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New LED Components for Automotive Lighting, Featuring Chip-Scale Packaging (2016.06.21)
Samsung Electronics announced that it has introduced “Fx-CSP,” a line-up of LED packages which features chip-scale packaging* and flexible circuit board technology, for use in automotive lighting applications.
“Our new Fx-CSP line-up will bring greater design flexibility and cost competitiveness to the automotive lighting industry,” said Jacob Tarn, executive vice president, LED Business Team, Samsung Electronics |
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KIWI PLUS Launches a New Children’s Smartwatch in Collaboration with u-blox (2016.06.21)
KIWI PLUS, one of Korea’s software development, has launched a new children’s smartwatch developed in collaboration with u-blox. LINE Kids Watch is a tiny and colorful wearable with LINE emojis functioning as an Android-based smartwatch and officially distributed by KT Corporation |
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The World’s Smallest 9-axis Motion Sensor Compact (2016.06.21)
Bosch Sensortec is launching the BMX160, a compact 9-axis motion sensor that is ideally suited for a wide range of applications such as smartphones, smart watches, fitness trackers, smart jewelry – e.g. rings, necklaces – as well as Augmented/Virtual Reality devices |
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ROHM and Mindteck Collaborate on IoT Applications (2016.06.21)
ROHM and Mindteck today announced their collaboration on 2 IoT-based demonstrations utilizing ROHM sensors, a Wi-Fi Thermostat and Lighting Control System, developed using advanced sensing technologies.
The Wi-Fi Thermostat is a cloud-enabled thermostat integrating ROHM's temperature and proximity sensors (BD1020HFV and RPR-0521RS) that provides anytime/anywhere control with real-time data collection |
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ST Collaborates with Qualcomm on Sensors for Smart Mobile Devices (2016.06.20)
STMicroelectronics today announced that Qualcomm Technologies Inc., a subsidiary of Qualcomm Incorporated, intends to add software support for ST's inertial sensor solutions including its award-winning iNEMO inertial module. |
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Bluetooth 5 to Increases Data Broadcasting Capacity by 800% (2016.06.20)
The Bluetooth Special Interest Group (SIG) announced that its next release, coming late 2016 to early 2017, will be called Bluetooth 5 and will include significantly increased range, speed, and broadcast messaging capacity.
Bluetooth 5, projected for release in late 2016 to early 2017, will quadruple range and double speed of low energy connections while increasing the capacity of connectionless data broadcasts by 800 percent |
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India's 3D Printer Market Projected to Reach Over $62 Million by 2022 (2016.06.20)
According to Research and Markets, India's 3D printer prototyping & materials market is projected to reach over $62 million by 2022.
A 3D printer is a device that creates objects by using technologies such as stereolithography, selective laser sintering, fused deposition modelling, multijet modelling or polyjet technology and with materials like ABS, PLA, PC, resins, powders or other suitable materials |
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APLEX Industrial Panel PC Certified by ATEX Standard and IECEx Conformity (2016.06.20)
TAIPEI, Taiwan APLEX Technology announced its success in the ATEX and IECEx certification for the 15” Panel PC. The AEx Series complies with the Essential Health and Safety Requirements relating to the design and construction of equipment and protective systems intended for use in potentially explosive atmospheres |
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Telink Semiconductor and IXYS Corporation Join Forces to Address IoT Chip Solutions Market (2016.06.20)
Telink Semiconductor and IXYS Corporation have signed an agreement to jointly target the growing IoT market. The companies will initially address geographies such as Korea, Japan and Europe, leveraging IXYS’ channels and sensor technologies, and Telink’s unified IoT system-on-chip solutions |
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1.2-mm2 FemtoFET 60-V N-channel power MOSFET (2016.06.20)
Texas Instruments (TI) introduced a new 60-V N-channel FemtoFET power transistor that provides the industry's lowest resistance that is 90 percent below traditional 60-V load switches, reducing power loss in end-systems.
The CSD18541F5 is offered in a tiny 1 |
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Healthcare Providers in India to Spend $1.2B on IT in 2016, Gartner Says (2016.06.20)
Healthcare providers in India are expected to spend $1.2 billion (USD) on IT products and services in 2016, an increase of 3.4 percent over 2015, according to Gartner, Inc. This forecast includes spending by healthcare providers (includes hospitals, hospital systems, nursing and residential care and university hospitals) on internal services, software, IT services, data center systems, devices and telecom services |
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Imec Demonstrates Highly Efficient Bifacial Solar Cells with near 100% Bifaciality (2016.06.20)
Imec will present at this week’s Intersolar Europe/EU PVSEC a highly efficient bifacial n-PERT (BiPERT) solar cell featuring a bifaciality value close to 100%. With a rear cell efficiency close to the efficiency measured from the front of the cell, imec’s new achievement underscores the ability to strongly enhance the energy yield of photovoltaic (PV) modules made with this type of cell |
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TrendForce Forecasts Rising Prices for TLC Wafers and Spot-traded Memory Cards in the Q3 (2016.06.20)
The latest NAND Flash price report from DRAMeXchange, a division of TrendForce, finds prices of TLC wafers and spot prices of mainstream memory cards have been on a steady rise for three consecutive months since this April. The uptrend will continue as the possibility of the market encountering tight supply in the third quarter becomes more apparent |
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Imec Demonstrates Junction-less Gate-All-Around Lateral and Vertical Nanowire FET Devices (2016.06.16)
At the 2016 Symposia on VLSI Technology & Circuits, imec presented junction-less gate-all-around (GAA) nanowire (NW) FETs built in lateral and vertical configurations. With their simplified processing, improved reliability, reduced low frequency noise and lower IOFF values, they are an attractive option for advanced logic, low power circuits and analog/RF applications |
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Singapore NTU and Delta Set up S$45 Million Joint Lab for Smart Technologies (2016.06.16)
Nanyang Technological University (NTU Singapore) and Delta Electronics have established a joint laboratory to develop smart technologies that will enhance everyday lives, enable better learning and advance manufacturing processes |
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DRAM Prices to Stabilize in 2017 as Suppliers Implement Plans to Control Supply, Says TrendForce (2016.06.16)
The DRAM market is in the midst of a long-term slump and the average contract selling price has suffered 19 consecutive months of decline. DRAMeXchange, a division of TrendForce, reports that the average selling price of DDR4 arrived at US$1 |
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Taiwan’s Hermes Microvision Inc. acquired by ASML (2016.06.16)
TAIPEI, Taiwan - Hermes Microvision, Inc. (HMI), Taiwan’s leading supplier of pattern verification systems used for advanced semiconductor devices, announce that ASML will acquire all shares of HMI in a cash transaction valued at about TWD 100 billion (approximately EUR 2 |
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WISE-4051: RS-485 Wireless I/O Module with Cloud Connectivity and IoT Protocol (2016.06.16)
Advantech’s Industrial Automation Group (IAG) is pleased to announce the launch of their complete series of 2.4G WISE-4000 IoT Wireless I/O modules which will revolutionize the way that data is gathered from remote or difficult to wire locations |
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WPC and TAICS Form Agreement to Promote Qi Standard in Taiwan (2016.06.16)
TAIPEI, Taiwan - The Wireless Power Consortium (WPC) announced today it signed a strategic agreement with Taiwan Association of Information and Communication Standards (TAICS), an association supported by Taiwan’s Ministry of Economic Affairs |
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EXPEC Becomes Taiwan’s First Company to Obtain PS4 VR Certification (2016.06.16)
TAIPEI, Taiwan - With the major gaming companies Sony and Microsoft developing VR products, VR product development is becoming an important market in the gaming industry. Taiwan XPEC Entertainment are also actively developing VR gaming software and have obtained PS4 VR certification from Sony, which makes them Taiwan’s first company to obtain VR certification |
