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. Imagination Demonstrates Its New PowerVR in Mobile Applications at GDC 2016 (2016.03.16)
  Imagination Technologies, a Silicon IP provider owned by Intel and Apple, was demostrating its new PowerVR technology at GDC 2016, which have setted a bar for high-end graphics in mobile. One of the most important demonstration at the event comes from the PowerVR Ray Tracing team...
. European Broadband Connectivity to Soar Over the Next Five Years, Ovum Says (2016.03.16)
  High-speed Internet connectivity is set to soar in Europe over the next five years, with the region featuring eight of the 10 biggest absolute increases in the latest Broadband Development Index from global analyst firm Ovum. The Index tracks the projected take-up of high-speed fixed and mobile broadband services in 191 countries worldwide from 2013 to 2020...
. Sales of MEMS-based Products to Rise 4.4% in 2016, IC Insights Reports (2016.03.16)
  According to IC Insights, in 2015, nine product categories within the optoelectronics, sensors/actuators, and discretes (O-S-D) marketplace reached record-high sales compared to seven in 2014 and six in 2013. And sales of MEMS-based products are forecast to rise 4...
. ARM, TSMC Announce Multi-year Collaboration on 7nm FinFET (2016.03.15)
  HSIHCHU, Taiwan – ARM and TSMC announced a multi-year agreement to collaborate on a 7nm FinFET process technology which includes a design solution for future low-power, high-performance compute SoCs. Additionally, the agreement extends previous collaborations on 16nm and 10nm FinFET that have featured ARM Artisan foundation Physical IP...
. COMPUTEX Issues Last Call for 2016 d&i Awards (2016.03.15)
  TAIPEI, Taiwan - COMPUTEX TAIPEI today announced last call (submission deadline is March 31) for companies interested in submitting their products for the ninth annual d&i (design and innovation) awards. Technology companies throughout the world are invited to submit their products for review, and award submission is not limited to COMPUTEX exhibitors or attendees...
. TAICS Signs Agreement with NGMN for 5G Cooperation (2016.03.15)
  TAIPEI, Taiwan - TAICS (Taiwan Association of Information and Communication Standards), and NGMN(Next Generation Mobile Networks) today signed a agreement at Taipei 5G Summit. Two sides committed to co-develop 5G technology...
. Delta Unveils Modular 500kVA UPS and 120kW RowCool at CeBIT 2016 (2016.03.15)
  Delta unveiled today, at DatacenterDynamics CeBIT 2016, new power and cooling technologies with industry-leading power capacity for high-density and large-scale green datacenters. Delta debuts the Modulon DPH series 500 kVA modular UPS featuring both the world’s highest power capacity and power density per module at 55kVA and 22...
. ASE Showcases Its Leading IC Assembly Technology at SEMICON China 2016 (2016.03.15)
  TAIPEI, Taiwan - Advanced Semiconductor Engineering, Inc (ASE), announced it will be showcasing its System in Package (SiP) solutions in consumer and automotive applications at SEMICON China, scheduled to take place in Shanghai, China, from March 15 to 17, 2016...
. Global AMOLED Panel Production Capacity to Increase 19.1% YoY in 2016, TrendForce Says (2016.03.15)
  According to WitsView, a division of TrendForce, the global AMOLED panel production capacity by area will reach 7.9 million square meters in 2016, representing a 19.1% year-on-year increase. As panel makers worldwide continue to expand their AMOLED production, the total capacity for 2018 is forecast at 14...
. Lattice, MediaTek Joint Release the Most Power Efficient 4K Video Solution Over USB Type-C (2016.03.14)
  Lattice Semiconductor Corporation and MediaTek today announced the joint release of power-efficient reference designs that drive 4K UHD over a USB Type-C connector. Lattice’s USB Type-C port controllers and MHL transceivers can easily be paired with MediaTek’s Helio X20, the world’s first mobile processor with Tri-Cluster CPU architecture and ten processing cores (Deca-core)...
. M31 Announces Its Release of TSMC's 28HPC+ ULL SRAM Compilers for the Smart Devices (2016.03.14)
  HSINCHU, Taiwan — M31 Technology Corporation announced today its release of TSMC's 28HPC+ ULL SRAM Compilers for the Intelligent Device Market. These IP cores will enable designers to realize the features and benefits of a low power, high performance, and cost effective SoC design...
. Automobile CMOS Sensor Market is Rapidly Growing (2016.03.14)
  TAIPEI, Taiwan - According to Photonics Technology & Industry Devlopment Association (PIDA) statistics, in 2014 the total global CMOS sensor shipments amounted to 4.65 billion units. Chinese manufacturer Galaxycore was the top company, accounting for 21% of the shipments; whereas Japan’s Sony and the United States’ Omnivision made the second highest number of shipments at 19%...
. AIPTEK to Unveil Its Solution for Interactive Touchscreen projection at CeBIT 2016 (2016.03.14)
  Taiwanese company AIPTEK International GmbH announced that the company is to unveil its solution for interactive touchscreen projection and a combined portable HD projector and Bluetooth speaker system with integrated battery at CeBIT 2016 in Hannover, Germany...
. eMemory Announces Industry’s First 16nm FinFET Compact Process Verified OTP Silicon IP (2016.03.14)
  HSINCHU, Taiwan – eMemory announces today that its OTP technology NeoFuse has been verified in 16nm FinFET Compact process (16FFC), marking an important milestone as the world’s first IP provider to deliver a logic NVM solution in the cutting-edge 16FFC process platform...
. SEMI Taiwan Highlights Industry 4.0 at Semiconductor Smart Manufacturing Forum (2016.03.14)
  Ideas about smart factories and Industry 4.0 have become one of the most important issues in Taiwan high-tech industry, and how to introduce these ideas into the production flows of various sectors will be a big challenge for the island in years to come...
. Imec Opens New 300mm Cleanroom Serving the Global Semiconductor Industry (2016.03.12)
  imec announced the opening of its new 300mm cleanroom. With this 4000m2 new facility, imec’s state-of-the-art semiconductor research cleanrooms now totals 12,000m2, one of the most advanced research facilities in the world dedicated to scaling IC technology beyond 7nm...
. Big Data Applications Expected to Flourish in Sync with China's Smart City Development (2016.03.11)
  The development of smart cities and big data will move in sync in China due to two factors, according to MIC (Market Intelligence and Consulting Institute), an ICT research institute based in Taiwan. First, a smart city project generally lasts for three years...
. ASRock Rack to Showcase High-density 1U Solution and SoC Platform at WHD 2016 (2016.03.11)
  ASRock Rack announced that th company will showcase its latest products at WorldHostingDays.global 2016 (WHD) in Rust, Germany, to share experiences with other greatest hosting and cloud services industry. With high demand of bigger storage and consideration of limited space, ASRock Rack will demonstrate the best solution for temporal data management on cloud-based datacenter and warehousing environments, 1U2FH-8S2E and 1U12LX-14S...
. PV Cell Prices Falling Faster Than Expected, TrendForce Reports (2016.03.11)
  EnergyTrend, a division of TrendForce, reports that the global PV market is seeing slowing demand after the Chinese New Year holidays. Peak installation seasons in the U.S. and Japan have passed, and the demand related to China’s efforts to connect its PV power plants to the grid is also subsiding as this mission is set to be completed at the end of June...
. X-FAB Announces 6-inch SiC Production in Texas, United State (2016.03.11)
  X-FAB Silicon Foundries announced the availability of its silicon carbide (SiC) offering from its wafer fab in Lubbock, Texas. X-FAB Texas has heavily upgraded its manufacturing resources in order to make them “SiC-ready”...
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