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Axiomtek’s New Industrial ATX Motherboard with Multiple I/O (2016.10.17)
Axiomtek introduced its new IMB500, an industrial ATX motherboard powered by the 6th generation Intel Core, Pentium and Celeron processors (formally codename: Skylake) in the LGA1151 socket with Intel Q170 chipset.
The IMB500 supports four 288-pin DDR4-2133/1866 SO-DIMM sockets with a memory capacity of 64GB to enhance overall system performance |
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Gigazone, Gigabyte, E Ink Jointly Launch "Cordless and Wireless" Digital Photo Frame (2016.10.17)
New Taipei City, Taiwan– Gigazone International Co., Ltd., Gigabyte Technology Group, and E Ink Holdings, announced a collaboration to launch the world's first "Cordless and Wireless" digital photo frame - Pixer.
Pixer is the world's first "Cordless and Wireless" digital photo frame by using the latest E Ink Carta display, providing the industry's highest contrast ratio, 300 DPI high-definition and 16 bits grayscale |
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ASE Receives ISO 26262 Certification Standard for Automotive Electronic Systems (2016.10.17)
TAIPEI, Taiwan - Advanced Semiconductor Engineering, Inc (ASE), the leading provider of semiconductor assembly and test services, announced that its Chung Li, Taiwan facility has received the ISO 26262 certification from TÜV NORD |
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SoftBank and Alibaba to Produce Chinese Version Pepper (2016.10.14)
SoftBank Robotics Holdings yesterday announced that the company is going to expand its humanoid robot ‘Pepper’ business in the China market by establishing a joint venture with Alibaba Group.
According to SoftBank, the new joint venture named “Alibaba Robot Corporation” |
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SMIC Starts Construction of a New 12-Inch Wafer Fab in Shanghai, China (2016.10.14)
Semiconductor Manufacturing International Corporation (SMIC), one of semiconductor foundries in Mainland China, yesterday held its groundbreaking ceremony of a new 12-inch wafer fab in Shanghai to meet SMIC Shanghai's increasing production and development needs |
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Professional Service Robots Forecasted to Increase Very Quickly (2016.10.14)
As technology improves and as prices fall, professional service robots are increasingly doing jobs formerly handled by human workers. Revenue from professional service robots reached $2.6 billion, with around 20,000 units shipped in 2015, according to a new report from IHS Markit |
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Toshiba's New Transistor Arrays Have Data Storage Function (2016.10.14)
Toshiba Corporation's Storage & Electronic Devices Solutions Company today announced the launch of “TBD62089APG”, a new-generation transistor array for applications such as LED lighting for amusement equipment and high voltage signal transmitters for industrial equipment |
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Powertron Announces Industry's First Ultra-High-Precision Current Sense Resistors (2016.10.14)
VPG Foil Resistors, a Vishay Precision Group, Inc. product group, announced today that its Powertron brand has expanded its S-Line of precision Bulk Metal® Foil current sense resistors with the new SHLR series. For industrial and energy applications, the SHLR 4-2321, SHLR 4-3825, and SHLR 4-3825H are the industry's first such devices to combine low resistance down to 0 |
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The Scale of COB LED Lighting Market to Reach US$700 Million in 2021 (2016.10.14)
According to LEDinside, a division of TrendForce, the scale of the global market for chip-on-board (COB) LEDs used in the lighting application will reach US$580 million in 2016 and exceed US$700 million in 2021, achieving a CAGR of about 4% during the forecast period |
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Worldwide Shipments of 3D Printers to Grow 108% in 2016, Gartner Says (2016.10.13)
Worldwide shipments of 3D printers will reach 455,772 units in 2016, more than doubling the 219,168 units shipped in 2015, according to Gartner. Despite slowing growth rates after the market's initial growth spurt, the increase in 3D printer shipments over the next four years will see the number of units shipped in 2020 total more than 6 |
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TSMC Is Confident Its 7nm to Be Ahead of the Competitions (2016.10.13)
TAIPEI, Taiwan – After reaching a historical high of Q3 revenue, TSMC today projected its Q4 revenue of 2016 will be about NT$255 billion to NT$258 billion, slightly decline 0.9% to 2%. In addition, TSMC indicated that it was optimistic about its developing progress of 7nm technology and the company will take the lead in the advanced process competition |
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Apple to Establish R&D Center in Shenzhen, China (2016.10.13)
TAIPEI, Taiwan - Apple CEO Tim Cook announced that Apple will in Shenzhen, China establish its second research and development center in Mainland China and also increase their local sales outlets. At the same time, the company responsible for Apple iPhone assembly, Hon Hai, signed a memorandum of cooperation with Shenzhen City Government to further deepen their investment in Shenzhen |
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ASRock 100 Series Motherboards Support Next Generation Socket 1151 Intel Processors (2016.10.13)
ASRock announces that its 100 series motherboards will support Next Generation socket 1151 Intel Core Processors. Via a new BIOS update, ASRock Z170, H170, B150 and H110 series motherboards are resurrected.
ASRock provides the latest BIOS not only to those high-end and mainstream motherboards, but also to those entry level ones |
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New Wireless Temperature Measurement and Monitoring System for Automotive Brake Rotors (2016.10.13)
TECAT Performance Systems today announced the first product in its new WISER TC family of temperature measurement and monitoring systems. Optimized for automotive brake rotors and ideal for mounting inside wheel hubs, the compact WISER TC2-K provides low power consumption and high accuracy in high-temperature environments |
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HDR TV Shipments to Grow to 4.3M Units in 2016, IHS Markit Says (2016.10.13)
High dynamic range, also known as HDR, is a new category of 4K TVs that emerged in 2016. HDR TV shipments will reach more than 4 million units in 2016 and growth to more than 30 million units by 2020, according to IHS Markit.
The market for HDR compatible TVs, defined as any sets compatible with basic HDR formats but utilizing standard dynamic range displays, will be as much as four times larger |
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Low 1mm Profile LED Driver IC Saves More Than 0.5W (2016.10.13)
Arctic Sand Technologies launched an ultra-high efficiency LED driver targeting Next Gen - Ultra High Definition - Ultrabook platforms. The ARC2C0608 reduces losses in the LED boost by about 50%, resulting in savings of more than 0 |
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64 Ports of 100GE with Tomahawk II 6.4Tbps Ethernet Switch from Broadcom (2016.10.13)
Broadcom Limited announced immediate availability of its new family of switches optimized for cloud-scale data centers deploying high density 100G switching solutions. Building on the widely deployed StrataXGS Tomahawk and Trident switch products |
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Unmatched Modular UPS with 55kVA per Module and 120kW RowCool from Delta (2016.10.12)
Delta announced it is attending Data Center World 2016 in Singapore under the theme “High Power, High Performance, High Efficiency” to demonstrate its 500kVA modular UPS Modulon DPH series which features the world’s highest 55kVA power within the world’s most compact 3U size module, and its precision cooling solution, RowCool, with uniquely high 120kW cooling capacity, both designed for large, high-density and green data centers |
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Samsung's 7nm Process May Be Behind the Schedule (2016.10.12)
TAIPEI, Taiwan - According to news from Taiwan's Economic Daily News, progress on Samsung's 7nm production is behind schedule and mass production will be impossible for them next year. However, Taiwan Semiconductor Manufacturing Company (TSMC) will carry out risk trials for 7nm products in Q1 of next year and expect to do commercial production during Q4 of next year so that it will contribute to their revenue in 2018 |
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Samsung’s LED Modules Based on Chip Scale Packaging (2016.10.12)
Samsung Electronics announced a new line-up of chip scale package (CSP) LED modules for spotlights and downlights that features color tunability and increased design compatibility.
The new LED modules are Samsung’s first to incorporate CSP technology, which bring a wide range of lighting benefits such as significantly reducing the size of a conventional LED package |
Overall, the number of times the Bus specification standard is rising between mainframe computers and peripherals, data transfer speed, capacity and quality of the application process. Let's Introduction to several important bus application specifications.