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Acer’s New Swift 7 and Spin 7 Awarded Japanese Good Design Awards (2016.10.19)
TAIPEI, Taiwan - Acer announces that its latest ultra-thin-and-light notebooks, Acer Swift 7, Acer Spin 7, have been honored at the 2016 edition of Japan’s Good Design Award. The Acer’s abTouchPhone was also awarded.
“The thinness and functionality of a laptop PC conflict with its operability, but the Acer Swift 7 strikes an appropriate balance between the two elements |
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MediaTek Releases New LinkIt 2523 Development Kit for Wearable Products (2016.10.19)
MediaTek announced the availability of the LinkIt 2523 Hardware Development Kit (HDK) for developers looking to create advanced wearable products. Based on the MediaTek MT2523G chipset the HDK - produced by Silicon Application Corp (SAC) - offers dual-mode Bluetooth, comprehensive GNSS standards support and industry leading performance in terms of time-to-first-fix, accuracy and power consumption |
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Motion-Sensing Device from STM Certified for Google Daydream and Tango, Supports VR and AR (2016.10.19)
STMicroelectronics (STM) announced that its LSM6DSM 6-axis Inertial Measurement Unit (IMU) has earned certification for use in next-generation mobile devices running Google Daydream, a high-performance virtual-reality platform, and Tango, a platform that maps 3D space and enables it to be overlaid with virtual objects |
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Knowles, Goertek and AAC Rank the Top 3 Suppliers of MEMS Microphones (2016.10.19)
Knowles, Goertek and AAC ranked as the top three global suppliers of packaged MEMS microphones for 2015, according to IHS Markit.
MEMS (micro-electromechanical systems) technology is utilized to produce microphones used in laptops, hearing aids, wearables and smartphones among many other products |
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First Dual-port CSI-2 Quad Deserializer Hub for ADAS Applications (2016.10.18)
Texas Instruments (TI) introduced the industry's first dual-port quad deserializer hub that is compliant with the MIPI Camera Serial Interface 2 (CSI-2) specification. The new automotive-qualified hub simultaneously aggregates and replicates high-resolution data from up to four cameras |
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TSMC Projects Three Subjects Will Grow in the Next Five Years (2016.10.18)
TAIPEI, Taiwan – As the biggest IC foundry in the world, TSMC has most leading tech companies in its hand, and that is why TSMC’s project of the market trend is so important to technology industry.
Recently, TSMC had pointed out that smartphones |
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Broadcom Expands 802.11ac MU-MIMO Portfolio for Routers, Service Provider Gateways and STBs (2016.10.18)
Broadcom Limited announced a new 4x4 802.11ac Wave2 solution which enables significantly better range performance in addition to video over Wi-Fi acceleration capability. The BCM4366E Wave-2 802.11ac 4x4 radio incorporates RangeBoost technology for enhanced Wi-Fi coverage and DoubleZero acceleration technology enabling best-in-class Video over Wi-Fi capability |
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New EERAM Memory Offers Unlimited Endurance Along with Safe Data Storage at Power Loss (2016.10.18)
A new low-cost, low-risk memory solution offering unlimited endurance and safe data storage at power loss is now available from Microchip Technology. This new I2C EERAM memory is an easy-to-implement, non-volatile SRAM memory that is ideal for applications that need to constantly or instantaneously record, update or monitor data including metering, automotive and industrial applications |
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Vietnam’s LED Lighting Market to Takes Off and Reach US$348M in 2016, Says TrendForce (2016.10.18)
The latest analysis by LEDinside, a division of TrendForce, finds that Vietnam’s LED lighting market is projected to reach US$348 million in 2016, up 28% from US$271 million in 2015. The steady growth of the Vietnamese market has caught the attention of LED lighting companies worldwide |
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eMemory Receives SMIC Best IP Partner Award for 4th Year in a Row (2016.10.18)
HSINCHU, Taiwan – eMemory, announced today that the company have been recognized for the fourth year in a row with the Semiconductor Manufacturing International Corporation (SMIC) Best IP Partner Award.
eMemory has been working closely with China-based to deploy logic-based non-volatile memory (Logic NVM) in all generations of SMIC’s process platforms |
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Moldex3D Donates $3 Million Gift to Vietnamese Universities to Inspire New Talents for the Country (2016.10.18)
HSINCHU, Taiwan – CoreTech System (Moldex3D), the global leading provider of plastic injection molding simulation solutions, today announced the donation of the latest release of Moldex3D R14 software, valued at $3 million USD, to two of the most reputable universities in Vietnam, Ho Chi Minh City University of Technology and Education (HCMUTE) and Ho Chi Minh City University of Technology (HCMUT) |
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TAICS Hosts International 5G Technology Workshop for Standardized Development (2016.10.18)
TAIPEI, Taiwan - Taiwan Association of Information and Communication Standards (TAICS), Chunghwa Telecom, and MediaTek on October 15 in Kaohsiung, Taiwan held the “5G Technology Workshop – Potential Technology for 3GPP Rel-15 Standardization |
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Computer Technology and Control are the Most Important Smart Home Appliance Patent Fields (2016.10.18)
(圖一) Smart Home Appliance Patent by Sector(Source: MIC, August 2016)
Of the 1,702 smart home appliance patents applied to USPTO (United States Patent and Trademark Office) during January 1, 2005 and April 12, 2016, 52.0% were used in Electrical Engineering, 27 |
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Semtech Joins ZTE to Launch IoT Demonstration Bases for LoRa Technology in China (2016.10.18)
Semtech Corporation joined ZTE Corporation today to formally announce the launch of ZTE’s first Internet of Things (IoT) Demonstration Base (CLAA IoT Demonstration Base) dedicated to LoRa Technology in Nanjing, China.
The CLAA IoT Demonstration Base allows IoT solution providers to deploy and test their applications over a low power, wide area network (LPWAN) |
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Broadcom Introduces the BCM6858 Solution Delivering 10G PON Support for All PON Protocols (2016.10.17)
Broadcom Limited introduced the BCM6858 solution delivering 10G PON support for all PON protocols. As a follow on to Broadcom’s market leading BCM6838 and BCM6848 product families, the BCM6858 enables a 10 Gigabit non-blocking fiber-based Optical Network Termination (ONT) and home gateway capabilities to facilitate service provider’s advanced 10G PON service offerings |
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DENSO and Toshiba co-Develop AI Technology, Deep Neural Network-IP, for Image Recognition Systems (2016.10.17)
DENSO Corporation and Toshiba Corporation have reached a basic agreement to jointly develop an artificial intelligence technology called Deep Neural Network-Intellectual Property (DNN-IP), which will be used in image recognition systems which have been independently developed by the two companies to help achieve advanced driver assistance and automated driving technologies |
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Taiwan OLED Display Panel Suppliers Overview (2016.10.17)
Utilizing Organic Light-Emitting Diode (OLED) technology as a display application has the advantages of consuming less power and having a thinner panel volumes. It is also extremely suitable for use in mobile devices, especially smart phones |
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Tight Supply for VR-related Components to Persist Over the Next year, Including OLED Panels (2016.10.17)
TrendForce pointed out that Sony’s PlayStation VR (PS VR) immediately achieved sold-out which signaled the start of a new round of competition in the global VR device market in the fourth quarter of 2016.
“Demand for VR devices will remain quite strong in the next two years,” said Jason Tsai, wearable device analyst for TrendForce |
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Samsung Starts Mass Production of SoC with 10nm FinFET Technology (2016.10.17)
Samsung Electronics today announced that it has commenced mass production of System-on-Chip (SoC) products with 10-nanometer (nm) FinFET technology for which would make it first in the industry.
Following the successful mass production of the industry’s first FinFET mobile application processor (AP) in January, 2015, Samsung extends its leadership in delivering leading-edge process technology to the mass market with the latest offering |
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Optics, Audio-Visual, Computer, Telecommunications are the Most Important AR HMD Patent Fields (2016.10.17)
TAIPEI, Taiwan - According to MIC, most of the assignees' patents of AR HMD patent fields concentrated in the following sectors: Electronic Engineering (50.2%), Apparatus (15.3%), Mechanical Engineering (1.7%), Chemistry (1.3%), and others (1 |
USB2.0 is a Universal Serial Bus standard PC and peripheral equipment is widely used to get rid of the application areas limited to the PC in the past, and more in-depth applications in the digital consumer electronics products which.