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TI's Ultra-small 5.5-V DC/DC Step-down Power Module Delivers True 6-A Performance (2018.05.08) Texas Instruments (TI) introduced a 5.5-V step-down power module that delivers true, continuous 6-A output current with up to 95 percent efficiency. The easy-to-use TPSM82480 DC/DC module integrates power metal-oxide semiconductor field-effect transistors (MOSFETs) and shielded inductors into a tiny |
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HOLTEK New BS83B24C/BS83C40C High Key Count High Anti-interference Touch MCUs (2018.05.07) Holtek announced the release of a new generation of Touch Flash MCUs, the BS83xxxC series. In addition to including all the advantages of the already released BS83BxxA series, this new series contains an improved anti-interference ability that allows them to repel interference from electrical noise sources such as that from power supplies, RF interference, power supply voltage fluctuations etc |
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China’s Xiaomi could finally enter US market after IPO cash injection, says GlobalData (2018.05.07) Following the recent announcement that Chinese smartphone maker Xiaomi has filed for an initial public offering (IPO) to raise at least $10bn on the Hong Kong stock exchange,
Avi Greengart, Consumer Technology Analyst at GlobalData a leading data and analytics company |
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Merck and Taiwan Launch a Biopharma R&D & Training Collaboration Program in Taiwan (2018.05.07) HSINCHU, Taiwan– Vice President Chien-Jen Chen on May 7 visited ITRI GuangFu Innovation Campus to attend the launch ceremony of the Biopharma R&D & Training Collaboration Program between Taiwan and Merck. The program aims at developing advanced biopharmaceutical production technologies and cultivating high-level biopharma talents in Taiwan, with potential benefits to generate NT$10 billion in industry value |
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Osram Acquires VCSEL Specialists Vixar (2018.05.04) Osram has added to its expertise in semiconductor-based optical security technology by acquiring US-based Vixar Inc. After acquiring Vixar, Osram will have a unique breadth of technological expertise and an expanded product portfolio after bringing on board Vixar's specialist capabilities in the field of VCSEL |
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u-blox Announces the First High Precision GNSS Module Based on u blox F9 Technology (2018.05.04) u-blox announced the ZED-F9P multi-band GNSS module with integrated multi-band Real Time Kinematics (RTK) technology for machine control, ground robotic vehicles, and high precision unmanned aerial vehicles (UAV) applications |
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Price Decline in LCD TV Panel Market to Continue in 2Q18, Says TrendForce (2018.05.03) Prices of LCD TV panels of all sizes have been decreasing since the end of 2Q17, and have not shown any sign of stop so far, according to the latest report from WitsView, a division of TrendForce. In 2Q18, TV panel prices will show further decline for various size segments compared with 1Q18: the 32-inch by 20%~22%, the 43-inch by 13%~15%, the 49- to 50-inch range by 12%~14%, the 55-inch by 9%~11%, and the 65-inch by 14~16% |
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Asus, Taiwan Mobile, Quanta Collectively Spend NT$1.1B to Establish Taiwan AI Platform (2018.05.03) TAIPEI, Taiwan - AsusTek Computer Inc., Taiwan Mobile, Co., Ltd., and Quanta Computer, Inc. jointly announced that they will collaborate on the construction of a national AI host project in Taiwan to assist in the construction of a next-generation AI computing host |
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Q1 2018 Taiwan IC Revenue Totaled NT$603.2 Billion, Up 5.6% on-year (2018.05.03) The TSIA survey showed that Q1 2018 Taiwan IC revenue as a whole (including design, manufacturing, packaging and testing) totaled NT$603.2 billion(US$19.8B) (10.7% decline on-quarter and up 5.6% on-year), with NT$137.2 billion in design(US$4 |
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Samsung Introduces 16Mp ISOCELL Slim 3P9 Image Sensor with a Plug and Play Solution (2018.05.03) Samsung Electronics today introduced a new 16-megapixel (Mp) ISOCELL Slim 3P9 image sensor along with a Plug and Play solution, a pre-optimized turnkey camera module made up of an ISOCELL image sensor and preferred partner components to help expedite time-to-market |
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AAEON Launches the GENE-APL6 Rugged Subcompact Motherboard for Factory Automation (2018.05.03) AAEON launches the GENE-APL6, a rugged subcompact motherboard purpose-built for factory automation and transport applications.
Equipped with an Intel Pentium N4200 or Celeron N3350 processor and DDR3L memory, the fanless GENE-APL6 features a solder-up design, which allows for the easy implementation of a heat spreader to channel heat from the CPU out through the chassis |
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Contract Prices of Mobile DRAM to Stay on the Same Path in 2Q18-3Q18 (2018.05.02) The latest analysis by DRAMeXchange, a division of TrendForce, finds that the interference in pricing by the China’s National Development and Reform Commission in 1Q18 is still having an effect on the mobile DRAM market in 2Q18, causing the quoting to be more conservative |
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New 100-Mbps single-pair Ethernet PHY with SGMII (2018.05.02) Texas Instruments (TI) introduced a new automotive Ethernet physical layer (PHY) transceiver that cuts the external component count and board space in half and consumes as little as half the power of competitive solutions.
The DP83TC811S-Q1's support for serial gigabit media independent interface (SGMII) |
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South Korea Among the World’s Leading Markets for Blockchain, Says GlobalData (2018.05.02) Blockchain represents a new standard for the way information is shared and a host of companies such as telecom operator Korea Telecom (KT) and messaging apps Line and Telegram are working to determine how they can use the technology to save on costs and generate new revenue, says leading data and analytics company GlobalData |
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Demand for Curved Gaming Monitor is Climbing, Says TrendForce (2018.05.01) According to WitsView, a division of TrendForce, the shipments of LCD monitor recorded a positive year-on-year growth of 0.3% in 1Q18. Over the whole quarter, the demand saw drop in January and February, before showing a significant quarterly rise of 40 |
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Synopsys and TSMC Collaborate to Deliver Ultra-Low Power TSMC 22-nm Processes (2018.05.01) Synopsys announced its collaboration with TSMC to develop DesignWare Foundation IP for TSMC's 22-nanometer (nm) ultra-low power (ULP) and ultra-low leakage (ULL) processes. DesignWare Foundation IP, including logic libraries, embedded memories |
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HOLTEK New HT68F0012 Small Package Flash MCU (2018.04.30) Holtek announces the release of an addition to its small package Flash MCU range with the new HT68F0012. As an extension product of the HT68F001, which has a 32kHz system frequency, this new device can operate with a higher system frequency of 512kHz |
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Chinese and Taiwanese Memory Manufacturers to Collaborate on Production of NAND Flash Memory (2018.04.30) TAIPEI, Taiwan - According to Taiwan’s Economic Daily News, Yangtze Memory Technology Corp (YMTC), a subsidiary company of China’s Tsinghua Unigroup, is interested in forming a memory industry alliance with Taiwanese memory manufacturers which include Phison Electronics Corp |
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Toshiba Shipping Samples of Motor Driver IC with High-Definition Micro Stepping (2018.04.27) Toshiba Electronic Devices & Storage Corporation announced “TB67S128FTG,” a bipolar stepping motor driver with a 50V/5A rating and support for 128 micro steps. Sample shipments start from the end of this month.
High speed and high performance motor control and lower power consumption are required for applications that include 3D printers |
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eMemory introduces more security features to its eNVM IP for TSMC 7nm Process (2018.04.27) HSINCHU, Taiwan – eMemory today announced the successful verification of its secure eNVM IP for TSMC’s advanced processes, and the company is introducing more security features to the eNVM solution for TSMC’s 7nm process technology in the coming months |