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SMD Wet Tantalum Capacitor Offers Small Size for Avionics and Aerospace Applications (2016.03.30)
Vishay Intertechnology introduced a new tantalum-cased wet tantalum capacitor with a glass-to-tantalum hermetic seal that is the industry's first in the compact 9 mm by 7.1 mm by 7.4 mm C case code.
For avionics and aerospace systems, the T22 combines a reverse voltage of 1 |
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New Cree XLamp CXA2 High Density LEDs Double Lumen Output (2016.03.30)
Cree introduced its Cree XLampCXB1310 and CXB1520 High Density LED arrays. Incorporating elements of Cree's SC5 Technology Platform, the new LEDs deliver the highest lumen density at 6mm and 9mm - the most lumens in the industry for their LES [light emitting surface] sizes |
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Microchip’s MCP990X Multi-Channel Temp Sensor Family (2016.03.29)
Microchip Technology announced the MCP990X family of System Management Bus (SMBus) temp sensor ICs for monitoring of up to four channels in cold, outdoor and industrial low-temperature applications ranging from freezers and refrigerators to base stations and remote radio units |
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Foreign Brands Dominate China 3D Printer Market (2016.03.29)
According to IDC, the fast-growing 3D printer market continue to be dominated by foreign brands although Chinese vendors are catching up and growing faster. The top five players in the China 3D printer market in revenue terms are all foreign brands namely EOS, Stratasys, Renishaw, ZRapid and Solidscape |
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Building Automation System Market to Reach 10.65% CAGR by 2020 (2016.03.29)
The building automation system market is set to reach USD 100.60 billion by 2022 soaring at a CAGR of 10.65% between 2016 and 2022, led by commercial buildings sector holding the largest share of the BAS market.
The growing concern for the conservation of energy coupled with the rising cost of energy is driving the demand for energy-efficient buildings |
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H Bridge Driver IC for Low-Voltage (2.5V) Drive (2016.03.29)
Toshiba Corporation's Semiconductor & Storage Products Company today announced the launch of “TC78H620FNG”, an addition to its line-up of H bridge driver ICs for the DC brushed motors and stepping motors used in the mobile battery-drive equipment (cameras and small printers) and home appliances |
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Advantech, AAEON, Avalue, ARM, NXP and TI Collaborate on a New RTX Open Standard Form Factor (2016.03.29)
Advantech, along with AAEON, Avalue, ARM, NXP and Texas Instruments (TI), today announced their collaboration on a new open form factor: RTX (Rugged Technology eXtended).
RTX is a compact and robust ARM-based Computer-On-Module (COM) specification for industrial applications, with 2 |
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TSMC and Nanjing Sign 12-inch Fab Investment Agreement (2016.03.28)
HSINCHU, Taiwan－ TSMC today announced that the Company and the municipal government of Nanjing, China have signed an investment agreement. This agreement affirms that TSMC will make an investment in Nanjing valued at US$3 billion to establish TSMC (Nanjing) Co |
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3D Printing and Driverless Cars Increase Laser Market Revenue (2016.03.28)
TAIPEI, Taiwan － Taiwan’s Photonics Industry & Development Association (PIDA) announced that according to Strategies Unlimited Data, in 2015 the global laser output value reached US $ 9.9 billion, and compared to US$9.4 billion 2014 this was a 5% increase |
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World’s Smallest Plug-and-play NFC Security Module (2016.03.28)
The solution lies in a unique NFC security module series launched by Infineon Technologies AG in collaboration with Beijing-based Mobile Payment Solutions Co. Ltd. (MPS). This new plug-and-play solution significantly reduces design efforts for device manufacturers by bundling a high-end Infineon security chip with NFC antenna components and software on smallest PCB footprint |
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DediProg Releases Automated IC Programming System, DP2000 (2016.03.28)
After working with a variety of prominent manufacturers, DediProg has designed and manufactured the patented DP2000 Automated IC Programming System, to meet different demands of production programming.
With a high performance of 3000 units per hour (UPH) t hat outpaces the rival's throughput and helps factor ies m eet production deadline s with great return on investmen t |
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39% of Tech-Savvy Consumers Have Not Heard of Telemedicine, HealthMine Reports (2016.03.28)
HealthMine Survey conducted a survey which covered 500 insured consumers who use mobile/internet-connected health applications found that 39% still have not heard of telemedicine. Only one third of respondents say their health plan offers telehealth as an option |
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U.S. Industrial Robotics Market to Grow at a CAGR of 12.25% During the 2016-2020 (2016.03.28)
According to Research and Markets, the industrial robotics market in the US to grow at a CAGR of 12.25% during the period 2016-2020.
The market research firm divided industrial robotics market into four segments based on robot types, which are Articulated, Cartesian, SCARA and other |
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HOLTEK New HT45F3630 Power Tool Controller Flash MCU (2016.03.28)
Holtek announces the release of its new power tool controller Flash MCU, the HT45F3630, which is especially designed for motor speed control products, such as electric drills, electric screwdrivers, lawn mowers and other related applications |
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Cash and Card are Still Top Payment Methods in Taiwan (2016.03.25)
TAIPEI, Taiwan － According to a survey, which conducted by MIC (Market Intelligence and Consulting Institute), that cash and card are still top of nearly 60% of Taiwanese consumer minds when it comes to picking payment methods in most everyday situations |
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grandPad, Acer Announce Strategic Partnership to Deliver Family-Friendly Applications (2016.03.25)
TAIPEI, Taiwan – Today grandPad and Acer announced a strategic partnership, where Acer makes an equity investment in grandPad.
The partnership aligns the two companies with similar missions: providing safe and simple technology that empowers all users |
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Sony Announces Changes to Organizational and Management Structure (2016.03.25)
Sony Corporation announced today that the company has been engaged in the sequential splitting out of business units across the Sony Group, in order to reinforce the competitiveness of each business, and ensure clearly attributable accountability and responsibility |
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Winbond Introduces First SpiStack Memories in 8-Pin Packages (2016.03.25)
Winbond Electronics Corporation today announced a expansion of its flash product portfolio with the introduction of a family of stackable SpiFlash memories. The new SpiStack W25M Series is Winbond’s first to allow the “stacking” of homogeneous or heterogeneous flash, thus achieving memories of varying densities for code and/or data storage, while providing designers with the flash solutions most appropriate for their design requirements |
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AAEON Hosts Mayor of Eindhoven, The Netherlands (2016.03.25)
TAIPEI, Taiwan － Mr. Rob Van Gijzel, Mayor of Eindhoven, The Netherlands, paid a visit to the AAEON Headquarters in Taipei, Taiwan on March 22. He was invited to Taiwan as a speaker for the Smart City Summit and Expo 2016.
As one of the leading developer of industrial and network computing solutions in Taiwan |
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New PICMG 1.3 Full-sized Single Board Computer (2016.03.25)
Axiomtek released the SHB140, its new PICMG 1.3 full-sized single board computer based on the 14nm 6th generation Intel Core processor in the LGA1151 package with Intel Q170 Express chipset (codename: Skylake).
The high performance SHB-based CPU card supports PCI Express Gen 3 |
IAB Internet Activities Board short, which means the U.S. Internet advertising organization, an agency of a dedicated management to observe the activities of the U.S. Internet advertising.