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Industry's First Fully Integrated DDR Memory Power Solution (2016.10.04)
Texas Instruments (TI) introduced the industry's first fully integrated power management solution for double date rate (DDR)2, DDR3 and DDR3L memory subsystems in automotive and industrial applications.
The TPS54116-Q1 DC/DC buck converter is a 2 |
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SAS and Cathay Life Insurance to Establish a New Solar Energy Joint Venture (2016.10.03)
TAIPEI, Taiwan - Taiwan’s Sino-American Silicon Products Inc(SAS) handed with Cathay Life Insurance Co., Ltd., a leading brand in the life insurance market in Taiwan, to setup a new joint venture to increase the investment of solar power plants |
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Average Contract Price for DRAM to Hit Two-Year High in Q4, Says TrendForce (2016.10.03)
The global average contract price of PC DRAM rose 7.4% monthly in September to US$14.5 as DRAM makers adjusted their product mixes and caused PC DRAM supply to tighten significantly, says DRAMeXchange, a division of TrendForce |
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Taiwanese Fabless IC Design Industry to Continue Growth in 2017 (2016.10.03)
TAIPEI, Taiwan - Shipment value of the Taiwanese fabless IC industry is estimated at NT$574.6 billion in 2016, up 11.3% year-on-year, according to MIC (Market Intelligence & Consulting Institute), a Taipei-based IT research institute |
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CoreTech System Announces Winners of Tell Us Your #Moldex3DStory Contest (2016.10.03)
Hsinchu, Taiwan – CoreTech System (Moldex3D) today announced the winners of the 4th Global Innovation Talent Award under the theme of “Tell Us Your #Moldex3DStory.” This global competition recognizes Moldex3D customers that best demonstrate Moldex3D solutions’ values and offerings to the overall manufacturing process and outcome |
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Telechips Collaborates with TomTom to Expand Global Automotive Market (2016.10.03)
Telechips announced that TomTom and Telechips have entered into MOU at preliminary event for Paris Motor Show in 29th of Sep, 2016 for market expansion into global automotive market.
TomTom and Telechips will promote jointly developed IVI in global IVI market, especially, in East Asia including China market |
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VSON4 Small Package Photorelays with 110 Degrees Celsius Maximum Operating Temperature (2016.10.03)
Toshiba Corporation’s Storage & Electronic Devices Solutions Company announced the launch of a new line-up of its small package “VSON4 Series” photorelays that extends the upper end of the operating range from 85 to 110 degrees Celsius |
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Sony and Jackson Estate Announce Closing of Sony's Purchase of Sony/ATV Music Publishing (2016.10.03)
Sony Corporation and the Estate of Michael Jackson, today announced that following the satisfaction of applicable closing conditions, including the receipt of regulatory approvals, Sony Corporation of America, Sony's wholly owned subsidiary, has closed on the purchase of the remaining 50% interest in Sony/ATV Music Publishing LLC from the Estate |
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TSMC Invests Around 400 R&D Manpower in 3-nm Developing (2016.09.30)
TAIPEI, Taiwan - Taiwan Semiconductor Manufacturing Co., Ltd. (TSMC) said yesterday that the company will actively develop 5 nanometers process technology, while putting about 300 to 400 R&D personnel in developing more advanced 3-nanometer process, and toward the 1-nanometer manufacturing process |
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Micro-LED Can Be Game Changing for LED Industry, Says TrendForce (2016.09.30)
LEDinside, a division of the global market research firm TrendForce, held LEDforum 2016 at National Taiwan University Hospital (NTUH) International Convention Center on September 30. This conference, which focused on micro-LED as the next-generation display technology |
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Industry’s Smallest-Package and Lowest-Power MEMS Oscillators (2016.09.30)
Microchip Technology announced the availability of the DSC6000 family of Micro-Electro-Mechanical Systems (MEMS) oscillators. The new family is the industry’s smallest MEMS MHz oscillator with the lowest power consumption over full frequency range of 2 KHz to 100 MHz |
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TIA and TAICS Unveiling a New Chapter in 5G with LOI Signing (2016.09.30)
TAIPEI, Taiwan – Taiwan’s 5G Technology Program Office hosted the 2016 Taipei 5G/IoT Summit on September 29, 2016, in conjunction with TAICS (Association of Information and Communication Standards), to demonstrate Taiwan's determination and efforts in the development of 5G and IoTs |
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Low-Power MCUs for Compact Sensor Hub Applications (2016.09.30)
Renesas Electronics America announced the RL78/G11 Group of microcontrollers (MCUs), a group of small-package, low-power MCUs that will enable users to easily and more quickly prototype and develop systems that support low-power sensor hubs and sensor application systems |
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Connected Car to Grow Rapidly Over Next Five Years, Gartner Says (2016.09.30)
Connected car production is growing rapidly in both mature and emerging automobile markets, according to the latest forecast by Gartner, Inc. The production of new automobiles equipped with data connectivity, either through a built-in communications module or by a tether to a mobile device, is forecast to reach 12 |
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802.11ad Test Solution From Keysight (2016.09.30)
Keysight Technologies announced the volume launch of their solution for testing 802.11ad devices. The flexible and compact E7760A wideband transceiver is an integrated test solution that supports the IEEE 802.11ad wireless standard |
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Taiwan’s Panel Industry Output Declined in the 2016H1 (2016.09.29)
TAIPEI, Taiwan - According to PIDA, Taiwan’s panel industry was affected by unclear global demand and the continual growth of Mainland China’s production capacity for panels. Therefore, during the first half of 2016, the output of Taiwanese LCD panel manufacturers slowed down |
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Samsung Electronics and SAP Open Research Center for Next-generation In-memory Platform (2016.09.29)
Samsung Electronics and SAP SE, today held the opening ceremony for a joint research center where engineers will conduct R&D for memory solutions to be used in next-generation in-memory computing.
The establishment of the research center is part of an extended partnership between the two world-leading corporations |
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Mesh Networking Module Simplifies Thread and ZigBee Connectivity (2016.09.29)
Silicon Labs has introduced a new family of Wireless Gecko modules focused on mesh networking applications with support for best-in-class ZigBee and Thread software.
Silicon Labs’ new MGM111 module is the first in this comprehensive family of multiprotocol modules based on the Mighty Gecko system-on-chip (SoC) device |
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Stacked Perovskite/CIGS Solar Module Achieves Unprecedented Efficiency at 17.8% (2016.09.29)
Scientists from imec (partner in Solliance and EnergyVille), Karlsruhe Institute of Technology (KIT), and Zentrum für Sonnenenergie- und Wasserstoff-Forschung Baden-Württemberg (Centre for Solar Energy and Hydrogen Research, ZSW), announced that they have fabricated a thin-film solar module stack made up of perovskite and Copper Indium Gallium Selenide (CIGS) with a conversion efficiency of 17 |
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Xavier, the NVIDIA AI Supercomputer for Autonomous Transportation (2016.09.29)
NVIDIA unveiled Xavier, new AI supercomputer, designed for use in self-driving cars.
Xavier is a complete system-on-chip (SoC), integrating a new GPU architecture called Volta, a custom 8 core CPU architecture, and a new computer vision accelerator |
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