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CTIMES / Electronic Science and Technology
Science and Technology
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About the Bus specifications

Overall, the number of times the Bus specification standard is rising between mainframe computers and peripherals, data transfer speed, capacity and quality of the application process. Let's Introduction to several important bus application specifications.
100V Micropower Voltage Monitors Provide 1.4% Measurement Accuracy for High Voltage Designs (2015.03.30)
Linear Technology Corporation introduces the LTC2965 and LTC2966, 3.5V to 100V, single and dual channel voltage monitors that draw only 6µA of quiescent current. Alternative voltage monitoring solutions typically call for a low power comparator
ADLINK Encourages Retails to use Industrial Mobile PC (2015.03.27)
TAIPEI, Taiwan — ADLINK’s display and computing product segment is committed to offering rugged industrial and mobile product solutions, together with mobile operating systems. Patrick Chiang, the company’s Director at the Handheld Product Center, encouraged retail businesses to use their industrial mobile computers with the following reasons
Samsung Still Secures 50% Market Share in Mobile DRAM (2015.03.27)
According to MIC, a Taipei-based ICT research institute, Samsung has expanded rapidly and has obtained the leading position in the global DRAM market by securing nearly 40% market share. Kevin Tu, industry analyst with MIC, said that Mobile DRAM is now the area of focus in the entire DRAM industry
Smart Power Switch Replaces Discrete Units in Automotive (2015.03.27)
Texas Instruments (TI) introduced the industry's first smart, high-side power switch with programmable current limit. As automotive systems become more complex, the various loads within the system can each require different profiles during operation
Synchronous Step-Down LED Driver Delivers up to 40A of LED Current (2015.03.27)
Linear Technology announces the LT3744, a synchronous step-down DC/DC converter designed to deliver constant current to drive high current LEDs. Its 3.3V to 36V input voltage range makes it ideal for a wide variety of applications, including industrial, DLP projection and architectural lighting
Micron and Intel Unveil New 3D NAND Flash Memory; Achieves 384GB TLC (2015.03.27)
Micron Technology and Intel Corporation today revealed the availability of their 3D NAND technology, the world's highest-density flash memory. Flash is the storage technology used inside the lightest laptops, fastest data centers, and nearly every cellphone, tablet and mobile device
UMC Xiamen 12-Inch Fab Holds Groundbreaking, Qualcomm President Attends (2015.03.27)
TAIPEI, Taiwan - According to Taiwan's Economic Daily News reported, the subsidiary of United Microelectronics Corporation(UMC) in Xiamen, China, held its 12-inch fab groundbreaking ceremony yesterday, Qualcomm president Derek Aberle personally attend the event
Imec Demonstrates 50GHz Ge Waveguide Electro-Absorption Modulator (2015.03.26)
At this week’s OFC 2015, nanoelectronics research center imec, its associated lab at Ghent University (Intec), and Stanford University have demonstrated a compact germanium (Ge) waveguide electro-absorption modulator (EAM) with a modulation bandwidth beyond 50GHz
The World’s First and Only Mini-ITX Sized X99 Motherboard (2015.03.26)
ASRock’s research and development team has worked out a way to defy logics, and have built an incredibly small mini-ITX form factor motherboard with Intel X99 chipset’s extremely huge performance. Hence the world’s first and only mini-ITX X99 chipset motherboard – ASRock X99E-ITX/ac is born! Regardless of its tiny size, X99E-ITX/ac is built around an X99 chipset and an X Series OC Socket
Intel Unveils Next-Gen Industrial Solutions System Consolidation Series (2015.03.26)
Intel today announced the next generation of the Intel Industrial Solutions System Consolidation Series, offering OEMs, machine builders and system integrators an expanded set of software configurations to simplify the development of industrial solutions using 4th generation Intel Core vPro processor-based platforms
Hon Hai and SK C&C Signes A Global IT services collaboration Agreement (2015.03.26)
TAIPEI, Taiwan - Hon Hai / Foxconn Technology Group today announced the signing of a strategic cooperation agreement with the Korean company SK C&C, the two sides will jointly manage the joint venture company, to expand IT services in China
HTC to Feature Wireless Charging in The Next Flagship Model (2015.03.26)
TAIPEI, Taiwan — In response to its rival Samsung’s Galaxy S6 and S6 Edge have featured the wireless charging function, Taiwanese handset maker HTC forecast that soonest they will feature the same function in its next flagship model
HGST Helium-Filled HDDs Achieve Milestone in Field Reliability of 2.5 Million Hours (2015.03.26)
HGST, a Western Digital company announced it has achieved a new milestone in reliability as the only manufacturer with drives field-proven and rated for two and a half (2.5) million hours mean time between failure (MTBF). With strong market acceptance from the largest cloud service providers
QuickLogic Adds New Smartphone and Wearable Algorithms to Its SenseMe Software Library (2015.03.26)
QuickLogic Corporation announced the addition of two new algorithms and an expanded algorithm to its rapidly growing SenseMe Sensor Algorithm Library. This library represents an exceptional set of algorithms designed to support QuickLogic's ArcticLink 3 S2 ultra-low power sensor hub silicon platform which enables rapid development of advanced transportation
Integrated IO-Link Temperature Sensor Lowers Cost and Power (2015.03.26)
Designers can save power, cost, and space with the MAXREFDES42# IO-Link temperature sensor reference design (RD) from Maxim Integrated Products, Inc. The new MAXREFDES42# IO-Link resistance temperature detector (RTD) joins the company's portfolio of other IO-Link reference designs for industrial control and automation
SUNIX DevicePort Solution Supports Banking Application (2015.03.26)
SUNIX announces DevicePort (Advanced mode) that support banking industry applications. As the banking industry needs better service quality and enhances client's experience, there are more and more banks are exploring the future IT structure to speed up some complicated steps
Optoelectronics, Sensors, Actuators, and Discrete Semiconductors Increases 9% in 2014 (2015.03.26)
Following two lethargic years of low growth and some setbacks, worldwide sales of optoelectronics, sensors, actuators, and discrete semiconductors regained strength in 2014 and collectively increased 9% to reach an all-time high of $63
New CXA2 LED Arrays Enable System Cost Savings of up to 60 Percent (2015.03.26)
Cree, Inc. introduces a new addition to its industry leading CXA LED array family, CXA2 LED arrays, delivering up to 33 percent higher efficacy in the same form factors. Utilizing elements of the Cree SC5 Technology Platform, this improvement in lumen density enables better performance and radically reduces system size and cost
Broadcom Launches First HD Satellite Set-top Box SoC for China (2015.03.25)
Broadcom Corporation announced a new high definition (HD) set-top box (STB) system-on-chip (SoC) for China's free-to-air (FTA) satellite market. As the momentum to deploy HD programming in China increases, Broadcom's BCM7228 chip enables satellite TV operators to roll out more advanced services and additional HD satellite broadcast transmissions through the integration of Audio Video Coding Standard (AVS+) decompression
MOST150 Enable Cost-Effective Smart Antenna Module Coaxial Connectivity (2015.03.25)
Microchip Technology announced that the MOST® Cooperation released its MOST150 technology coaxial physical layer specification. This new industry-standard specification enables Microchip to support smart antenna module connectivity to in-vehicle MOST150 advanced driver assistance system (ADAS) and infotainment networks, via its OS81118AF Intelligent Network Interface Controller (INIC) with integrated coax transceiver

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