 |
FTDI Chip Introduces EVE Platforms Supporting Development of HMIs with Capacitive Touch (2014.12.16)
FTDI Chip has further enlarged the portfolio of development modules accompanying its Embedded Video Engine (EVE) technology - which has helped revolutionise how human machine interfaces (HMIs) are implemented thanks to its innovative object-oriented approach |
|
All-in-One Fan Driver Simplifies Circuit Design (2014.12.16)
Diodes Incorporated introduced a pair of all-in-one single-phase 12V fan motor drivers for low to medium voltage brushless DC fan control in consumer, home appliance, industrial and office equipment. The high level of integration, miniature package options and thermal handling offered by the AH5772 and AH5773 fan drivers enable a reduction in component count and PCB area where space is at a premium |
|
High-Power Module Platform, Offers Royalty-Free License of Package Design for Industry (2014.12.16)
Infineon Technologies AG today announced the launch of two new power module platforms designed to improve the performance of high-voltage IGBTs in voltage classes from 1200V up to 6.5kV. To make the benefits of the new module broadly available, Infineon is offering a royalty-free license of the design to all providers of IGBT power modules |
 |
Gartner: Sales of Smartphones Grew 20% in Q3 2014 (2014.12.15)
According to Gartner, worldwide sales of mobile phones to end users were flat in the third quarter of 2014, however, sales of smartphones to end users grew 20.3 percent to reach 301 million units.
“Sales of feature phones declined 25 percent in the third quarter of 2014 because the difference in price between feature phones and low-cost Android smartphones is reducing further,” said Roberta Cozza, research director at Gartner |
|
AAEON Release AQ7-IMX6 with Wide Temperature Support (2014.12.15)
AAEON will be releasing the small but tough AQ7-IMX6 CPU module(IPC) with wide temperature support for harsh environments.
The SGET-standardized Qseven Rev. 2.0 module, originally released in Q2 of 2014, is now available with AAEON’s WiTAS (Wide Temperature) technology, allowing it to operate in the extreme temperatures of -40°C to +85°C |
|
Infineon and UMC Announce Manufacturing Agreement for Automotive (2014.12.15)
HSINCHU, Taiwan –The semiconductor manufacturer Infineon Technologies AG and United Microelectronics Corporation (UMC) today announced the extension of their manufacturing partnership into power semiconductors for automotive applications |
|
Wintek to cut Employees and Transform into LED and Food Biotechnology (2014.12.15)
TAIPEI, Taiwan — Touch panel maker Wintek was once one the main suppliers for Apple, but placed a bet that failed after the Cupertino-based group selected a rival touchscreen technology in late 2012, the company said on December 12, its board had agreed to lay off 2,360 employees in its latest restructuring, after cutting 610 jobs earlier this month |
|
TSMC and Samsung Keep Competing in the Advanced Process (2014.12.15)
TAIPEI, Taiwan — TSMC and Samsung keep competing in the advance process, manufacturing of Apple's A9 processor is reportedly underway in Samsung's Austin, Texas plant, according to Korea's ET News (via The Verge). Samsung is suggested to be handling the bulk of the orders for the A9 using its 14nm chip process, with rival Taiwan Semiconductor Manufacturing Company (TSMC) contributing a supplementary supply |
|
Wintek Announces Layoffs, Withdraws from Touch Business (2014.12.15)
TAIPEI, Taiwan－Unable to sustain continued loses, Taiwanese touch panel company, Wintek, this week dismissed large numbers of employees. In the future, Wintek will only have 300 employees in Taiwan, which is only 6% of its former labor force |
|
HOLTEK New Touch Key ICs for Household Appliance Applications (2014.12.15)
The release of the new BS812A-1, BS8112A-3 and BS8116A-3 devices adds three new additions to Holtek’s standard touch key peripheral IC series. These new touch switch devices allow human body contact to be detected using external touch keys while internal circuitry provides automatic calibration according to environmental changes, to enhance touch detection accuracy |
|
New AS3722 PMIC and AS3728 Power Stages Supply Tegra K1 Mobile Processor SoC in Jetson Design Kit (2014.12.15)
ams AG added to its family of power management ICs (PMICs) for mobile multi-core ARM processors with the AS3722, which provides a complete power-control solution for Nvidia’s Tegra K1 mobile system-on-chip (SoC).
ams is also releasing today the AS3728, an 8A high-voltage power stage to complement the AS3722’s high-current DC-DC controllers |
|
Molex Rigid Flex Circuitry Streamlines Mission-Critical Power and Signal Distribution (2014.12.15)
Molex introduced its Rigid Flex Circuits and Assemblies. Ultra-reliable Molex rigid flex circuits and assemblies minimize impedance discontinuities in high-speed military and aerospace data and telecommunications devices that are lightweight, portable and intended for use in harsh environments |
|
Standard & Poor maintains its ratings on CHT (2014.12.12)
TAIPEI, Taiwan — Chunghwa Telecom (CHT) announced on Friday that Standard & Poor's Ratings Services affirmed its “AA” long-term foreign currency corporate rating on the company. The outlook is stable.
Taiwan Ratings Corp |
|
New 2.1 Megapixel CMOS Image Sensor Delivers 1080p HDR Video for Security Cameras (2014.12.12)
ON Semiconductor has introduced its latest high performance CMOS image sensor targeted for use in advanced video security cameras. The AR0230CS image sensor is a 1/2.7 inch optical format device with 105 decibel (dB) dynamic range that combines industry leading low-light capabilities with superior near-infrared (NIR) performance |
|
42V, 5A (IOUT), Synchronous Step-Down Silent Switcher Delivers 95% Efficiency at 2MHz (2014.12.12)
Linear Technology announces the LT8640, a 5A, 42V input capable synchronous step-down switching regulator. A unique Silent Switcher architecture, combined with spread spectrum frequency modulation, reduces EMI/EMC emissions by more than 25dB even with switching frequencies in excess of 2MHz, enabling it to easily pass the automotive CISPR25, Class 5 peak limits |
|
QuickLogic Announces TAG-N Wearable Sensor Hub Evaluation Kit (2014.12.12)
QuickLogic announced the availability of the TAG-N Wearable Sensor Hub evaluation kit. The kit incorporates the QuickLogic ArcticLink 3 S2 ultra-low power programmable sensor hub, QuickLogic-developed algorithms, and a direct connection to a Nordic Semiconductor nRF51 DK, Nordic's all-in-one, multiprotocol development kit for ultra-low power wireless development on the nRF51822 SoC |
|
HOLTEK HT45RM22/HT45RM23 Digital Servo ASSP Device Series (2014.12.12)
With a focus on the DC Brushed Motor Digital Servo area, Holtek is delighted to announce its new Digital Servo ASSP MCUs, the HT45RM22 and HT45RM23.
With an integrated LDO regulator and internal H-Bridge MOS×4 driver, the devices can implement a complete servo circuit with just a few passive components |
|
u-blox Sets New Benchmark for GNSS Precision Timing with Two New Modules (2014.12.12)
u blox announces the NEO-M8T and LEA-M8T precision timing modules. The compact, surface-mount modules are able to generate a precise reference clock with |
 |
Gear Up to Seize the IoT Business (2014.12.11)
Internet of Things (IoT) has no doubt that will be one of the next big things, IC design, wafer foundry, or end device providers all aim at the IoT market. Taiwan's leading electronic and information technology (IT) companies are gearing up to seize the chance offered by the coming era of IoT |
|
Genesis Photonics' Flip Chip Applies in LED (2014.12.11)
TAIPEI, Taiwan — Genesis Photonics has been devoted in developing and researching LED epitaxial wafer and chip technology for 10 years, has made great progress in flip-chip packaging. The company has fostered flip-chip and eutectic bonding technology, which are to improve reliability of LED lighting fixtures, making them to reach stringent outdoor lighting standards |
Overall, the number of times the Bus specification standard is rising between mainframe computers and peripherals, data transfer speed, capacity and quality of the application process. Let's Introduction to several important bus application specifications.