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Taiwan’s ICs Foundries Are at Full Capacity After Severe Earthquake (2016.03.01) |
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TAIPEI, Taiwan － Taiwan's Economic Daily News reported that Taiwan’s IC foundries were fully loaded. Including TSMC, UMC and VIS(Vanguard International Semiconductor Corporation), had greatly increased their orders since the severe earthquake in February... |
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ASUS Breaks Record with 13 Wins at 2016 iF Design Awards (2016.03.01) |
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TAIPEI, Taiwan — ASUS won 13 2016 iF Product Design Awards, setting a new record number of wins for the company in a single iF Design Award competition. Spanning four product design categories — Computer, TV/Camera, Telecommunication, and Sports/Leisure... |
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Taiwan Passes South Korea to Become NO.1 in IC Wafer Fab Capacity (2016.03.01) |
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IC Insights reported that Taiwan led all regions/countries in wafer capacity with nearly 22% of worldwide IC capacity installed in the country in the Dec-2015. And Taiwan surpassed South Korea in 2015 to become the largest capacity holder after having passed Japan in 2011... |
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Mizuho Bank to Develop Customer Service-oriented Robots with IBM Research (2016.03.01) |
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Mizuho Bank, Ltd. today announced plans to use a new common robotics platform using research developed by IBM (NYSE: IBM) Research-Tokyo for the bank’s customer service-oriented robots.
Most existing robots operate on commercially available technology platforms that can limit customization and prevent companies from applying robots to new tasks or activities... |
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xCommerce will Be a US$17 Trillion Industry in Asia by 2019, IDC Says (2016.02.29) |
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International Data Corporation (IDC) predicts that the xCommerce market will grow rapidly in the Asia-Pacific ex-Japan (APeJ) region, rising from nearly $7 trillion in 2015 to nearly US$17 trillion in 2019.
This represents a strong double-digit compound annual growth rate (CAGR) of 19% within the 2015–2019 period... |
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ZTE Joins the GSMA NB-IoT Forum As A Major Member at MWC (2016.02.29) |
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ZTE today announced that it officially joined the GSMA NB-IoT (Narrow Band-IoT) Forum as a major member, at the Mobile World Congress 2016 in Barcelona.
The NB-IoT forum mainly comprises mainstream operators, major equipment manufacturers, chip providers and terminal module manufacturers around the world... |
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Large-Size LCD Panel Shipments Declines Over 10% in January (2016.02.26) |
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WitsView, a division of TrendForce, reports that large-size LCD panel shipments for this January totaled 57.47 million units, down 16.8% from a month ago. Most panel makers posted declining results, but Panasonic LCD and Sharp were able to grow their shipments against market headwinds because they had shorter base periods... |
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HP Collaborates with iPass to Give Wi-Fi Access to Customers Around the World (2016.02.26) |
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HP announced it is extending its collaboration with iPass Inc. to bring iPass’ global Wi-Fi network to HP customers on select HP notebook and tablet PCs worldwide.
Customers who purchase new select HP notebooks, hybrid PCs, phablets and tablets with the iPass option will be able to access millions of hotspots on the iPass global Wi-Fi network for one, two, or three years at no additional cost starting in 2016... |
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Visitors to the MWC 2016 Surpass the 100,000 Mark for the First Time (2016.02.26) |
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Visitors to the MWC 2016 surpassed the 100,000 mark for the first time in the event’s history, with nearly 101,000 attendees, an increase of more than six per cent over last year, the GSMA reported today. Additionally, nearly 4,000 people participated in the ESL Expo Barcelona, which took place the weekend prior to Mobile World Congress... |
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Samsung Announces Mass Production of 256GB Embedded Memory Based on V-NAND Flash (2016.02.25) |
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Samsung Electronics announced today that it is now mass producing the industry’s first 256-gigabyte (GB) embedded memory based on the Universal Flash Storage (UFS) 2.0 standard, for next-generation high-end mobile devices. T
The new Samsung UFS memory satisfies needs for ultra-fast speed, large data capacity and compact chip size in high-end smartphones... |
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Sharp Agrees to Be Acquired But Foxconn Says Not Yet (2016.02.25) |
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TAIPEI, Taiwan － Sharp announced today that the comoany agreed to accept Hon Hai/ Foxconn’s reconstruction program of JP¥700 billion, and to be auguired by Foxconn. However, Foxconn said that the two sides have not reached a consensus... |
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Visualizing Warpage Behavior during Post-mold Cure Stage in IC Packaging Using Advanced CAE Technolo (2016.02.25) |
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Epoxy Molding Compounds (EMC) are thermosetting plastic materials that are commonly used in the IC encapsulation process. During the filling stage of the encapsulation process, the cross-linking of polymer chains occurs as the temperature increases; when the cross-linking reaction reaches a certain degree, the EMC encapsulates will start to cure, which ultimately leads to better mechanical properties and stability of the finished products... |
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Acer Monitors Rank No. 1 in North American Retail Market of more Than 20% in 2015 (2016.02.25) |
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TAIPEI, Taiwan － Acer was the No. 1 ranking brand for LCD monitors in the US retail market for year 2015, according to global information company, The NPD Group.
Acer led the market with more than 20 percent market share and grew 26 percent year-on-year for unit shipments, far exceeding the industry average of 6 percent... |
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ZTE and Korea Telecom Showcase Pre5G at MWC 2016 (2016.02.24) |
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ZTE today announced its joint demonstration with Korea Telecom at Mobile World Congress 2016. The companies will exhibit a Pre5G Massive multiple input multiple output (MIMO) base station demonstrating their latest cooperative achievements in the 5G field... |
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