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Asia Pacific to Add 600 Million New Mobile Subscribers by 2020, GSMA Reports (2016.06.29)
The number of mobile subscribers in the Asia Pacific region reached 2.5 billion at the end of last year and will grow to 3.1 billion by 2020, according to a new GSMA study published at GSMA Mobile World Congress Shanghai this week |
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Gartner Forecasts Public Cloud Services in Mature Asia/Pacific to Reach $8.1 Billion in 2016 (2016.06.29)
The public cloud services market in the mature Asia/Pacific (AP) region is on pace to grow 12.8 percent in 2016 to total $8.11 billion, up from $7.19 billion in 2015, according to Gartner, Inc. By 2019, Gartner predicts that total public cloud services spending in the mature AP region will rise to $12 |
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Industry's Highest Performing Reinforced Isolated Amplifier (2016.06.28)
Texas Instruments (TI) introduced a reinforced isolated amplifier with the highest reliability, lowest power consumption, highest DC accuracy and improved overall efficiency compared to competitive devices.
The AMC1301 is the newest addition to TI's reinforced isolation portfolio, which features the industry's highest working voltage specifications |
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IBM Research Converts Old Smartphones into Non-Toxic, High-Strength Plastics (2016.06.28)
IBM Research announced that researchers from the Almaden lab in San Jose, Calif. have discovered a new, one-step chemical process that converts polycarbonates into plastics safe for water purification, fiber optics and medical equipment |
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GSMA: Customers Seeking Rich Services from Operators (2016.06.28)
Global mobile subscribers are demanding richer, global and open IP-based messaging experiences from mobile network operators, according to a new report called ‘The Future of Mobile Communications,’ released today by the GSMA |
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Covestro Develops New Materials for 3D Printing (2016.06.28)
Covestro currently is developing a comprehensive range of filaments, powders and liquid resins for all common 3D printing methods.
“We market products with a variety of properties like toughness and heat resistance as well as transparency and flexibility that support a number of new applications,” said Dr |
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New Flash MCU for Smart Household Appliance Applications (2016.06.28)
Holtek announced the release of a new device addition to its Enhanced A/D Flash Type range, the HT66F0176, forming an extension product of the HT66F0175. The device includes an internal UART function which allows for easy communication with bluetooth and WiFi modules, making it suitable for use in smart kitchen, household and personal life appliances, a product trend which is making homes safer, more convenient and comfortable |
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LCD Panel Prices to Recover Despite an Increase in Market Supply During Q2 (2016.06.28)
The first quarter conventionally is when the LCD panel market has abundant supply. However, the February earthquake in southern Taiwan and Samsung Display (SDC) having problems with transitioning to a new manufacturing process resulted in some loss of the panel industry’s overall capacity during the period |
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ROHM, EcoReco Develop an Innovative Electric Scooter (2016.06.27)
ROHM and EcoReco announced their collaboration on a new electric scooter utilizing ROHM Group sensors. EcoReco's Model R scooter prototype, which will be showcased at Sensors Expo 2016, integrates ROHM's RPR-0521RS proximity + ambient light sensor along with Kionix's 6-axis accel-gyro combo sensor, KXG03 |
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Front IP65 10.1’’ Full Flat Multi-Touch Monitor (2016.06.27)
Avalue Technology is releasing Rity10M in July, 2016. Rity10M is a 10.1” touch monitor that serves multiple purposes due to the diverse configurations Avalue offers. It could be the 2nd display of POS terminals Rity 15”, but also as an independent touch monitor that could be used for interactive menu, customer registration, digital signage, conference system and many others in retail or hospitability scenarios |
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First Sino-Korean Youth Innovation Contest Takes Place in China (2016.06.27)
Between June 24-25, the First Sino-Korean Youth Innovation and Entrepreneurship Contest and Sino-Korean Cultural Festival took place in Chengdu Hi-tech Zone of China .
The District is western China's first National Innovation Demonstration Zone, and also the location selected for the Sino-Korean Innovation and Entrepreneurship Park |
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Lowest Power, Cost-Effective PIC32 Family (2016.06.27)
Microchip Technology announced the company’s lowest power and most cost-effective family of 32-bit PIC32 microcontrollers (MCUs). The Microchip PIC32MM family bridges the gap between the company’s popular PIC24F XLP and PIC32MX families |
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China SMIC Acquires LFoundry to Step into Global Automotive Electronics Market (2016.06.26)
Semiconductor Manufacturing International Corporation (SMIC) jointly announces with LFoundry Europe GmbH (LFE) and Marsica Innovation S.p.A. (MI), the signing of an agreement on June 24, 2016 to purchase a 70% stake of LFoundry for a consideration of 49 million EUR |
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Acer to Invest in Starbreeze through Two-year Convertible Bond (2016.06.26)
TAIPEI, Taiwan – Acer announces its intent to acquire Starbreeze AB’s (First North: STAR) convertible bonds through a private placement transaction. Starbreeze and Acer have reached a term sheet whereby Starbreeze will issue US$9 million (SEK 74 |
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Acer and Starbreeze Boards Approve Definitive Agreement to form Joint Venture for StarVR (2016.06.26)
TAIPEI, Taiwan- Acer and Starbreeze AB announced today that their respective Board of Directors have approved the establishment of a joint venture for design, manufacturing, promotion, marketing and sales of the StarVR Virtual Reality (VR) Head-Mounted Display (HMD) as previously announced May 15th, 2016 upon signing the letter of intent |
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Taiwan Hosts VR/AR Gaming Technology Summit to Discuss the Latest Trends (2016.06.24)
TAIPEI, Taiwan - Taiwan on June 23-25 2016 will host the “Gamera VA/AR Game Development Technology Summit” and have invited over 20 professional lecturers, which include high level personnel from AUTODESK, AMD, CRYTEK, HTC, NVIDIA, RAZER, UNITY, Taiwan iStaging, and ARPLANET, to discuss the newest VR technologies and trends |
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ASE Receives 2016 Asia Responsible Entrepreneurship Award (2016.06.24)
Advanced Semiconductor Engineering, Inc. (ASE) today announced it has received the 2016 Asia Responsible Entrepreneurship Award (AREA) in the category of “Social Empowerment” for its ASE30 Environmental Conservation Fund (ECF) |
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256M High-Speed CMOS SDRAMs with 86-Pin TSOP II Package (2016.06.24)
Alliance Memory today extended its offering of 256M high-speed CMOS synchronous DRAMs (SDRAM) with two new x32 devices in the 86-pin 400-mil plastic TSOP II package.
Internally configured as four banks of 8M word x 32 bits, the high-density AS4C8M32S-6TIN and AS4C8M32S-7TCN provide reliable drop-in |
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SMIC Commences Successful Mass Production of Qualcomm Snapdragon 425 Processor (2016.06.23)
Semiconductor Manufacturing International Corporation (SMIC) announced that the Snapdragon 425 processor and MDM9x07 has passed customer qualification and begun mass production in Beijing, after the successful technology transfer from SMIC's Shanghai 12-inch fab to SMIC's majority owned joint venture fab in Beijing |
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Power Transistor Sales Expected to Stabilize and Begin a Modest Recovery in 2016 (2016.06.23)
After dropping 7% in 2015 to $12.3 billion, power transistor sales are expected to stabilize and begin a modest recovery in 2016, growing by a little over 1% to $12.4 billion, according to the latest edition of IC Insights’ annual O-S-D Report |
IEEE1394 is a common interface standard that allows interconnected communication between computers and peripheral equipment. So rapidly the efficiency of the transmission speed, it is often applied in connection high density of signal transmission, the transmission quantity of peripheral devices.