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APeJ Mobile Solutions Spending Expected to Be More Than $540.7 Billion in 2018 (2018.03.22)
APeJ spending on mobility solutions is expected to grow 5.3% year over year in 2018, reaching more than $540.7 Billion, according to the IDC Worldwide Semiannual Mobility Spending Guide. This growth is expected to continue through 2021 with spending on mobility-related hardware, software, and services surpassing $1 |
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Samsung Annouces Its New AP Exynos 7 Series 9610 (2018.03.22)
Samsung Electronics announced the availability of its latest application processor (AP), the Exynos 7 Series 9610. The Exynos 9610, built on Samsung’s 10-nanometer (nm) FinFET process, elevates the multimedia experience in high-end smartphones with premium-level features such as deep learning-based image processing for ultimate picture-taking experiences and stunning slow motion video recording at 480 frames per second (fps) |
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Marvell Introduces Industry's First NVMe Chipset Solutions (2018.03.21)
Marvell announced that it is launching innovative NVM Express (NVMe)-based chipset solutions that will accelerate the time to market for application-optimized data center SSD implementations. These new, highly-versatile building blocks can optimally address current and emerging workload storage requirements, spanning capacity, latency, performance, power and cost, to enable tailored SSD solutions for specific cloud and enterprise workloads |
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Acer Reports 2017 Consolidated Revenues of NT$237.28 Billion, Up 2% YoY (2018.03.21)
TAIPEI, Taiwan - Acer announced today the financial results for fiscal 2017 and the fourth quarter ended December 31, 2017, following approval by its Board of Directors.
Acer reported for the full year of 2017 consolidated revenues of NT$237 |
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AI Items Added to COMPUTEX BC Awards (2018.03.21)
TAIPEI, Taiwan - The COMPUTEX TAIPEI computer exhibition will be held from June 5-9, and one of the co-organizers, Taipei Computer Association (TCA) stated that AI and Big Data items will be added to the competition events for the official COMPUTEX Best Choice Awards |
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UK Chief Scientific Adviser launches UK-Taiwan Innovative Industries Programme (2018.03.21)
Professor Robin Grimes, Chief Scientific Adviser of the UK Foreign & Commonwealth Office, today launches the ‘UK-Taiwan Innovative Industries Programme’ (UKTW I2P) together with Vice President of Taiwan Dr. Chen Chien-Jen |
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Global Smart Lighting Market to Reach a Value of US$13.4 Billion in 2020, Says TrendForce (2018.03.20)
Smart lighting has been developed for years, but products and applications are not really used widely. In 2017, however, smart lighting has begun to escalate with diversification of products, continuous improvements of technology, maturing ecosystem of industry chain, and active promotion of manufacturers |
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IHS Markit Identifies Eight Global Solar and Energy Storage Market Trends to Watch (2018.03.20)
Annual solar installations grew almost 20 percent year over year in 2017, and the solar industry is also edging within 100 gigawatts, a milestone the industry will reach this year, according to IHS Markit.
“Remarkable expansion has occurred against a backdrop of trade disputes and far-reaching policy changes on the one hand |
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Toshiba Memory Releases Enhanced Data Center SSD Line-up with 64-Layer 3D Flash Memory (2018.03.20)
Toshiba Memory Corporation announced its latest line-up of NVM Express (NVMe) and SATA data center solid-state drives (SSDs) in multiple form factors. The new SSDs offer cloud data centers robust performance and reliability, and deliver lower operating power for read-intensive applications such as NoSQL databases, big data analytics and streaming media |
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Würth Elektronik eiSos and Infineon Present Wireless Power Development System 200-W-WPT (2018.03.19)
Under the name 760308EMP-WPT-200W, Würth Elektronik eiSos and Infineon Technologies AG are offering a 200-watt development system for wireless power transfer. What makes the development kit special is that the link between the transmitter and receiver coils can be used to transfer not only power but also data |
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HOLTEK New HT69F2562 Ultra-Low Power MCU with LCD & EEPROM (2018.03.19)
Holtek is delighted to announce the release of its new HT69F2562 Flash MCU, having the special characteristics of ultra-low power and integrated LCD driver circuit. This new device provides an excellent MCU solution for those applications which require ultra-low power consumption in the standby mode but still require an active RTC, such as battery powered consumer products, thermal rewritable cards, NFC data loggers etc |
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Server DRAM Prices Will Continue to Rise as Server Demand from China Boosts in 2Q18, Says TrendForce (2018.03.19)
According to the latest data of DRAMeXchange, a division of TrendForce, the top three Server DRAM suppliers are progressing towards the specification of 32GB RDIMM, and the 1Q18 quotes offered by Server DRAM suppliers will grow by only 4% compared with 4Q17 in order to ensure sales by favorable prices |
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Fingerprint Cards to Add Face Recognition to Its Biometric Solutions Portfolio (2018.03.19)
Fingerprint Cards AB announced today that it is further strengthening its touchless solutions portfolio by developing a face recognition solution.
Fingerprints offers both touch and touchless modalities, with solutions based on fingerprint and iris recognition |
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Research: Aerobic Exercise Mitigates Dementia (2018.03.19)
TAIPEI, Taiwan - Taiwan's Ministry of Science and Technology (MOST) and National Cheng Kung University jointly announced the results of their latest research study on dementia. The report pointed out that aerobic exercise can effectively mitigate cognitive function deterioration for elderly people with mild cognitive impairment |
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New Numerical Investigation of the Reinforcement Efficiency of Long Carbon Fiber Composites (2018.03.15)
Long carbon fiber reinforced thermoplastics (LCFRT) have become familiar lightweight automotive materials since they satisfy safety and durability requirements, and the mechanical performance characteristics of carbon fibers are superior to those of glass or natural fibers |
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Advantech Announces Its Co-Creation Model and Global Deployment (2018.03.15)
TAIPEI, Taiwan - Advantech, the supplier of global intelligent systems in the inventor's conference announced that to enter the next stage of IIoT. They will start up the arrangement over the world, developing the local business, and to construct the ecosystem of industrial IoT (IIoT) based on the “co-creation model”, strengthen the influence of the vertical domain |
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GSMA Outlines New Developments for MWC Shanghai 2018 (2018.03.15)
The GSMA today highlighted new developments for the 2018 GSMA Mobile World Congress Shanghai, including the first confirmed conference speakers, and co-located events, as well as new exhibitors, partners and sponsors. Mobile World Congress Shanghai will take place 27-29 June at the Shanghai New International Expo Centre (SNIEC) |
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IC Insights Raises 2018 IC Market Forecast from 8% to 15% (2018.03.15)
IC Insights announced today that they had updated its 2018 McClean Report (MR18). The biggest adjustments to the original MR18 IC market forecasts were to the memory market; specifically the DRAM and NAND flash segments. The DRAM and NAND flash memory market growth forecasts for 2018 have been adjusted upward to 37% for DRAM (13% shown in MR18) and 17% for NAND flash (10% shown in MR18) |
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DELO Announces Its New Generation of 365 nm Curing Lamps (2018.03.15)
DELO Industrial Adhesives has extended its device portfolio by another two curing lamps. A new generation of area lamps with a wavelength of 365 nm is now available. Compared to their previous models, the enhanced DELOLUX 20 / 365 and DELOLUX 202 / 365 LED lamps deliver much higher intensity |
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AAEON Collaborates with Microsoft to Develop Motherboards Incorporating Windows 10 IoT Core (2018.03.15)
TAIPEI, Taiwan –AAEON is working with Microsoft to develop a motherboard that incorporates NXP processors and supports the Windows 10 IoT Core operating system.
AAEON announced the venture at the recent Embedded World trade fair in Nuremburg, Germany, and the news is likely to shake up the world of computing as Microsoft has previously focused on creating software for Intel and Qualcomm |
DOS-popular, accompanied from IBM personal PC's fame, however, to trace its origins from the earlier of the microprocessor era to begin with.