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MediaTek Unveils New Helio P22 Chipset to Power Mid-Range "New Premium" Smartphones (2018.05.22)
HSINCHU, Taiwan - MediaTek today announced the launch of the Helio P22, the latest addition to the Helio family of powerful and power-efficient chips for the mid-market. With Helio P22, MediaTek continues to expand its Helio P series family that brings high-end features users demand to mid-tier devices |
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Toshiba Memory Corporation to Expand 3D Flash Memory Production Capacity (2018.05.22)
Toshiba Memory Corporation (TMC) today announced that it decided to start construction of a new state-of-the-art fab for BiCS FLASH, its proprietary 3D flash memory, in Kitakami, Iwate prefecture in July this year.
TMC has selected Kitakami City as the next location to expand its operations in September last year, and has started preparations for construction of the new fab |
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Vishay Intertechnology High Speed PIN Photodiode Offers Enhanced Sensitivity (2018.05.22)
Vishay Intertechnology broadens its optoelectronics portfolio with the introduction of a new high speed silicon PIN photodiode with enhanced sensitivity for visible light. Featuring a rectangular 4.8 mm by 2.5 mm top-view, surface-mount package with an industry-low 0 |
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AUO Announces World’s Highest Resolution Micro LED Display Technology (2018.05.22)
HSINCHU, Taiwan – AU Optronics Corp. (AUO) today introduced the world’s highest resolution and full color TFT driven micro LED display technology, offering inspiring new directions for next-generation technology development |
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Avalue Launched the SPC Series, Stainless Steel and Anti-Dirt Tablet PC (2018.05.22)
Avalue's SPC series 1533 Full Plane Tablet PC is designed exclusively for heavily polluted environments. The whole device comes with a design of water resistance, anti-dirt and easy-to-clean, making it especially suitable for meat processing industry, aquaculture, car wash, navigation, waste water treatment, farms, and biotechnology industry |
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AUO to Display Full Series of Mini LED Backlit LCDs for High-end Application (2018.05.22)
HSINCHU, Taiwan – AU Optronics Corp. (AUO) announced that the company will participate in SID’s Display Week 2018 to showcase a full range of LCD panels adopting mini LED backlight technology for gaming monitors, gaming notebook PCs and VR headsets, claiming market leadership in high-end gaming and niche applications with exceptional image quality featuring ultra high brightness and high dynamic range |
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Global Mobile DRAM Revenue Reached a New Record High in 1Q18, Says TrendForce (2018.05.21)
DRAMeXchange, a division of TrendForce, reports that smartphone brands had then spent three months adjusting their inventories before they again started to stock up on components toward the end of February 2018, when the end demand also began to bounce back |
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AAEON Receives Three COMPUTEX d&i Awards (2018.05.21)
TAIPEI, Taiwan– AAEON has been honored with three COMPUTEX d&i Awards. The coveted awards recognize groundbreaking design and innovation in the information and communication technology (ICT) field, and AAEON received its accolades for the AIOT-IP6801 and UPC-GWS01 IoT gateway devices and for the BOXER-8120AI box PC |
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Hyundai Mobis to Develop All Autonomous Driving Sensors by 2020 (2018.05.21)
Hyundai Mobis plans to use its proving ground, which opened last June in Seosan, South Chungcheong Province, as a test bed for new technologies, with the goal of becoming a leader in future car technologies. The automotive supplier announced at the proving ground that it plans to develop autonomous driving sensors, which are essential for future vehicles, by 2020, and lead the global market for autonomous driving based on its technology power |
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AUO Introduces Its New LTPS LCD Lineup for Smart Mobile Life (2018.05.21)
HSINCHU, Taiwan – AU Optronics Corp. (AUO) today announced that a comprehensive portfolio of leading-edge mobile device displays and technologies will be unveiled at SID’s Display Week 2018, the annual premier international gathering of the electronic information displays industry, in Los Angeles from May 22 to 24 |
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NTU Develops the World’s Leading Carbon Capture Materials (2018.05.21)
TAIPEI, Taiwan - A team at National Taiwan University’s (NTU) Department of Chemical Engineering has successfully developed a leading global technological innovation: “The Innovative Hollow Metal Fiber Carbon Dioxide Adsorption/Catalytic Conversion System |
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Vishay Intertechnology Snap-in Power Aluminum Capacitors Save Space, Lower Costs (2018.05.17)
Vishay Intertechnology, Inc. (NYSE: VSH) today introduced a new series of miniature snap-in power aluminum electrolytic capacitors. Ideal for power supplies, solar inverters, and industrial motor controls, the Vishay BCcomponents 259 PHM-SI series combines 30 % higher ripple current than previous-generation components with a long useful life |
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The Average Contract Prices of Enterprise SSD May Fall by 10% in 2Q18, Says TrendForce (2018.05.17)
According to the report of DRAMeXchange, a division of TrendForce, the Enterprise SSD market has been expanding in recent years driven by the development of data center, AI, big data, 5G, and edge computing. The shipments of Enterprise SSD are expected to reach 30 million units this year, up from less than 20 million units in 2016 |
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AI, IoT and Blockchain Dominate Influencer Mentions During in Q1 2018, Says GlobalData (2018.05.17)
Artificial Intelligence (AI) has emerged as the most frequently mentioned theme in discussions among the key disruptive technologies during the first quarter (Q1) of 2018 on Twitter, according to leading data and analytics company GlobalData |
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Taipei Game Show Strives to Cultivate the Asian Market (2018.05.17)
Being an important platform for game developers in Asia, Taipei Game Show (TGS) has been actively engaging in the international stage and form strategic alliances with major international game shows in recent years. Other than inviting game developers from various countries to exhibit at the Taipei Game Show |
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TrendForce: Three Major Server DRAM Suppliers Score 10.3% Revenue Growth in 1Q18 (2018.05.16)
Despite the recent adjustments of product mix by suppliers, the supply of server DRAM remained tight in 1Q18, thus resulting in high average selling prices. Consequently, the total revenue of the three major server DRAM suppliers rose by 10 |
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Solderless and direct plug-in connectors (2018.05.16)
Würth Elektronik eiSos introduces its new “REDFIT IDC SKEDD WR-WST connectors” product family: solderless, space-saving and multi-pluggable connectors for signal transmission. The electronics and electromechanical components manufacturer is using the patented SKEDD technology from its sister company Würth Elektronik ICS for this innovative product |
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Onboard WiFi, Bluetooth, and Storage Strengthen the World’s Smallest Maker Board (2018.05.16)
AAEON announces the launch of the UP Core, the world’s smallest maker board. The 56.5mm x 66mm board draws on the breakthroughs made by AAEON’s UP and UP2 boards and delivers a combination of high-performance and low-power-consumption specifications that can’t be matched by other maker boards currently on the market |
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Toshiba Releases Photorelay for Factory Automation and Other Industrial Applications (2018.05.16)
Toshiba Electronic Devices & Storage Corporation has released the new TLP3122A photorelay for factory automation and other industrial applications including building automation, security and semiconductor testing.
The new photorelay integrates MOSFET devices fabricated using the latest U-MOS IX process to reduce on-state resistance |
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EMB-2230: Pico-ITX ARM Board with 40-Pin Expansion Header for Flexibility and Versatility (2018.05.16)
The EMB-2230 brings the power and flexibility of an ARM Cortex A9 processor to the IoT devices meant to perform more demanding tasks. Designed for slim Panel PC and Tablet applications , the EMB-2230 sets itself apart with an extremely small, adaptable Pico-ITX form factor, and the inclusion of a low profile 40-Pin PCIe/GPIO expansion connector, as well as two integrated LCD touchscreen and MIPI slim FPC connectors |
