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Xilinx, BEEcube Announce Scalable Prototyping Platform for 5G MIMO Systems (2015.02.26)
Xilinx and BEEcube today announced a highly scalable prototyping platform for 5G massive MIMO antenna systems. The new MegaBEE prototyping platform supports up to 256x256 antennas and provides all the elements necessary to put a massive MIMO system on the air within LTE bands and without external hardware |
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TimeProvider 5000 System Supports Phase Synchronization of LTE Advanced and Small Cell (2015.02.26)
Microsemi Corporation announced its TimeProvider 5000 Software Release 2.2, adding ITU-T G.8275.1 phase synchronization profile support with a software upgrade and license key. The new software release now supports Synchronous Ethernet and the IEEE 1588 Precision Time Protocol (PTP) phase profile |
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New SimpleLink Ultra-Low Power Wireless Platform (2015.02.26)
Texas Instruments (TI) announced the new SimpleLink ultra-low power wireless microcontroller (MCU) platform that helps customers go battery-less with energy harvesting or enjoy always-on, coin cell-powered operation for multiple years |
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Automotive Grade ARM Cortex-M0+-based MCUs With Capacitive Touch Hardware Support (2015.02.25)
Atmel Corporation announced the company has launched its next-generation family of automotive-qualified ARM Cortex-M0+-based MCUs with an integrated peripheral touch controller (PTC) for capacitive touch applications. The new SAM DA1 is the first series in this Atmel |SMART MCU automotive-qualified product family, operating at a maximum frequency of 48MHz and reaching a 2 |
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Renesas Develops 28nm Embedded Flash Memory for Faster Automotive MCUs (2015.02.25)
Renesas Electronics today announced that it has developed a new flash memory technology that achieves even faster read and rewrite speeds. The new technology is designed for on-chip flash memory microcontrollers (MCUs) using a 28-nanometer (nm) embedded Flash (eFlash) process technology |
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Greater Flexibility in TV Panel Price Dealings as Chinese New Year’s Production Cut (2015.02.25)
The newest panel price report from WitsView, a division of TrendForce, indicates that Chinese New Year had some effects on panel module production and reduced pressures on the supply side in February. However, the extent of positive support on panel prices driven by the holiday period has been quite limited |
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Expert Forecasts DDR4 Kicks off DDR3 in 2015 (2015.02.25)
TAIPEI, Taiwan — Wu Jin-rong, General Manager of Explore Microelectronics, forecast that DDR4 is gradually replacing DDR3 to become the mainstream standard of Dynamic Random Access Memory (DRAM). He even stated that the shipment of DDR4 will surpass DDR3 by the third quarter of 2016 |
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New MCUs Feature Flexible Interconnections of Advanced Analog and Digital Integration (2015.02.25)
Microchip Technology announced from the Embedded World conference in Germany a new family of 8-bit PIC® Microcontrollers (MCUs) with the PIC16(L)F1769 family. This family is the first PIC MCU to offer up to two independent closed loop channels |
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Intel Tops All Chip Firms in R&D Spending, TSMC Ranks Fifth (2015.02.25)
According to IC Insights’ report, Intel's R&D expenditures were 2x greater than nearest competitor; Qualcomm with largest percentage increase of 62%, ranked second; TSMC’s 15% R&D spending increase in 2014, ranked fifth; Nvidia with highest R&D/sales ratio |
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Digital UV Sensor for Mobile, Wearable, and IoT Applications (2015.02.25)
STMicroelectronics (STM) has expanded its portfolio of environmental sensors with the introduction of the UVIS25, the world's first sensor to provide a direct digital output of the Ultraviolet Index (UVI), the international measurement of the strength of ultraviolet (UV) radiation, primarily from the sun, at a given place and time |
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Silicon Labs Rolls out Next-Generation 8-Bit Microcontrollers for the IoT (2015.02.25)
Silicon Labs introduced the company’s next-generation 8-bit MCU portfolio designed for today’s ultra-low-power, small-footprint IoT applications. Silicon Labs’ new EFM8 MCU family includes three lines of highly integrated, peripheral-rich MCUs optimized for exceptional price/performance value, ultra-low-power capacitive touch control and streamlined USB connectivity |
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Foxlink May to Acquire Japanese Automation Technology Provider in 2015 (2015.02.24)
TAIPEI, Taiwan － According to Taiwan media reported, Guo Tai-Qiang, chairman of Foxlink, a Taiwanese connector firm, said that Foxlink might to pursuit the acquisition of Japanese automation companies this year, to improve its ability of automation and precision mold for the robotics market |
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ASUSTOR Launches Surveillance Center 2.2 (2015.02.24)
TAIPEI, Taiwan — ASUSTOR, an innovator and provider of network storage solutions, has announced that Surveillance Center has officially upgraded to version 2.2. All ASUSTOR NAS users with surveillance needs are welcome to download and experience this new version firsthand |
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Dayeh University Provides 3D Printing Service for Teachers and Students (2015.02.24)
TAIPEI, Taiwan — Dayeh University Computer Center provides 3D printing service for teachers and students from this new semester, which allows them to print out their designs as toy figures.
Zhgn Gu-yao, Director of Dayeh University Computer Center, said that there are lots of 3D printing applications that can be applied into Industry, Manufacturing, and Medical Services |
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HOLTEK New HT45F56 Vibration Detection MCU (2015.02.24)
Holtek wishes to announce the release of its new cost-effective vibration detection MCU, the HT45F56. The device includes a fully integrated 8MHz RC oscillator for MCU system operation.
It can adjust the vibration sensitivity by adjusting the internal OPA gain or setting the DAC comparator threshold value, and can also program the output signal timing of its detected state according to different product requirements |
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Acer Unveils Two New Cloud Application Solutions for the Era of C&C (2015.02.24)
TAIPEI, Taiwan － Acer today unveils two new cloud application solutions: abPBX plus series for enterprises and aBeing series for individuals and other working environments. In addition, a New New Acer shall combine hardware, application software, and devices with a focus on providing people-centric services to embrace the era of a new C&C (Computing and Communication) |
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32-Bit Automotive MCUs Specialized for Instrument Clusters in Entry Level (2015.02.24)
Renesas Electronics announced the RH850/D1x Series of 32-bit automotive microcontrollers (MCUs) specialized for instrument clusters that deliver easy-to-access information to support a safer and rich driving experience.
The connected car is generating amount of information from the automotive networks, cameras and multimedia systems |
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Imec, Murata, and Huawei Introduce Breakthrough Solution for TX-to-RX Isolation for Mobile Phones (2015.02.24)
imec, Murata and Huawei will present a stand-alone multiband electrical-balance duplexer in 0.18µm SOI CMOS at MWC2015. This type of duplexer is a promising alternative to the fixed frequency surface-acoustic wave (SAW) filters implemented in mobile phones providing transmit-to-receive (TX-to-RX) isolation |
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Blue Gecko Modules, SoCs, Development Kit and Software (2015.02.24)
Silicon Labs unveiled a complete Bluetooth Smart solutions portfolio designed to help developers minimize the energy consumption, cost and complexity of wireless IoT designs. Silicon Labs’ recent acquisition of Bluegiga, a leading supplier of wireless modules and software, accelerates the company’s ability to deliver comprehensive Bluetooth Smart solutions |
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Semiconductor Unit Shipments to Exceed One Trillion Devices in 2017 (2015.02.19)
According to IC Insights’ forecast that total semiconductor unit shipments (integrated circuits and opto-sensor-discrete, or O-S-D, devices) are forecast to continue their upward march through the current cyclical period and top one trillion units for the first time in 2017 |
DOS-popular, accompanied from IBM personal PC's fame, however, to trace its origins from the earlier of the microprocessor era to begin with.