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Contract Prices of Server DRAM Modules to Rise Over 25% in Q1 (2017.01.10)
At the start of the first quarter of 2017, contract prices of server DRAM modules have already increased by over 25% on average from the same point in the prior quarter, according to the latest report by DRAMeXchange, a division of TrendForce |
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Maxim Announces Industry's First Remote Tuner Solution with Single Hardware Platform (2017.01.10)
Using the remote tuner solution from Maxim Integrated Products, Inc., designers can significantly simplify the head unit design of a vehicle and reduce cables. The MAX2175 RF to Bits tuner within the solution eliminates the need to rework the vehicle's hardware to support worldwide radio standards, allowing updates by simply changing the vehicle's software |
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iST Becomes the Asia’s First CTIA authorized MIMO OTA Lab (2017.01.10)
TAIPEI, Taiwan - iST, a Taiwanese verification and analysis services provider, announced today that its over-the-air (OTA) wireless signal testing lab in Taipei, which recently certified by CTIA (Cellular Telephone Industries Association) specific to the certification of MIMO(Multi-input Multi-output) and become the first CTIA Authorized MIMO OTA lab (CATL, CTIA authorized Test Labs) in Taiwan and even Asia |
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Over 80% 3D Printing Service Platform Patents Focus on Data Processing and Control Systems (2017.01.10)
As the 3D printing boom continues to drive the demand for 3D printable files and contract manufacturing service, MIC (Market Intelligence & Consulting Institute) recent findings show that patent deployment is highly concentrated on Data Processing and Control System technologies, which accounts for 38 |
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HOLTEK New HT66FB582 USB Full Speed Flash MCU (2017.01.10)
Holtek announced the release of a new Full Speed USB Flash MCU in the form of its A/D type HT66FB582 device. This device is a new addition to Holtek’s range of 8-bit Flash USB MCUs.
In addition to being used in general USB PC peripherals and consumer products, one special feature of the this new MCU is its large 48K×16 bits Flash Program Memory capacity in addition to an true EEPROM memory of 16K bytes |
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Düsseldorf Court of Appeal Confirms Infringement of Nichia‘s YAG Patent by Everlight (2017.01.10)
With judgment of December 22, 2016 (docket number I-15 U 31/14), the Düsseldorf Court of Appeal in Germany has confirmed the infringement of YAG Patent EP 0 936 682 (DE 697 02 929) of Nichia Corporation by Taiwanese LED manufacturer Everlight Electronics Co |
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LumaSense Introduces MCL640 Thermal Imaging Camera with Better Resolution (2017.01.10)
LumaSense Technologies, Inc. introduces the MCL640 thermal imaging camera, the next generation in LumaSense’s line of infrared thermal imagers designed specifically for industrial process control and monitoring. The MCL640 camera offers 640 x 480 resolution imaging for long wave infrared applications, producing superior images and temperature measurement (±2 °C) |
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Global Gaming PC Market to Remain Growth Engine for the PC Market in 2017 (2017.01.09)
While the global PC industry keeps declining, MIC (Market Intelligence & Consulting Institute) found that the share of global gaming PCs in branded vendors' sales have increased steadily during the period 2014-2016.
It is anticipated that gaming PCs will continue the growth trend in 2017 and account for about 5 |
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Year-End Promotions Caused Prices of LED Light Bulbs to Drop Significantly, TrendForce Reports (2017.01.09)
Since November 2016, LED light bulb vendors have lowered prices of their products for regional markets including Japan, Europe and the U.S. as part of their year-end promotions. The downtrend in prices became more noticeable at the end of the year |
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XYZprinting Showcases New Type of 3D Printer at CES 2017 (2017.01.09)
Taiwanese 3D printing solutions provider XYZprinting at CES 2017 announced completely new products including the da Vinci Nano, which is their lightest and most dexterous 3D printer; the da Vinci Junior 2.0 Mix, which can mix two colors using an external nozzle to create gradient colors; and the Nobel Superfine, which is a high precision desktop 3D printer |
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Telink Semiconductor’s RF SoC Passes ZigBee 3.0 Certification (2017.01.09)
Telink Semiconductor has announced that its ZigBee RF SoC has passed the ZigBee compliant platform tests based on the latest ZigBee stack specification using DSR Corporation’s ZBOSS 3.0 ZigBee 3.0 wireless stack, and thus can start to provide a ZigBee 3 |
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Oven Industries Features an Electronic Temperature Controller with Easy-to-use Software (2017.01.09)
The 5R7-570(A) RoHS compliant open board electronic temperature controllers are specifically designed with a proportional integral control algorithm to provide the (Peltier) at the most economical price.
The H-bridge temperature control provides a seamless transition between heating and cooling eliminating dead spots |
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Ambarella Introduces 8K SoCs for VR and Drone Cameras (2017.01.09)
Ambarella introduced the H3 System-on-Chip (SoC) for high-end drones and a new generation of video cameras, including 360-degree and virtual reality cameras. The H3 video SoC enables 8K Ultra HD H.264/AVC video at 30 frames per second, as well as multiple video streams with equivalent performance, including 360-degree cameras with dual 4KP60 sensor video capture |
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DRAMs and NAND Flash ICs to Increase by CAGR of 7.3% to $109.9 Billion in 2021 (2017.01.09)
Sales of memory ICs are expected to show the strongest growth rate among major integrated circuit market categories in 2017, including DRAMs and NAND flash ICs will increase by a compound annual growth rate (CAGR) of 7.3% to $109 |
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Faraday Extends SoC Design Services to Include Virtual Prototyping Solution (2017.01.06)
HSINCHU, Taiwan - Faraday Technology Corporation and Synopsys today announced the expansion of Faraday's design services to include a virtual prototyping solution.
Building on Faraday's SoCreative SoC development platform's success, the SoReal! Virtual Platform is now extended with SystemC models of the Faraday A380 dual-core system-on-chip (SoC), which contains high-speed interface IP modules including USB, DDR, etc |
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Socionext Introduces New Milbeaut Image Processor (2017.01.06)
Socionext today introduced the new "SC2000", a new image processing IC designed for drones and action cameras. The SC2000 is a new product from the "M10V" series, an eighth-generation version of Socionext’s Milbeaut Image Processors |
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AmTRAN Showcases 75 and 80-inch 8K TVs at CES 2017 (2017.01.06)
TAIPEI, Taiwan - Taiwanese television manufacturer AmTRAN announced that at CES 2017 they will showcase 75 and 80-inch 8K televisions along with the newest types of television support HDR technology.
AmTRAN stated that each year they participate in CES, and in addition to showcasing new products they also conduct yearly negotiations with important clients over opportunities for new orders |
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Telechips to Introduce Display Audio and 4K STB Chipset in CES 2017 (2017.01.06)
Telechips, multimedia fabless semiconductor company, will introduce Display Audio and 4K STB chipsets and solutions in CES 2017.
IVI automotive system has been rising in automotive market. Telechips will introduce automotive SoC and solution for Display Audio and AVN with ‘Intelligent Automotive’ theme in CES 2017 to keep pace with this rapid change in the automotive market trends |
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ASUS Introduces ZenFone AR, ZenFone 3 Zoom, and Gaming Products at CES 2017 (2017.01.06)
ASUS yesterday unveiled its latest products lineup at CES 2017. ASUS Chairman Jonney Shih personally introduced the ASUS ZenFone AR and ZenFone 3 Zoom smartphones at Caesars Palace in Las Vegas. ZenFone AR will be the world's first smartphone that is both Tango enabled and Daydream-ready |
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Samsung NEXT Announces $150M Fund to Support Startups in Emerging Tech (2017.01.05)
Samsung NEXT (formerly Samsung Global Innovation Center) today announced at CES the creation of the Samsung NEXT Fund, a $150 million venture capital investment fund, to increase Samsung’s global support of early stage startups pursuing advanced software and services innovation |
IETF is the Internet Engineering Task Force (International Network Engineering Research Team) is an open international organization, its role is to bring together a network designer, network operators, network vendors, and researchers jointly developed to improve network engineeringarchitecture and build a stable network environment.