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NFC Forum Updates Technical Specifications Speed and Secure NFC Services (2016.03.18)
The NFC Forum yesterday announced the publication of one candidate and two adopted specifications, following approval by the Board of Directors. The New specifications enhance the performance and security of NFC services.
Connection Handover Candidate Technical Specification 1 |
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Industry's First SFP28 Transceiver IC for Data Centers (2016.03.17)
Manufacturers of SFP28 modules for data center and radio fronthaul applications can now use TO-cans enabled by the industry's first transceiver IC, which is shipping now from Maxim Integrated Products, Inc.
Maxim's SFP28 transceiver allows module manufacturers to avoid a driver inside the transmit optical subassembly (TOSA) |
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50 A, 1200 V Thyristor Offered in New Long Leads TO-247 Package (2016.03.17)
Vishay Intertechnology today introduced a new 50 A, 1200 V phase control thyristor in the new long leads TO-247 package. For power switching applications, the Vishay Semiconductors VS-50TPS12L-M3 provides a new medium-power option in the 3-lead through-hole package |
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LG Electronics Unveils Dual-Sided OLED Digital Signage Displays at DSE 2016 (2016.03.17)
LG Electronics USA Business Solutions today announced digital signage displays based on OLED technology. The paper-thin, dual-sided displays will be available in curved and flat configurations.
The Dual-View Curved Tiling OLED display offers a beautifully curved design using slim tiles to form customizable displays that link two, three or four tiles together |
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ASE Announces the Tender Offer of SPIL Was Unsuccessful (2016.03.17)
Advanced Semiconductor Engineering, Inc. ("ASE") announced today that the tender offer by ASE for common shares of Siliconware Precision Industries Co., Ltd. ("SPIL"), launched on December 29, 2015, was unsuccessful due to failure to satisfy the tender offer conditions, as ASE did not receive approval from the Taiwan Fair Trade Commission ("FTC") for the proposed combination between ASE and SPIL before the expiration of the tender offer |
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Huawei Launches Its New Marketing Slogan for ICT Era at CeBIT 2016 (2016.03.17)
Huawei Enterprise Business Group today launched its new marketing slogan -- "Leading New ICT, Building a Better Connected World" at CeBIT 2016.
In this new era, enterprise ICT systems are shifting from siloed support systems to mission-critical production systems that enable efficient production, operation, and decision-making |
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TV Panel Shipments Decline of 8.7% And YoY Decline of 8.3% in February (2016.03.17)
The latest large-size panel shipment report by WitsView, a division of TrendForce, says TV panel shipments for this February totaled 17.88 million units, representing a monthly decline of 8.7% and a year-on-year decline of 8.3% |
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Openstack-Taiwan Hackathon Will Be Held on March 18 (2016.03.17)
TAIPEI, Taiwan － The OpenStack Foundation will hold the first annual global “Openstack-Taiwan Hackathon” from March 18 to 20 in Taiwan. OpenStack will use this event as a model for hosting large-scale global OpenStack hackathons |
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NIO 50 Wi-Fi Device Server from NEXCOM Deliver IoT connectivity for Industry 4.0 (2016.03.17)
NEXCOM Wi-Fi device server NIO 50 injects IoT connectivity into factories, gearing unconnected industrial equipment and machines for smart manufacturing and Industry 4.0.
The NIO 50 delivers data acquisition capability, IoT connectivity, convenience of remote monitoring, and industrial durability to provide end-to-end connectivity for the industrial internet of things (IIoT) |
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IoT Gateway Starter Kit from Advantech with Microsoft Azure Verified (2016.03.17)
Advantech announced IoT Gateway Starter Kit. This kit will jumpstart IoT innovation with a reliable platform and open gateway technologies. The whole package includes a ready-to-run system (Intel Celeron J1900 platform & Windows 7 Embedded), IoT software platform service (WISE-PaaS), software development kit and technical support service |
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Keysight's ADS Signal, Power Integrity Software Tool Adopted by SECO for PC Board Validation (2016.03.17)
Keysight Technologies announced that SECO, Arezzo Italy, a design and manufacturing of embedded PC boards (PCBs), has successfully used Keysight EEsof EDA’s SIPro and PIPro signal and power integrity solutions to validate an embedded COMexpress PC Board using an AMD R-Series Merlin Falcon 3 |
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India PC Shipments Grew 10.6% in Q4 of 2015, Gartner Says (2016.03.16)
PC shipments in India totalled nearly 2.6 million units in the fourth quarter of 2015, a 10.6 percent increase over the fourth quarter of 2014, according to Gartner, Inc.
"Consumers accounted for 40 percent of total PC sales in the fourth quarter of 2015, down from 52 percent in the fourth quarter of 2014," said Vishal Tripathi, research director at Gartner |
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MediaTek’s Helio X20 Supports DTS’ Immersive Headphone Sound Technology (2016.03.16)
DTS, Inc., announced that its DTS Headphone:X immersive sound technology is supported by the new Helio X20 processor, the latest flagship chip for smartphones from MediaTek.
DTS Headphone:X technology offers an authentic immersive 3D sound experience through any pair of headphones or earbuds to fully transport consumers into the games, movies and music they are enjoying on their smartphones |
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Low-Power Embedded Wi-Fi Solutions for Growing IoT Market (2016.03.16)
Microchip Technology announced today four compact, low-power, highly integrated solutions that allow Wi-Fi and networking capability to be embedded into virtually any device, including Internet of Things (IoT) applications. These four modules provide complete solutions for 802 |
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Axiomtek's SHB140 PICMG 1.3 Full-sized Single Board Computer Supports 6th Generation Intel Core Pr (2016.03.16)
Axiomtek introduced the arrival of SHB140, its new PICMG 1.3 full-sized single board computer based on the 14nm 6th generation Intel Core processor in the LGA1151 package with Intel Q170 Express chipset (codename: Skylake).
The high performance SHB-based CPU card supports PCI Express Gen 3 |
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Synchronous Buck DC/DC Converter IC Featuring Lowest Minimum ON-Time (2016.03.16)
ROHM has recently announced the development of the BD51180TL, a step-down DC/DC converter featuring the lowest minimum ON time in the industry, making it ideal for high-power applications such as industrial equipment and automotive systems |
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Thermaltake Continues to Open Physical Gaming Stores in Taiwan (2016.03.16)
TAIPEI, Taiwan － According to Taiwan Economic Daily, Thermaltake Group, the Taiwanese PC hardware, accessories and gaming products maker, will continue to establish its physical gaming store in Taiwan to raise its market share and sales |
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Sony to Launch PlayStation VR from October 2016 Globally (2016.03.16)
Sony Computer Entertainment Inc. (SCEI) today announced that PlayStation VR (PS VR), will launch from October 2016 in Japan, North America, Europe and Asia, at manufacturer's suggested retail price of 44,980 yen, $399 USD, €399 and £349 |
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Panasonic joins Solliance to Develop Roll-to-roll Flexible Perovskite Solar Cells (2016.03.16)
Solliance announced todaty that Panasonic Corporation has joined a research program concerning the development of roll-to-roll manufacturing processes aimed at large scale production of flexible perovskite solar cells as one of the industrial partners |
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Imagination Demonstrates Its New PowerVR in Mobile Applications at GDC 2016 (2016.03.16)
Imagination Technologies, a Silicon IP provider owned by Intel and Apple, was demostrating its new PowerVR technology at GDC 2016, which have setted a bar for high-end graphics in mobile.
One of the most important demonstration at the event comes from the PowerVR Ray Tracing team |
