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TI's New Voice Remote Control Solutions (2016.07.03)
Texas Instruments (TI) announced new voice remote control solutions as part of its SimpleLink ultra-low power platform. These were created to help developers easily add ultra-low power Bluetooth low energy, ZigBee RF4CE or multi-standard connectivity to their designs for voice remote controls, TVs, set-top boxes and more |
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FET signed 5G MoU with Ericsson to Develop 5G in Taiwan (2016.07.03)
Ericsson announced last week signing of a 5G Memorandum of Understanding (MoU) with Far EasTone, a leading telecom operator in Taiwan to jointly accelerate 5G development for Taiwan.
Under the agreement, a first 5G Lab in Taiwan is to be established at T-park, New Taipei Ciy in Taiwan |
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Modest Impact on the Taiwan ICT Industry Expected from Brexit, MIC Says (2016.07.01)
TAIPEI, Taiwan - The result of the referendum for the UK to leave the European Union has sent shock waves to the world on June 24, in particular European exchange markets. But it will not hurt Taiwan ICT industry in the long run, according to Taiwan based market intelligence MIC |
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New 2C adhesive for e-motors from DELO (2016.07.01)
DELO Industrial Adhesives has developed a new epoxy resin. The DELO-DUOPOX SJ8665 two-component product provides flexibility and reliability in the production of electric motors in a medium temperature range.
The adhesive features increased strength for this area of application |
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Rambus to Acquire Memory Interconnect Business from Inphi (2016.07.01)
Rambus today announced it has signed a definitive agreement to purchase the Memory Interconnect Business from Inphi Corporation (NYSE:IPHI) for $90M in cash.
The acquisition includes all assets of the Inphi Memory Interconnect Business including product inventory, customer contracts, supply chain agreements and intellectual property |
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Eurofins Digital Testing Opens Cinavia Watermarking Certification Lab in Hong Kong (2016.07.01)
Verance Corporation has authorised Eurofins Digital Testing as a Cinavia certification and verification lab. Consumer electronic devices incorporating the content protection technology will be tested at Eurofins Digital Testing’s facility which is situated in the Hong Kong Science Park, ideally located to support manufacturers in China and South East Asia |
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Phihong Announces A New Family of Highly Efficient Moveable EV DC Chargers (2016.07.01)
Phihong has announced a new family of moveable EV DC off-board chargers that provide quick and highly efficient charging solutions for personal and commercial electric vehicles with 200–700V battery systems.
Featuring a convenient moveable design |
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HTC Founds Virtual Reality with Venture Capital World (2016.07.01)
TAIPEI, Taiwan - HTC at MWC Shanghai 2016 announced that they will team up with 28 of the world’s top venture capital firms to found the Virtual Reality Capital Alliance (VRVCA) and invest billions in funding to encourage entrepreneurship and innovation in the global virtual reality industry |
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New Bluetooth Low Energy Single-Chip Solution (2016.06.30)
STMicroelectronics has revealed its first Bluetooth Low Energy wireless System-on-Chip (SoC). The BlueNRG-1 is optimized to satisfy high-volume opportunities in the fast-growing Bluetooth Low Energy market through the combination of superior energy efficiency and strong radio performance |
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DRAM and NAND Flash Chips Remain SK Hynix's Core Products: MIC (2016.06.30)
SK Hynix has seen much success in the DRAM and NAND flash market. In the ranking of the world's top DRAM companies, SK Hynix is placed second with a 27.7% market share, says Kevin Tu, industry analyst with MIC (Market Intelligence & Consulting Institute) |
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Taiwan's Semiconductor Industry to See 5.5% Growth in 2016 (2016.06.30)
According to MIC, Market Intelligence & Consulting Institute, Taiwanese semiconductor industry will still manage to grow over 5% in 2016.
"Though global semiconductor market value is anticipated to decline 3.2% year-on-year in 2016 to US$329 |
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Illumination LED Driver IC with Single-Wire Input (2016.06.30)
Toshiba Corporation's announced the launch of “TB62D786FTG”, a new LED driver IC with single-wire input and 9-channel output, for amusement equipment and LED illumination applications. Full-scale production is scheduled to start this autumn |
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The Immersion Corrosion Solution for Waterproof Smartphone USB-C Connectors (2016.06.30)
XTALIC introduced LUNA USB earlier this year as a newly engineered connector plating technology that uses Xtalic nanostructured metal alloys to provide USB-C connectors with superior immersion corrosion protection.
While electrical connectors are generally designed to survive and perform in a range of corrosive environments, the mobile electronics application is particularly challenging for two reasons |
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World High Purity Alumina Market Expected to Reach $4,498 Million by 2022 (2016.06.30)
According to a new report published by Allied Market Research, titled, "World High Purity Alumina (HPA) Market - Opportunities and Forecasts, 2015-2022", the high purity alumina (HPA) market is expected to reach $4,498 million by 2022, registering a CAGR of 16 |
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OPPO and Vivo to Surpass 40% in Production Volume Growth This Year (2016.06.30)
The latest report from the global market research firm TrendForce finds that Chinese smartphone brands will continue to witness substantial increase in their production volumes through 2016, with their average year-on-year growth rate reaching 11% |
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Industry’s First Multiband, Multiprotocol SoCs Support 2.4 GHz and Sub-GHz Connectivity (2016.06.29)
Expanding its Wireless Gecko portfolio, Silicon Labs has launched the industry’s first multiband, multiprotocol wireless system-on-chip (SoC) devices for the Internet of Things (IoT) market.
The new multiband Wireless Gecko SoCs enable developers to use the same multiprotocol device for operation in 2 |
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TSMC’s Production Capacity to Be Fully Loaded in the H2 (2016.06.29)
TAIPEI, Taiwan - According to Taiwan Economic Daily News, leading chip foundry, clients are lining up for Taiwan Semiconductor Manufacturing Company’s (TSMC) 8-inch and 12-inch chip production lines. TSMC’s third quarter revenue is expected to experience a growth rate of over 15% and possibly even as high as nearly 20% |
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Mini-ITX Motherboard with Wide Range DC Power Input 12~24V Support (2016.06.29)
Advantech announced the release of a high-end Mini-ITX motherboard with wide range 12~24V DC power input. AIMB-275 is and the latest 6th generation Intel Core I processor, bundled with Advantech’s own WISE-PaaS/RMM software suite that offers remote management and security features |
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Amkor Technology Opens MEMS Packaging Line in China (2016.06.29)
Amkor Technology today announced it is ramping up a new MEMS and sensor packaging line at its facility in Shanghai. This new, state-of-the-art line will build on the expertise developed at Amkor’s MEMS packaging line in the Philippines, which has produced more than 2 |
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World’s Fastest 256GB microSD Card (2016.06.29)
Western Digital Corporation introduced a new suite of 256 gigabyte (GB) microSD cards, which includes the new 256GB SanDisk Extreme microSDXC UHS-I card – the fastest microSD card in its class.
The new suite of cards also includes 256GB SanDisk Ultra microSDXC UHS-I card, Premium Edition, the first 256GB card optimized for mainstream consumers |
