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Average Contract Price of PC DRAM 4GB Modules Rose to US$18 in November (2016.12.07)
Prices in the contract and spot markets for PC DRAM kept climbing between October and November, according to DRAMeXchange, a division of TrendForce. The average contract price of PC DRAM 4GB modules increased by 2.86% monthly to arrive at US$18 in November, while the average spot prices of DDR3 and DDR4 4Gb chips respectively rose 6% and 2% monthly to reach US$2 |
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Bluetooth 5 Ready SoC from Nordic for Smart home, IoT, and Wearables (2016.12.07)
Nordic Semiconductor today announces the launch of its Bluetooth 5 ready nRF52840 SoC with features and capabilities that redefine the performance envelope of single-chip Bluetooth® low energy applications: especially in smart home and advanced wearables – including wearables for payments and medical – as well as industrial sensors and other Internet of Things (IoT) devices |
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Wearable Devices Need to Be More Useful, Gartner Says (2016.12.07)
The abandonment rate of smartwatches is 29 percent, and 30 percent for fitness trackers, because people do not find them useful, they get bored of them or they break, according to a survey by Gartner, Inc.
"Dropout from device usage is a serious problem for the industry," said Angela McIntyre, research director at Gartner |
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REYAX Integrates u-blox Wireless & GNSS Modules Solution into Industrial Router Platform (2016.12.07)
u-blox today announced that REYAX Technology, a leading industrial and telematics systems provider for aftermarket telematics, has launched a new industrial router platform that incorporates cellular, short range and GNSS modules from u-blox |
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Industry's First 2.1-MHz Class-D Amplifier for Automotive Audio (2016.12.06)
Texas Instruments (TI) introduced the first 2.1-MHz Class-D audio amplifier specifically designed for automotive applications. Supporting high-resolution 96-kHz digital input, the compact TAS6424-Q1 enables high-fidelity audio with low distortion in automotive infotainment applications |
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Micron to Establish 3D DRAM Packaging Plant in Taiwan (2016.12.06)
TAIPEI, Taiwan - According to Taiwan’s Economic Daily News, Micron Technology, Inc. has decided to establish their first overseas 3D DRAM memory packaging and testing plant in the Central Taiwan Science Park in Taichung, and Amkor’s former General Manager will serve as the Taiwan General Manager |
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TrendForce Forecasts LCD TV Shipments to Expand by 2.5% in 2017 (2016.12.06)
Shipments of LCD TV sets worldwide for 2016 are estimated to grow by 1.9% annually to around 220 million units, according to the latest analysis by WitsView, a division of TrendForce.
At the start of 2017, the U.S. consumer market will be bumpy in the short term due to the results of the country’s presidential election |
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NVIDIA, Yann LeCun Announce Deep Learning Teaching Kit for University Professors (2016.12.06)
With demand for graduates with AI skills booming, NVIDIA released its Deep Learning Teaching Kit to help educators give their students hands on experience with GPU-accelerated computing.
The kit — co-developed with deep-learning pioneer Yann LeCun, and largely based on his deep learning course at New York University — was announced Monday at the NIPS machine learning conference in Barcelona |
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AMD Extends Strategic Partnership with Mentor Graphics for Linux-based Embedded Solutions (2016.12.06)
AMD today announced a new three-year agreement to expand its strategic partnership with Mentor Graphics Corporation. The agreement continues AMD's relationship with Mentor Graphics, a world leader in electronic hardware and software design solutions, and reinforces AMD's commitment to offer greater choice for embedded developers when it comes to high-performance x86 architectures |
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NFC Forum Innovation Awards Open for Submissions (2016.12.06)
The NFC Forum announced today a call for entries for the NFC Forum Innovation Awards to recognize innovative Near Field Communications (NFC) products, services and applications worldwide.
Companies and developers using NFC in new |
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MegaChips Adopts Omni Design’s Ultra-Low Power A/D Converter IP for Next-Gen Communication Networks (2016.12.06)
MegaChips Corporation and Omni Design Technologies, a provider of high-performance, ultra-low power semiconductor IP cores, today announced a strategic partnership for the development of high-performance, low-power analog front end (AFE) chips |
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Toshiba Launches 1.3A LDO Regulator with the Industry's Leading-class Small Package (2016.12.05)
Toshiba Corporation’s Storage & Electronic Devices Solutions Company today announced the launch of a 1.3A output current CMOS LDO regulator, TCR13AGADJ, for use in the power supplies of mobile devices, housed in the industry’s leading-class small package |
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Qualcomm Leads Global Ranking of Top 10 Fabless IC Design Companies, Says TrendForce (2016.12.05)
Qualcomm CDMA Technologies tops the projected ranking of the top 10 fabless IC design houses worldwide based on annual revenues for 2016, according to TrendForce’s analysis. Broadcom Limited is expected to be runner-up, while MediaTek will take third place |
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Taking No Account of Making Chips in US, TSMC Says (2016.12.05)
TAIPEI, Taiwan - U.S. President-elect Donald Trump setted off the “made in USA” issues. But iPhone 's processor chip foundry TSMC said that it will not consider to base overseas unless Taiwan' s environment cannot meet the needs of TSMC |
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Fujitsu Develops In-Memory Deduplication Technology to Accelerate Response for Large-Scale Storage (2016.12.05)
Fujitsu Laboratories Ltd. today announced the development of a high-speed in-memory data deduplication technology for all-flash arrays, which are large-scale, high-speed storage systems and use multiple flash devices such as solid-state drives |
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The Latest Iteration Raspberry Pi 3 to Be Manufactured in Japan (2016.12.05)
RS Components (RS), the trading brand of Electrocomponents plc, the global distributor for engineers, today announced in conjunction with the Raspberry Pi Foundation that its latest iteration Raspberry Pi 3 credit-card-sized single-board computer will be manufactured in Japan under a local contract manufacturing arrangement |
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New Aspect of Atom Mimicry for Nanotechnology Applications (2016.12.03)
In nanotechnology control is key. Control over the arrangements and distances between nanoparticles can allow tailored interaction strengths so that properties can be harnessed in devices such as plasmonic sensors. Now resear |
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CyberLink PowerDVD World’s First Software Player Certified for UHD Blu-ray Disc Playback (2016.12.02)
TAIPEI, Taiwan - CyberLink Corp. today announced that its flagship media player, PowerDVD, achieved certification from the Blu-ray Disc Association (BDA) for the playback of Ultra HD Blu-ray Discs. PowerDVD is the world’s first software player to be certified, and continues CyberLink’s long tradition of industry leadership in multimedia playback |
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Toshiba New General Purpose Multi-Output System Power IC (2016.12.02)
Toshiba Corporation's Storage & Electronic Devices Solutions Company today launched "TC7739FTG,” a general purpose, multi-output system power IC equipped with DC-DC power supplies and serialized regulators. Mass production will start at the end of this month |
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New PXIe Chassis from Keysight Help Engineers Make Best Price/Performance Choices (2016.12.02)
Keysight Technologies announced three new PXIe chassis with different sizes and performance characteristics. The new chassis include 1) Keysight’s industry-leading 10-slot Gen 3 chassis, designed for high-performance, benchtop and R&D applications; 2) Keysight’s cost-effective 5-slot Gen 1 chassis; and 3) Keysight’s redesigned 18-slot Gen 2 chassis, with improved power supply and new features which improve system integration |
Transmission technology into the digital era, users and manufacturers are increasingly focusing on the quality requirements of the digital display, digital display interface standard combination of hardware graphics card, and therefore more subject to the attention of the progress of its development.