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Lian Li Partners with Razer for Special Edition PC-O11 Dynamic Designed by Razer Chassis (2018.06.07)
TAIPEI, Taiwan – Lian Li Industrial Co. Ltd., a manufacturer of aluminum chassis for enthusiasts, custom OEM/ODM case solutions and case accessories in partnership with Razer, announced the launch of a special edition PC-011 Dynamic chassis |
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MediaTek: We are in the Leading Position in 5G (2018.06.06)
TAIPEI, Taiwan - MediaTek, Inc. on June 5 announced that they would host their “Annual COMPUTEX Media Event,” with themes focusing on 5G and AI, and they also announced that they will release 5G products in 2019.
MediaTek CEO Rick Tsai shared the company’s strategies for 5G and AI and also emphasized their ability to bring about the top experience for users in terms of 5G and AI while bringing these technologies into public life |
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ASUS Announces New ZenBook and VivoBook at Computex 2018 (2018.06.05)
TAIPEI, Taiwan — ASUS Chairman Jonney Shih today hosted a press event at Computex 2018, unveiling all-new products, including ZenBook Pro 15 and ZenBook Pro 14 with the revolutionary ScreenPad input device, the triple-award-winning ZenBook S, a full lineup of VivoBook notebooks, and the VivoWatch BP wearable blood-pressure monitor |
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Acer Chromebook 11 Wins Gold at Computex d&i Awards 2018 (2018.06.05)
TAIPEI, Taiwan – Acer announced today that it has captured the d&i gold award at Computex 2018 for exceptional design, earning a total of four d&i awards. Acer also earned three Computex Best Choice Awards.
The awards winning products including Acer Chromebook 11(Winner of the d&i gold award) |
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Three New Class-D Amplifiers Solve Smart-Home Audio Design Challenges (2018.06.04)
Texas Instruments (TI) introduced three new digital-input Class-D audio amplifiers that enable engineers to deliver high-resolution audio in more smart-home and voice-enabled applications.
By combining first-of-its-kind integration, real-time protection and new modulation schemes, TI's new audio devices allow designers to reduce board space and overall bill of material (BOM) cost |
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Toshiba Releases Interface Bridge Devices for Automotive Infotainment Applications (2018.06.04)
Toshiba Electronic Devices & Storage Corporation announces a new range of video interface bridge devices intended for modern automotive In-Vehicle Infotainment (IVI) applications.
Increasingly, Systems-on-Chip (SoCs) from smartphones and tablets have been used in automotive applications as IVI systems became more sophisticated, requiring more functionality and greater performance |
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Airgain Announces Development of 802.11ax Technology at COMPUTEX 2018 (2018.06.04)
TAIPEI, Taiwan - Airgain, Inc. today announced it is actively engaged in the development of IEEE 802.11ax Over-the-Air (OTA) optimized reference designs for multiple tier 1 and tier 2 vendors of 802.11ax chipsets. It also confirmed it is in the performance verification phase of multiple commercial programs with leading service providers of 802 |
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Supermicro Announces Cost-Saving Green Computing at COMPUTEX 2018 (2018.06.04)
TAIPEI, Taiwan — Super Micro Computer today announced its new green computing with Resource Saving datacenter and cloud solutions, including SuperBlade, BigTwin and all-flash NVMe composable storage systems at Computex Taipei 2018 |
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NVIDIA, Taiwan’s MOST Unveil Collaboration to Supercharge AI Efforts (2018.06.04)
TAIPEI, Taiwan - NVIDIA and Taiwan’s Ministry of Science and Technology today announced an extensive collaboration that will advance Taiwan’s artificial intelligence capabilities.
Announced at the start of Computex 2018, the partnership will extend over the next decade to build up local deep learning and associated AI technologies |
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Taiwan Mobile, Asus, and Quanta Team Up to Collectively Form National AI Cloud Platform (2018.06.04)
TAIPEI, Taiwan - Taiwan’s Ministry of Science and Technology (MOST) announced the development of a national AI cloud platform in Taiwan by a collaborative team comprised of Taiwan Mobile, Asus, and Quanta. The platform is expected to be completed in December 2018 |
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Increase System Performance in Closed-loop Control Applications with New PIC and AVR MCUs (2018.06.01)
From pool pumps to air handling units, closed-loop control is one of the most fundamental tasks performed by embedded systems. Advancements in the architecture of PIC and AVR 8-bit microcontrollers (MCUs) have optimized the devices for implementing closed-loop control, enabling systems to offload the Central Processing Unit (CPU) to manage more tasks and save power |
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The Automotive IC Market to Raise 18.5% YoY This Year, IC Insights Says (2018.06.01)
Consumer demand and government mandates for electronic systems that improve vehicle performance, that add comfort and convenience, and that warn, detect, and take corrective measures to keep drivers safe and alert are being added to new cars each year |
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Toshiba Memory Corporation and Synopsys Collaborate to Accelerate 3D Flash Memory Verification (2018.05.31)
Synopsys announced that it has collaborated with Toshiba Memory Corporation to accelerate the verification of Toshiba Memory Corporation's BiCS FLASH vertically stacked three-dimensional (3D) flash memory. By working closely with Toshiba Memory Corporation, Synopsys introduced innovative simulation algorithms in its FineSim Pro FastSPICE tool to address the increased design complexity of 3D NAND Flash memory |
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Total Production Volume of Smartphones up by 5.3% YoY in 1Q18, Says TrendForce (2018.05.31)
DRAMeXchange, a division of TrendForce, reports that the smartphone market has remained in the low season since 4Q17. Smartphone vendors did not start to stock up on components until the end of February 2018, when the end demand began to bounce back |
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VIA Unveils Edge AI System Line for Automotive, Enterprise IoT, and Smart City Applications (2018.05.31)
TAIPEI, Taiwan - VIA Technologies, Inc., today showcased its family of high-performance Edge AI systems for the Automotive, Enterprise IoT, and Smart City segments at its global headquarters and highlighted its core facial and object recognition |
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Acer Thrills with Immersive Gaming Experiences at Computex 2018 (2018.05.31)
TAIPEI, Taiwan - Acer is providing visitors with an immersive gaming experience at Computex 2018 in Taipei by showcasing its full line of gaming PCs and gadgets, as well as bringing in celebrity gamers to get in on the action with Acer gaming devices |
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EEC Expands Power Source Lines with Feature-Rich 6300 and 6500 Series (2018.05.31)
Extech Electronics Co. (EEC) has re-energized its line of premium power sources with the introduction of the 6300 and 6500 series. The 6300 series is a tri-phase power source capable of outputting up to 300kVA, while the new 6500 series is a single-phase power source that can produce up to 80kVA |
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Price Decline to Drive the Adoption Rate of SSD/PCIe SSD to over 50% this year, Says TrendForce (2018.05.30)
DRAMeXchange, a division of TrendForce, reports that the oversupply in the NAND Flash market has resulted in price decline of Client SSD, which in turn drives the demand. DRAMeXchange expects that the SSD adoption rate in the notebook market will exceed 50% this year |
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BIOSTAR to Showcase Gaming, Crypto Mining, Smart Home and IPC Solutions at COMPUTEX 2018 (2018.05.30)
TAIPEI, Taiwan – BIOSTAR is to bring its latest gaming, crypto mining, smart home, and IPC solutions to COMPUTEX 2018. This includes the latest flagship 3rd generation RACING series featuring the Intel 300 chipset motherboards for the 8th generation Coffee Lake processors and AMD AM4 X470 platform |
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PIDA: Taiwan’s Epitaxy Wafer Grain Yield Declined 2% in 2017 (2018.05.30)
TAIPEI, Taiwan - Taiwan’s Photonics Industry & Technology Development Association (PIDA) yesterday pointed out that the epitaxy wafer grain yield declined by 2% in 2017, reaching NT$33.8 billion. Nevertheless, the overall profitability of the industry has improved significantly |
In October 1994, the network creator Tim Berner-Lee, at the Massachusetts Institute of technology laboratory for computer science, established the Joint Association of the Internet, which is now the World Wide Web Consortium.