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European Broadband Connectivity to Soar Over the Next Five Years, Ovum Says (2016.03.16)
High-speed Internet connectivity is set to soar in Europe over the next five years, with the region featuring eight of the 10 biggest absolute increases in the latest Broadband Development Index from global analyst firm Ovum.
The Index tracks the projected take-up of high-speed fixed and mobile broadband services in 191 countries worldwide from 2013 to 2020 |
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Sales of MEMS-based Products to Rise 4.4% in 2016, IC Insights Reports (2016.03.16)
According to IC Insights, in 2015, nine product categories within the optoelectronics, sensors/actuators, and discretes (O-S-D) marketplace reached record-high sales compared to seven in 2014 and six in 2013. And sales of MEMS-based products are forecast to rise 4 |
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ARM, TSMC Announce Multi-year Collaboration on 7nm FinFET (2016.03.15)
HSIHCHU, Taiwan – ARM and TSMC announced a multi-year agreement to collaborate on a 7nm FinFET process technology which includes a design solution for future low-power, high-performance compute SoCs.
Additionally, the agreement extends previous collaborations on 16nm and 10nm FinFET that have featured ARM Artisan foundation Physical IP |
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Aura SSD Flash Storage from OWC Upgrades for Mid 2013 and Later Macs (2016.03.15)
OWC Digital announced the all-new Aura SSD for Mid 2013 and Later Mac laptops, the most anticipated SSD upgrade release in OWC’s history. This upgrade allows users to expand the stock storage that came with their Mac laptops and reuse their original factory drive to transfer data and as a high-performance external storage solution |
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EMB-BSW1, New EMB Mini-ITX Industrial Motherboard with Intel N3000 product family (2016.03.15)
AAEON sets to bring more to its EMB Mini-ITX Industrial Motherboard product line with the next generation SoCs, Intel N3000 product family.
As its name suggests, the EMB-BSW1 utilizes the latest iteration of Intel’s SoC products that was geared specifically towards mobile devices |
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COMPUTEX Issues Last Call for 2016 d&i Awards (2016.03.15)
TAIPEI, Taiwan － COMPUTEX TAIPEI today announced last call (submission deadline is March 31) for companies interested in submitting their products for the ninth annual d&i (design and innovation) awards. Technology companies throughout the world are invited to submit their products for review, and award submission is not limited to COMPUTEX exhibitors or attendees |
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TAICS Signs Agreement with NGMN for 5G Cooperation (2016.03.15)
TAIPEI, Taiwan － TAICS (Taiwan Association of Information and Communication Standards), and NGMN(Next Generation Mobile Networks) today signed a agreement at Taipei 5G Summit. Two sides committed to co-develop 5G technology |
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Delta Unveils Modular 500kVA UPS and 120kW RowCool at CeBIT 2016 (2016.03.15)
Delta unveiled today, at DatacenterDynamics CeBIT 2016, new power and cooling technologies with industry-leading power capacity for high-density and large-scale green datacenters.
Delta debuts the Modulon DPH series 500 kVA modular UPS featuring both the world’s highest power capacity and power density per module at 55kVA and 22 |
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Smart Lighting Module to Simplify Connectivity in IoT Lighting (2016.03.15)
Samsung Electronics introduced a multi-purpose Smart Lighting Module (SLM) – the most fundamental IoT building block – for the fast-growing, smart building and smart city markets.
Samsung’s SLM is at the heart of the Samsung Smart Lighting Platform, which is designed for integration with LED lighting systems in order to easily transform luminaires into smart, digital nodes |
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Portwell Announces NANO-6050 with 5th Generation Intel Core Processors (2016.03.15)
Portwell announces the release of the NANO-6050 (120mm x 120mm) Nano-ITX embedded system board based on 5th Generation Intel Core i3-5010U and Intel Core i5-5350U Processor, formerly codenamed Broadwell-U.
The NANO-6050 is an extremely high-performance single board computer (SBC) with embedded qualities |
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ASE Showcases Its Leading IC Assembly Technology at SEMICON China 2016 (2016.03.15)
TAIPEI, Taiwan － Advanced Semiconductor Engineering, Inc (ASE), announced it will be showcasing its System in Package (SiP) solutions in consumer and automotive applications at SEMICON China, scheduled to take place in Shanghai, China, from March 15 to 17, 2016 |
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Global AMOLED Panel Production Capacity to Increase 19.1% YoY in 2016, TrendForce Says (2016.03.15)
According to WitsView, a division of TrendForce, the global AMOLED panel production capacity by area will reach 7.9 million square meters in 2016, representing a 19.1% year-on-year increase. As panel makers worldwide continue to expand their AMOLED production, the total capacity for 2018 is forecast at 14 |
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Lattice, MediaTek Joint Release the Most Power Efficient 4K Video Solution Over USB Type-C (2016.03.14)
Lattice Semiconductor Corporation and MediaTek today announced the joint release of power-efficient reference designs that drive 4K UHD over a USB Type-C connector.
Lattice’s USB Type-C port controllers and MHL transceivers can easily be paired with MediaTek’s Helio X20, the world’s first mobile processor with Tri-Cluster CPU architecture and ten processing cores (Deca-core) |
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Small LES, COB LED Solutions with Advanced Color Quality for Premium Commercial LED Lighting (2016.03.14)
Samsung Electronics introduced new color quality improvements for its small LES (light-emitting surface) chip-on-board (COB) package LC series: LC010, LC020 and LC040.
Samsung’s small LES LC series offers three alternatives: the LC010C with an operating wattage of 10W and an LES diameter of 6mm; the LC020C with 20W and an 8mm LES diameter; and the LC040C with 40W and an 11mm LES diameter |
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M31 Announces Its Release of TSMC's 28HPC+ ULL SRAM Compilers for the Smart Devices (2016.03.14)
HSINCHU, Taiwan — M31 Technology Corporation announced today its release of TSMC's 28HPC+ ULL SRAM Compilers for the Intelligent Device Market. These IP cores will enable designers to realize the features and benefits of a low power, high performance, and cost effective SoC design |
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Automobile CMOS Sensor Market is Rapidly Growing (2016.03.14)
TAIPEI, Taiwan － According to Photonics Technology & Industry Devlopment Association (PIDA) statistics, in 2014 the total global CMOS sensor shipments amounted to 4.65 billion units. Chinese manufacturer Galaxycore was the top company, accounting for 21% of the shipments; whereas Japan’s Sony and the United States’ Omnivision made the second highest number of shipments at 19% |
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AIPTEK to Unveil Its Solution for Interactive Touchscreen projection at CeBIT 2016 (2016.03.14)
Taiwanese company AIPTEK International GmbH announced that the company is to unveil its solution for interactive touchscreen projection and a combined portable HD projector and Bluetooth speaker system with integrated battery at CeBIT 2016 in Hannover, Germany |
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Smallest, Most Stable 32 kHz Super-TCXO with In-System Auto-Calibration (2016.03.14)
SiTime Corporation, a MEMS and analog semiconductor company and a wholly owned subsidiary of MegaChips Corporation, introduced the SiT156x/7x families of 32 kHz Super-TCXOs.
These timing solutions are available in a tiny, 1 |
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LED Beam Control Modules for Medium and High Power Lighting Applications (2016.03.14)
Plessey announced that it will be releasing its LED beam control module, which they are branding Stellar at the Light and Building event from 13-18 March 2016 at the Fair and Exhibition Centre in Frankfurt, Germany.
Dr. Keith Strickland, Plessey's CTO, said, "As part of our chip scale optics development we have developed a variety of solutions for beam control off the LED chip |
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Intelligent Power Devices with Low On-Resistance (2016.03.14)
Renesas Electronics announced the availability of six new intelligent power devices (IPDs) for automotive motor and heater control applications. The devices provide an extremely reliable, high-performance solution compared with mechanical relays that switch the current flow on and off in electronic control units (ECUs) |
