.21)
At the IEEE IITC conference, imec and Tokyo Electron Limited (TEL) presented a direct Cu etch scheme for patterning Cu interconnects. The new scheme has great potential to overcome resistivity and reliability issues that occur while scaling conventional Cu damascene interconnects for advanced nodes |
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Lose power, not data. New ultra-low-power FRAM MCU (2015.05.21)
Overcoming a design hurdle that has burdened engineers for decades, Texas Instruments (TI) announced a revolutionary Compute Through Power Loss (CTPL) technology to enable context save and restore across its MSP430 FRAM microcontroller (MCU) family, including the new MSP430FR6972 MCU |
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Super Red, Red, Amber, and Yellow Ultra-Bright LEDs in Compact SMD Packages (2015.05.21)
The Optoelectronics group of Vishay Intertechnology has introduced a new series of super red, red, amber, and yellow ultra-bright LEDs in compact untinted surface-mount packages with dome lenses. Utilizing the latest ultra-bright AllnGaP on Si chip technology, the Vishay Semiconductors VLD |
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MediaTek Climbs Into Top 10, UMC Enters Top 20 of Semiconductor Suppliers (2015.05.21)
IC Insights today announced a updata of the top 25 1Q15 semiconductor suppliers report. The top-20 ranking includes three pure-play foundries (TSMC, GlobalFoundries, and UMC) and four fabless companies. It is interesting to note that the top four semiconductor suppliers all have different business models |
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ASRock Rack Presents The High Specification EP2C612D24 (2015.05.20)
ASrock Rack introduces the latest high performance server board EP2C612D24, it is a very high-end solution for intensive compute tasks, big data analysis, Hadoop and cloud computing.
As how it calls, EP2C612D24 features Intel Xeon E5 v3 processors with dual sockets |
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Qisda Expands Its Industrial PC Capabilities By Buying DFI (2015.05.20)
TAIPEI, Taiwan － Qisda, a Taiwanese ODM/OEM services provider, yesterday announced that the company has bought 8.7% shares of DFI, a Taiwanese high-performance computing technology supplier, a total of NT$450 million by NT$45 per share, to increase its technological capabilities in the field of industrial PCs |
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Taiwanese Startups to Debut at COMPUTEX 2015 (2015.05.20)
TAIPEI, Taiwan - To promote the international awareness of Taiwan’s startups, the National Development Council(NDC) and Epoch Foundation will introduce “Meet The Future” innovation and startups theme pavilion at Computex TWTC Hall 3 during June 2 to June 6, 2015 |
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CES Asia Announces Suning’s Sun Weimin as Keynote Speaker (2015.05.20)
TAIPEI, Taiwan — CES AsiaTM on May 20 announced that Sun Weimin, Vice Chairman of Suning Commerce Group Co., will round out the list of keynote addresses at the inaugural CES Asia. Suning’s keynote will focus on the transformation of traditional retail enterprises toward Internet retail |
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Smallest IGBT gate-driver for 90 kW-500 kW inverters (2015.05.20)
Power Integrations launched its 2SC0115T2A0-12 dual-channel gate-driver core for 90 kW to 500 kW inverters and converters. Leveraging SCALE-2+ integrated circuit and isolated transformer technology for DC/DC power and switching signal transmission, the new driver core improves system reliability and performance by eliminating the need for an opto-coupler |
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Wide-voltage Range, Fanless 3.5” Atom-based SBC (2015.05.20)
Axiomtek has launched CAPA840, its fanless 3.5-inch embedded single board computer based on the latest generation of Intel Atom processor E3845 or E3827 featuring 1.91/1.75GHz clock speed. Two DDR3L SO-DIMM slots support system memory up to 8 GB |
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Smartphone Display Panel Shifting to High-Res, High-Performance Technologies (2015.05.20)
According to IHS, ongoing improvements in smartphone display performance is leading to increasing demand for high-resolution panels with lower power consumption requirements, which are not supported by the most common legacy technologies (non-crystalline thin-film silicon or a-Si for short) |
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New Approach to Pave the Way for Advanced Interconnects (2015.05.20)
During the IEEE IITC conference in Grenoble, the nanoelectronics research center imec and Lam Research Corporation today presented a novel bottom-up prefill technique for vias and contacts. The technique, based on Electroless Deposition (ELD) of Cobalt (Co) is a highly selective method resulting in void-free filling of via and contact holes |
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Virtualized 3D Graphics of Data Center Are Moving to GPUs (2015.05.20)
NVIDIA pointed on its blog that virtual delivery of 3D graphics is moving from the CPU to the GPU.
On last week at Citrix Synergy, a conference for virtualization, mobility, networking and cloud solutions, virtualization experts Rachel Berry, Thomas Poppelgaard and Dane Young each featured NVIDIA GRID vGPU graphics acceleration |
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Rumor: China Capital Attempting to Buy Taiwan Memory Companies (2015.05.19)
TAIPEI, Taiwan － According to a report from Taiwan’s Economic Daily News, China “SUMMITVIEW Capital” Investment Corporation may be shiftinging direction and buying Taiwanese memory suppliers Macronix and Winbon, after failing to buy Integrated Silicon Solution Inc |
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CvLux to Showcase its Apple-Compatible Peripherals at the CES Asia 2015 (2015.05.19)
XINBEI, Taiwan — The CES Asia 2015 will be held in Shanghai, China on May 25 to 27, CviLux Group is a Taiwanese connectors, FFC, and wire harnesses provider and an Apple MFi Manufacturer that will also made their debut at the event by showcasing its Apple-Compatible Peripherals |
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ITU Raises International Alliance to Help e-Waste Management in Latin America (2015.05.19)
A study undertaken by ITU in collaboration with other international and regional organizations has concluded with the release of a report outlining the state of e-waste management in Latin America. The report offers guidance to the region on the steps to be taken towards environmentally sustainable e-waste management |
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0.6mm Thinline Supercapacitors for Wearable, Ultra-Portable and Connected IoT Devices (2015.05.19)
CAP-XX today launched its Thinline series of single-cell supercapacitors. The world's thinnest at 0.6mm thick, and with prices starting at less than US$1 in large volumes, Thinline was developed to address the size, weight and cost challenges of designing thin, sometimes disposable electronic devices for the Internet of Things (IoT) |
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Altera Speeds IEC 61508-compliant Designs with Certified 28nm FPGAs, SoCs, and Toolflows (2015.05.19)
Altera Corporation announced the availability of the latest version of its Industrial Functional Safety Data Package (Ver. 3), for systems designers using Altera field programmable gate arrays (FPGAs). The safety pack provides TÜV Rheinland-certified toolflows, IP and devices including Cyclone V FPGAs, enabling faster time for market for industrial safety solutions to IEC 61508 up to Safety Integrity Level 3 (SIL3) |
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HOLTEK BS83B04A-4 New Touch Key Flash MCU (2015.05.19)
Following the successful release of the BS83A04A-3/-4, Holtek is now delighted to announce the release of a new Touch Key Flash MCU, the BS83B04A-4. In addition t to having the advantages of its predecessor devices, this new MCU also consumes less power, has a higher touch switch detection update rate as well as improved anti-power interference abilities |
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Latest Version of Java SE 8 Now Available for MIPS (2015.05.19)
Imagination Technologies announces the availability of Java SE 8 for the MIPS architecture. This new release is part of an ongoing collaboration between Imagination and Oracle intended to enhance Java for embedded and Internet of Things (IoT) applications and optimize Java for the MIPS CPU architecture |
If the supply of the computer's power supply is not normal interrupt or current unstable, uninterruptible power supply UPS (Uninterruptible Power Supply) will assume the function of the temporary emergency power supply, so that the computer will not be forced to the loss of data due to power outage, or causedamage.