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Würth Elektronik eiSos Board-to-board Connectors (2018.04.10)
Würth Elektronik eiSos has expanded its portfolio of board-to-board connectors. Under the designation WR-BTB, the manufacturer of electronic and electromechanical components offers a broad spectrum of plugs and receptacles. Examples for the new SMT assembly connectors are plugs and receptacles with collars and chamfers in 1 |
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Global Solar PV Demand Is Forecast to Reach Record 113 GW in 2018, IHS Markit Says (2018.04.10)
Global solar photovoltaic (PV) demand is forecast to hit another annual record of 113 gigawatts in 2018, propelled by strong demand anticipated in China. According to business information provider IHS Markit, burgeoning demand from the Chinese market is expected to persevere on the back of continuing policy support |
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MediaTek Announces World’s First Complete 56G PAM4 SerDes, Silicon-Proven on 7nm for ASIC services (2018.04.10)
HSINCHU, Taiwan –MediaTek announced a new addition to its ASIC lineup with a 56G SerDes IP chip available with silicon-proven 7nm FinFET process technology. MediaTek’s 56G SerDes is a high-performance DSP-based solution with PAM4 signaling |
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IDC: Global Tablet Manufacturing to Continue to Slide in 2018 (2018.04.10)
According to IDC’s newest tablet assembly survey research report, in the fourth quarter of 2017, the global tablet manufacturing industry was influenced by favorable factors, such as the high market season, and the total global shipments experienced a 4 |
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Gartner Says Global IT Spending to Grow 6.2 Percent in 2018 (2018.04.09)
Worldwide IT spending is projected to total $3.7 trillion in 2018, an increase of 6.2 percent from 2017, according to the latest forecast by Gartner, Inc.
"Although global IT spending is forecast to grow 6.2 percent this year, the declining U |
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New Conductive and Hybrid Conductive Aluminum Polymer Capacitors from Vishay Intertechnology (2018.04.09)
Vishay Intertechnology introduced new conductive (184 CPNS, 185 CPNZ, and 186 CPNT series) and hybrid conductive (182 CPHZ and 183 CPHT series) aluminum polymer capacitors in a variety of case sizes ranging from 4 mm by 4 mm by 5 |
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Toshiba Releases Medium-voltage Photorelay in Small 4-pin SO6 Package for Factory Automation (2018.04.09)
Toshiba Electronic Devices & Storage Corporation has released “TLP176AM,” a new photorelay in a small 4-pin SO6 package, for factory automation and other industrial applications. TLP176AM has a rated on-state output terminal voltage of 60V and a rated on-state current of 0 |
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ASUS Breaks Record with 16 Wins at the 2018 Red Dot Design Awards (2018.04.09)
ASUS today announced wins of 16 Red Dot Design Awards, setting a new company record for number of achievements in a single Red Dot Awards ceremony. The awards highlight the ASUS commitment to providing incredible customer experiences through innovation and exceptional product design |
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SEMI Reports 2017 Global Semiconductor Equipment Sales of $56.6 Billion (2018.04.09)
SEMI reported that worldwide sales of semiconductor manufacturing equipment totaled $56.6 billion in 2017, a year-over-year increase of 37 percent from 2016 sales of $41.24 billion. The data are available in the Worldwide Semiconductor Equipment Market Statistics (WWSEMS) Report, now available from SEMI |
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Chunghwa Telecom Upgrades to VCAS Ultra from Verimatrix to Secure New Premium UHD/4K Services (2018.04.09)
Verimatrix announced today that its long-standing customer Chunghwa Telecom has upgraded to VCAS Ultra, the latest generation of the Verimatrix Video Content Authority System (VCAS). As Chunghwa Telecom expands its multimedia on demand (MoD) offering to include UHD/4K streaming, it has deployed VCAS Ultra to secure new delivery models and support next-generation services and technology |
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Global Server Shipment Value to Reach Over USD 50 Billion in 2018: MIC (2018.04.03)
Global server shipment value increased by 1.5% year-on-year to USD 49.4 billion in 2017 and is estimated to reach about USD 50.7 billion in 2018, according to Taipei-based and government-backed IT research institute MIC (Market Intelligence & Consulting Institute) " |
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Fraunhofer Institute Presents First Wearable OLED Bracelet at Wearables Europe 2018 (2018.04.03)
Fraunhofer Institute presents first wearable OLED bracelet at Wearables Europe 2018, from April 11th to 12th in Berlin, Germany.
Since 2016 partners within the European joint project PI-SCALE are working on the introduction of a joint pilot line in order to give access for the manufacturing of flexible OLED for SMEs in Europe |
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Acer Announces Nitro 5 Gaming Laptop with the Latest Intel Core i+ Processors (2018.04.03)
TAIPEI, Taiwan - Acer today unveiled the latest addition to its Nitro 5 gaming series, lauded for its refined styling and outstanding performance targeting casual gamers. Powered by up to the latest 8th Generation Intel Core i7 and Intel Core i7+ processors, the newest 15-inch Nitro 5 offers improved speed and threading efficiency to gives users the ultimate thrill as they battle with friends online |
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China Now World’s Largest Consumer of Semiconductor Packaging Equipment and Materials (2018.04.03)
Fueled by heavy government investment, IC packaging and testing in China generated $29 billion in revenue in 2017, making China the world’s largest consumer of packaging equipment and materials, according to SEMI’s recent China Semiconductor Packaging Industry Outlook report |
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BIOSTAR Announces Intel B360 Chipset Gaming Motherboards with RACING B360GT5S/B360GT3S (2018.04.03)
BIOSTAR announces its new mainstream gaming motherboards with the Intel B360 chipset for budget conscious gamers who still want the latest features offered by Intel 300 series, Coffee Lake platform. These include an ATX motherboard BIOSTAR RACING B360GT5S and a micro-ATX motherboard, BIOSTAR RACING B360GT3S |
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Dow Expands Jhunan CMP Technological Center to Increase Capacity of CMP in Taiwan (2018.04.03)
TAIPEI, Taiwan - Dow Electronic Materials, a business unit of DowDuPont's specialty products division, held a ribbon-cutting ceremony for its phase four expansion at its Asia Chemical-Mechanical Planarization (CMP) manufacturing and technical center in Jhunan |
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Keysight, KT Sign Memorandum of Understanding to Collaborate on 5G New Radio Technology (2018.04.03)
Keysight Technologies announced the signing of a Memorandum of Understanding (MoU) with KT Corporation (Korea Telecom) at Mobile World Congress 2018 in Barcelona to collaborate on 5G New Radio (NR) technology and advanced 4G, accelerating commercial deployment of 5G |
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TE Connectivity Recognizes Top Performing Distributors with Awards for Outstanding Achievements (2018.04.03)
TE Connectivity (TE) presented its 2017 Distributor Awards during its recent Regional Distribution Summits held in Shanghai, China; Bad Neuenahr, Germany; and Orlando, Florida, USA. The annual awards recognize TE’s highest-performing distribution partners in a specific region based on sales growth, business plan realization, customer growth and training participation |
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HOLTEK New BS45F5930 12V/900mA High Current Driver Touch MCU (2018.04.02)
Holtek announced the release of its new 12V/900mA High Current Driver Touch Flash MCU, the BS45F5930. The device is specifically designed for applications which require a 6V~12V input voltage range, a PWM output and high current driver functions |
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Shift to 5G will Not Happen in 2018, Says GlobalData (2018.04.02)
While many telecom network technology vendors are claiming that the wait for fifth generation, high-speed wireless service (5G) is finally over, the full transition to 5G will not happen in 2018, according to leading data and analytics company GlobalData |
DOS-popular, accompanied from IBM personal PC's fame, however, to trace its origins from the earlier of the microprocessor era to begin with.