 |
Inventec Eyes on Handheld and Servers; India Factory to Activate in Q3 (2015.03.25)
TAIPEI, Taiwan － Inventec yesterday at a corporate presentation announced that smart handheld devices and servers will be Inventec’s main products this year. Currently the growth ratio for handheld devices is already in the double digits, and it will continue to increase this year |
|
GUC Relocates North America with Good Business Shape (2015.03.25)
HSIHCHU, Taiwa - Global Unichip Corp. (GUC) today relocated its North American Office to 2851 Junction Ave. Suite 101, San Jose, California.
The new office accommodates a growing engineering staff and expanded technical capabilities demanded by a robust US market |
 |
Industry's First Online Classroom for Analog Design (2015.03.24)
Texas Instruments (TI) unveiled TI Precision Labs, the electronics industry's first comprehensive online classroom for analog engineers. The on-demand courses pair theory and applied lab exercises to deepen the technical expertise of experienced engineers and accelerate the development of those early in their careers |
|
Pepper the Robot to Bring Forth a Craze in AI and App Development (2015.03.24)
Harrison Po, consultant of Topology, a division of TrendForce, said SoftBank’s Pepper has opened another window of opportunity in the market for smart service robots. In the future, the market size of this kind of robots will grow with new and diverse applications |
|
Industry's Lowest Power EDC PHY Delivers 30% Power Reduction to Enterprise and Carrier Systems (2015.03.24)
Broadcom Corporation announced the industry's first 28 nanometer (nm) electronic dispersion compensation (EDC) physical layer transceiver (PHY) with support for long reach multimode (LRM). This latest addition to Broadcom's portfolio of 1/10/40GbE physical layer devices delivers significant power savings while boosting performance |
|
NARlabs Launches the World’s First Multi-sensor Integrated MCU (2015.03.24)
TAIPEI, Taiwan — The National Applied Research Laboratories (NARLabs) lauched the world’s first multi-sensor integrated single-chip microcomputer (MCU) technology on March 24, the idea is combining micro-mechanism structure and IC chips that allows different kinds of sensors can be embedded along with processors, and communication circuits altogether in one chip |
|
Immersing the Charm of Dechnology at Songshan Cultural and Creative Park (2015.03.24)
TAIPEI, Taiwan — “Dechnology” is a new word, which is a combination of design and technology. The annual exhibition “Discovering Technology Treasures 2015” that is arranged by the Ministry of Economic Affairs (MOEA) and presented by 19 local research firms will be held at Songshan Cultural and Creative Park on March 27 to April 22, aiming to demonstrate the charm of dechnology |
|
CAN Flexible Data-Rate Transceiver Meets and Exceeds Global Automotive Requirements (2015.03.24)
Microchip Technology announced a new family of CAN FD (Flexible Data-Rate) transceivers, the MCP2561/2FD. As an interface between a CAN (Controller Area Network) protocol controller and the physical two-wire CAN bus, these transceivers can serve both the CAN and CAN FD protocols |
|
World’s Smallest Digital STB Tuner ICs with Integrated Loop-Through Technology (2015.03.24)
Silicon Labs introduced a new family of high-performance digital set-top box (STB) tuner ICs designed to reduce the cost, complexity and power consumption of cable, terrestrial, hybrid terrestrial/satellite and IP-based STB products |
|
Hon Hai, Tencent and Harmony Car Team Up for Smart EVs (2015.03.23)
TAIPEI, Taiwan － Hon Hai / Foxconn Technology Group today announced that signed a "strategic cooperation framework agreement" with Tencent and Harmony car to cooperate on the development of internet and smart Electric vehicles in Zhengzhou City, China |
|
Peter Chou to Head HTC’s Future Development Lab (2015.03.23)
TAIPEI, Taiwan — Taiwanese handset maker HTC announced executive personnel changes on March 20, former chief executive officer Peter Chou, who had been in the position for more than a decade, is now to head HTC’s Future Development Lab, while Chairperson and Co-Founder Cher Wang as its new Chief Executive Officer, the company said in a statement |
|
5GHz PA Extends Range and Reduces Costs of 11ac (2015.03.23)
Microchip Technology announced its new SST11CP22 5 GHz power amplifier module (PAM) for the IEEE 802.11ac ultra high data rate Wi-Fi standard. This PAM delivers 19 dBm linear output power at 1.8% dynamic EVM (Error Vector Magnitude) with MCS9 80 MHz bandwidth modulation |
|
100V Flyback Controller Now Offered in Military -55°C to 150°C MP Grade (2015.03.23)
Linear Technology Corporation announces a new military MP grade version of the LT3748, a high input voltage isolated flyback DC/DC controller. This device simplifies the design of an isolated DC/DC converter by not requiring an opto-isolator, third winding or signal transformer for feedback since the output voltage is sensed from the primary-side flyback signal |
|
Enterprise IT Spending in Southeast Asia to Reach $62 Billion by 2018 (2015.03.23)
According to forecasts from Gartner, by 2018, enterprise IT spending in Southeast Asia will total $62 billion. The Southeast Asia region comprises 11 countries of which Singapore, Malaysia, Indonesia and Thailand spend the most on IT and account for roughly 80 percent of IT spend in the region |
|
Taiwan Invents Light-power Harvesting Technology for IoT (2015.03.23)
TAIPEI, Taiwan － Taiwanese national research center, National Nano Device Laboratories (NDL) has researched and developed an 3D Integrated light harvesting technology that can be applied to Internet of Things chips. Chips that can capture light energy can be integrated into IoT chips using a 3D stacking method, which will enable chips to generate power using ambient light |
|
Taiwanese Firms Place High Hopes on Win 10 (2015.03.20)
TAIPEI, Taiwan — According to a reliable source that the latest operating system (OS) from Microsoft, Windows 10 will be launched earlier than expectations, which will surely be all the rage expecially in changing PC. Acer, ASUS, and Quanta, etc, these Taiwanese firms place high hopes on Windows 10 |
|
Acer Debuts Industry’s Fastest 15.6-inch Commercial Chromebook (2015.03.20)
Acer America rolled out the fastest commercial model in the industry – the Acer C910 Chromebook with a 5th Generation Intel Core i5 processor. The Acer C910 Chromebook is part of Acer’s commercial Chromebook line and was designed for education and business customers who need extra screen real estate along with outstanding Chrome performance and a durable design |
|
Software Development Kit for SmartMesh IP (2015.03.20)
Linear Technology’s SmartMesh IP wireless sensor networking products now provide the ability to program industrial Internet of Things (IoT) applications directly on the embedded ARM Cortex-M3, running Micrium’s µC/OS-II real-time operating system |
|
Direct Bonding is No Longer Limited to High-End Products (2015.03.20)
Accroding to IHS, the application of direct bonding is no longer limited to high-end products. Direct bonding is now applied to mid- to-low cost smartphones, and the yield rate for smartphones has reached a relatively high level, resulting in a drop in extra costs |
|
Global Devices Shipments to Grow 2.8% in 2015 (2015.03.20)
Worldwide combined shipments of devices (PCs, tablets, ultramobiles and mobile phones) are estimated to reach 2.5 billion units in 2015, an increase of 2.8 percent over 2014 according to Gartner, Inc. In spending terms, the global computing devices market (PCs and ultramobiles) is on pace to reach $226 billion, a 7 |
