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TrendForce Expects NAND Flash Prices to Keep Rising During 2017 (2016.12.21)
The global NAND Flash industry will see an annual increase of just 6% in its total wafer capacity in 2017, according to analysis by DRAMeXchange, a division of TrendForce.
DRAMeXchange noted, as the pace of the industry-wide transition to 3D-NAND architecture accelerates, supply of 2D-NAND memory will drop sharply, leading to shortages next year |
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ASUS’s Zenbo is Now Available in Taiwan for NT$19,900 (2016.12.21)
TAIPEI, Taiwan - ASUS today announced at a press event in Taipei that the Mandarin edition of Zenbo — the first ASUS robot designed to provide assistance, entertainment, and companionship to families — will be available for pre-order with price of NT$19,900 and NT$24,900 in Taiwan from 1st January, 2017 |
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Memory Market to Increase 10% in 2017, IC Insights Says (2016.12.21)
According to IC Insights, the total memory market still down 1% yearly in 2016, and will increase 10% in 2017 to a new record high of $85.3 billion as gains in average selling prices for DRAM and NAND flash.
IC Insights pointed, after increasing by more than 20% in both 2013 and 2014, the memory market fell upon difficult times in 2015 |
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STM and Valencell Announce Collaboration on Biometric Sensor Platform for Wearables and IoT (2016.12.21)
Valencell and STMicroelectronics (STM) announced today the launch of a new, highly accurate and scalable development kit for biometric wearables that includes ST's compact SensorTile turnkey multi-sensor module integrated with Valencell's Benchmark(TM) biometric sensor system |
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Toshiba Expands Line-up of Embedded NAND Flash Memory Products for Automotive Applications (2016.12.20)
Toshiba Corporation’s Storage & Electronic Devices Solutions Company announced the launch of JEDEC e∙MMC Version 5.1 compliant embedded NAND flash memory products supporting AEC-Q100 Grade2 requirements. The line-up offers densities of 8GB, 16GB, 32GB and 64GB |
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Cree Announces the Next Generation of Extreme High Power LEDs (2016.12.20)
Cree introduces the XLamp XHP50.2 LED, which delivers up to seven percent more lumens and 10 percent higher lumens-per-watt (LPW) than the first generation XHP50 LED in the same 5.0 mm x 5.0 mm package. The new XHP50.2 LED enables lighting manufacturers to quickly improve the performance of existing XHP50 lighting designs |
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Taiwanese Companies to Show Cutting-Edge Technologies at CES 2017 (2016.12.20)
TAIPEI, Taiwan - The Taiwan External Trade Development Council (TAITRA) is returning to Las Vegas for CES 2017. Influential voices from global Taiwanese brands, ASUSTeK, Kymco, Delta, and Thermaltake, will share their insights into innovation at a press conference on January 4th, 2017 |
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Acer Announces Intangible Asset Impairment Charge to Development New Businesses (2016.12.20)
TAIPEI, Taiwan - Acer’s Board of Directors today agreed at a special meeting to take an impairment charge of approximately NT$6.34 billion. Once completed, the impact on earnings per share (EPS) is estimated to be NT$2.06 with net value per share at approximately NT$19 |
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COMPUTEX Expands Unmanned Technology Exhibition (2016.12.20)
TAIPEI, Taiwan - Taipei computer exhibition, COMPUTEX, and organizer, Taipei Computer Association (TCA) jointly announced that this year a new InnoVEX exhibition area will be established for start-up companies from May 30, 2017 to June 1 |
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Ericsson, Qualcomm and SK Telecom Collaborate on 5G NR Trials to Accelerate 5G Deployments (2016.12.20)
Ericsson, Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, and SK Telecom today announced plans to conduct interoperability testing and over-the-air field trials based on 5G New Radio (NR) standards being developed based on specifications in 3GPP |
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China’s National IC Fund to Focus on Fabless IC Design (2016.12.19)
China’s National Integrated Circuitry Investment Fund (here referred to as “National IC Fund”) has committed to invest nearly RMB 70 billion into the domestic semiconductor sector since its creation in 2015. Approximately 60% of the committed investment amount has been allocated to building semiconductor wafer fabs, according to TrendForce’s analysis |
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BMW to Start Research with IBM on Future Driving Technology (2016.12.19)
IBM has announced a new collaboration with the BMW Group, through which the companies will work together to explore the role of Watson cognitive computing in personalizing the driving experience and creating more intuitive driver support systems for cars of the future |
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New High Voltage Zener Diode Lineup from ROHM (2016.12.19)
ROHM has announced the development of high voltage Zener diodes optimized for protection and constant current applications in a variety of electronic circuits. The UDZLV and KDZLV series are comprised of 12 models in Zener voltages ranging from 51V to 150V |
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Upstream First-Tier LCD Suppliers to Face Greater Pressure from Chinese Rivals, Says TrendForce (2016.12.19)
WitsView, a division of TrendForce, reports that upstream LCD component suppliers based in China have significantly expanded their manufacturing capabilities through 2016 and will become stronger competitors against their international first-tier counterparts in 2017 |
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Only DRAM Suppliers and Top Foundries Use 300mm Wafers (2016.12.19)
According to IC Insights’ latest report, number of IC manufacturers using 300mm wafers less than half using 200mm wafers, and is becoming top-heavy.
IC Insights said, prior to 2008, the 200mm wafer was used in more cases for manufacturing ICs than any other wafer size |
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ASRock DeskMini & X99 Taichi Win Taiwan Excellence Award 2017 (2016.12.18)
TAIPEI, Taiwan — ASRock announced that its DeskMini are honored with the 2017 Taiwan Excellence Award with its excellent expandability, while X99 Taichi motherboard made the winning goal with the perfect balance between its cost-effective price and premium features |
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Broadcom Announces Shipments of 16nm and Highest Throughput Knowledge-based Processors (2016.12.16)
Broadcom Limited today announced shipments of its latest series of heterogeneous knowledge-based processors (KBPs), the BCM15000 (BCM15K), designed for modern network infrastructure including core, edge and data center routers and switches |
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Smart Machines Will Enter Mainstream Adoption By 2021, Gartner Says (2016.12.16)
Enterprises Look to Service Providers to Help Deploy AI Technologies
Smart machines will enter mainstream adoption by 2021, with 30 percent adoption by large companies, according to Gartner, Inc. Technologies including cognitive computing, artificial intelligence (AI), intelligent automation, machine learning and deep learning fall under the umbrella term for smart machines |
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Innolux’s Automotive Display Products Win HSP Innovation Award (2016.12.15)
TAIPEI, Taiwan - Innolux announced today that the company won the 2016 Taiwan Hsinchu Science Park (HSP) Innovative Product Award with its S Shape Display (R curvature = 170mm), 1-axis Curve Display (R curvature = 500mm) and Curve with Touch Display (R curvature = 500mm) |
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TrendForce Projects Global Shipments of VR Devices for 2016 to Reach 2.91 Million Units (2016.12.15)
TrendForce’s latest market survey finds that VR devices will enjoy strong sales this Christmas season on account that game consoles are also going to be popular gift purchases.
Based on TrendForce’s latest analysis, annual shipments of VR devices worldwide (excluding mobile VR device) are projected to reach 2 |
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