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Smallest 3D Camera Brings AR to a Smartphone (2016.06.15)
Lenovo is the first manufacturer worldwide to bring Tango technology to a consumer product. Google's technology that allows devices to understand spatial information is an exclusive feature in the PHAB2 Pro smartphone launched today |
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Large Current Power Choke Coil for Automotive Use (2016.06.15)
Panasonic Corporation announced that it has developed 12mm range square size (SMD Type) large current (20A-50A) “Power Choke Coil” suited for power supply circuits of automotive ECUs (Electronic Control Units) of HEV, EV, gasoline-powered vehicles etc |
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Billion Electric Collaborates with Intraix to Conclude Smart Metering Project in Singapore (2016.06.15)
Billion Electric partners with Intraix, a Singaporean tech startup dedicated to the development of Smart Home Energy Management applications, to assist NEA (National Environment Agency) on facilitating the national policy of restricting carbon emission on home appliances through an effective intelligent energy management solution |
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Automotive Brushless DC Motors with Two New Motor Drivers (2016.06.15)
Texas Instruments (TI) introduced two new automotive motor drivers that support high-performance powertrain applications. The DRV8305-Q1, a highly integrated three-phase brushless DC gate driver, and the UCC27211A-Q1, a high-current half-bridge gate driver, improve system performance and provide design flexibility to meet a diverse range of automotive system requirements |
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Scale of Chinese LED Package Market to Expand by 5% Annually in 2016 (2016.06.15)
The scale of China’s LED package industry grew just 2% annually to US$8.8 billion in 2015, according to the 2016 Chinese LED Chip and Package Industry Report by LEDinside, a division of TrendForce. The weak performance of the Chinese LED industry last year was mainly attributed to the global economic slowdown |
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UTAC, Sarda and AT&S Collaborate in Delivering Small, Fast Voltage Regulators (2016.06.14)
Sarda Technologies (Sarda) and UTAC Holdings Ltd (UTAC) today announced that Sarda will implement its Heterogeneous Integrated Power Stage (HIPS) in UTAC’s three-dimensional system-in-package (“3D SiP”) based on ECP technology from AT&S to improve data center's energy efficiency |
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Smartphone Technologies Can Not Be Ignored (2016.06.14)
The smartphone market is getting more complex and dynamic, as well as maturing and being highly commoditized. In such mature market, technology improvements in smartphone has brought incremental enhancements and these are often not perceived by users as critical for them |
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ARM Announces POP IP for Cortex-A73 on TSMC 16FFC Process (2016.06.14)
ARM announced the availability of ARM Artisan physical IP, including POP IP, for mainstream mobile SoCs based on the new ARM Cortex-A73 processor on the TSMC 16FFC (FinFET Compact) process. The third-generation Artisan FinFET platform is optimized for TSMC 16FFC process and will enable ARM SoC partners to design the most power-efficient |
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Spur Canceled Clock Generator Recovers Receiver Sensitivity in Wireless SoCs (2016.06.14)
Toshiba Corporation has developed a spur canceled clock generator (SCCG) that recovers receiver sensitivity of wireless connectivity IC.
The SCCG recovers receiver sensitivity by suppressing the spur, interference that originates from the clock signal, and achieves receiver sensitivity of -93 dBm for all channels in Bluetooth Smart ICs |
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IBM to Offer Apple Pay on the Web (2016.06.14)
IBM today announced that it will offer Apple Pay on the web to its online clients, bringing their customers easy, secure and private payments in Safari on iPhone, iPad and Mac with a single touch.
Apple Pay on the web will be made available to clients that use IBM’s WebSphere Commerce or IBM Commerce on Cloud |
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The Closing of Micron-Merging-Inotera Deal Has Delay, TrendForce Says (2016.06.14)
Inotera held a brief press conference (6/13, 2016), stating that Micron has decided to delay the schedule of merging Inotera, and the future update will be announced in later part of this year. Other than the NT$80B syndicated loan is still processing, current technical support between MMT (Micron Memory Taiwan) and Inotera has been put on hold |
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VESA Develops Early Certification Program for USB Type-C Devices Using DisplayPort Alt Mode (2016.06.13)
The Video Electronics Standards Association (VESA) announced the official launch of its early certification test program for products incorporating the new USB Type-C connector and the DisplayPort Alternate Mode (“Alt Mode”) standard |
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Industry's Most Integrated Resolver Sensor Interface (2016.06.13)
Texas Instruments (TI) introduced the industry's first resolver sensor interface with integrated power supply, exciter amplifier and functional safety features.
The new device is capable of simultaneously exciting the resolver sensor coil and calculating the angle and velocity of a rotating motor shaft without the external components required by competitive solutions |
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Free STM32 USB-C and PD Middleware Stack (2016.06.13)
As electronics companies worldwide increasingly look to implement the new USB Type-C(TM) and Power Delivery (PD) technology, STMicroelectronics is making the task easier with a certified embedded software solution based on its industry-leading STM32 microcontrollers |
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Transcend Strengthens SSD Sales, Revenue Ratio to Exceed 20% (2016.06.13)
TAIPEI, Taiwan - Taiwan memory manufacturer Transcend stated that because DRAM companies are continuing to reduce their production capacities, in the third quarter of this year the oversupply situation is expected to slow down and prices to rebound |
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Keysight and Taiwan NAR Labs Sign MOU to Develop 5G Technologies (2016.06.13)
Keysight Technologies and National Applied Research Laboratories (NAR Labs), Taiwan, today announced the signing of a memorandum of understanding (MOU) to establish a strategic partnership on research and development of 5G communication technologies |
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IBM Unveils Two New IBM Studios in Singapore and Seoul (2016.06.13)
IBM today announced the opening of IBM Studios in Singapore and Seoul, Korea to support digital reinvention for clients in Asia.
IBM Studios Seoul, located at the IBM Korea headquarters in Yoido, and IBM Studios Singapore, located in the Marina Bay Financial Centre, will host designers and digital experts from IBM Interactive Experience (iX), which provides next-generation services dedicated to creating personalized brand experiences |
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SMIC and Synopsys Deliver 28-nm HKMG Low-Power Reference Flow (2016.06.08)
Semiconductor Manufacturing International Corporation (SMIC) and Synopsys, Inc. today announced immediate availability of their joint 28-nanometer (nm) RTL-to-GDSII reference design flow. Developed through deep engineering collaboration between Synopsys and SMIC on the 28-nm High-K Metal Gate (HKMG) process technology |
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Industries’ Highest Performance Gen 3 PXIe Chassis and System Components (2016.06.08)
Keysight Technologies announced a Gen 3 PXIe chassis and set of Gen 3 system components designed for complex, high-performance applications. Doubling the system bandwidth, the new products improve data streaming for capture/playback applications, such as 5G and electronic warfare |
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iST TEM Material Analysis Technique Hit 5nm (2016.06.08)
Amid further advanced processes pursued by the semiconductor industry, iST is announcing its breakthrough in material analysis (MA) test techniques today (June 8). Its TEM material analysis technique is now accepted by international customers for 5 nm process verification |
USB's History history is full of twists and turns, which tasted the major manufacturers against one another, from selfishness to the the profound lessons Wintel cooperation backward intentionally "He can be replaced by" Can you give some food for thought and reflection?