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. u-blox Announces First Timing Solutions Based on L1 and L5 GNSS Signals (2021.03.28)
  u-blox has announced its first multi-band high accuracy timing solutions to concurrently support the L1 and L5 GNSS (global navigation satellite system) signals. The ZED-F9T-10B and LEA-F9T-10B timing modules, and the RCB-F9T-1 timing card deliver nanosecond-level timing accuracies required to synchronize cellular network base stations and smart power grids...
. Mitsubishi Electric to Launch 80x60 pixel Thermal Diode Infrared Sensor (2021.03.14)
  Mitsubishi Electric Corporation announced that its Mitsubishi Electric Diode InfraRed (MelDIR) sensor lineup will introduce on July 1 a new thermal sensor featuring a wide field of view (FoV) and high 80x60 pixel resolution for applications including security, heating, ventilation and air conditioning (HVAC), people counting, smart buildings and thermal scanners...
. Astera Labs Expands Focus to Deliver Purpose-Built Solutions Addressing Connectivity Bottlenecks (2021.03.14)
  Astera Labs announces its expanded focus to address system-wide performance bottlenecks in data-centric applications. The new Aries Compute Express Link (CXL 2.0) Smart Retimer portfolio (PT5161LX, PT5081LX) for low-latency CXL...
. New Autodesk Fusion 360 App from SnapEDA Makes PCB Part Libraries a Snap (2021.03.12)
  SnapEDA is releasing the SnapEDA for Autodesk Fusion 360 app in collaboration with Autodesk. This new app integrates SnapEDA’s database directly within Fusion 360, enabling electronics engineers and designers to search and place millions of electronic component models - including symbols, footprints and 3D models - directly within the Fusion 360 environment...
. Global IT Spending to Jump by $228B and hit $3.92T in 2021 (2021.03.03)
  The COVID-19 crisis forced companies and organizations across the globe to speed up the digitalization of their business, as remote working and distance learning became the new normal amid the ongoing lockdown. The surge in the use of digital solutions and services abated the pandemic’s negative effect on IT spending, which still dropped to just under $3...
. Kioxia Establishing A New 6th-Gen 3D Flash Memory Factory (2021.02.25)
  Kioxia Corporation held a groundbreaking ceremony for its state-of-the-art semiconductor fabrication facility (Fab7) at Yokkaichi Plant in Mie Prefecture, Japan. The facility will be one of the most advanced manufacturing operations in the world, dedicated to production of its proprietary 3D flash memory BiCS FLASH...
. PICMG Announces Official Ratification of COM-HPC Specification (2021.02.25)
  PICMG announces that COM-HPC has been approved and ratified, and is now available for public download and distribution. "Twenty-six industry-leading companies worked together diligently and cohesively over a span of five years”, said Christian Eder, the COM-HPC Working Group Chair...
. Dirac Brings High-quality Audio to New FUJITSU Notebook LIFEBOOK U9311 and U9311X (2021.02.17)
  Swedish digital audio pioneer Dirac announced that Fujitsu’s LIFEBOOK U9311 and U9311X business laptops, produced by Fujitsu Client Computing Limited (Kawasaki, Japan) and sold by Fujitsu Limited (Kawasaki, Japan), now include Dirac audio technology to deliver an immersive sound experience with upgraded sound quality for various content and use cases...
. ExpressPCB Announces ExpressSCH Plus and ExpressPCB Plus 3.0 with SnapEDA Library (2021.02.17)
  ExpressPCB announced the release of its new Plus PCB Design Suite (ExpressSCH Plus and ExpressPCB Plus version 3.0). Highlights of the newly added features include an integrated search and download for components using SnapEDA, schematic link between ExpressSCH Plus and ExpressPCB Plus, as well as netlist validation between the printed circuit board (PCB) layout and the schematic...
. Taiwan’s NTHU Develops a Robot with a Human-hand-like Movement (2021.02.08)
  HSINCHU, Taiwan - Although widely used in manufacturing, robots require much more agility for use in nursing and rehabilitation. With this in mind, an interdisciplinary research team led by Professor James Chang of the Department of Power Mechanical Engineering has recently applied the latest advances in AI, biomechanics, and human-factor engineering to develop a robot that can imitate the meticulous movements of a human hand...
. u-blox ALEX-R5 Integrates Cellular and GNSS into a Miniature SiP form Factor with Zero Compromises (2021.02.03)
  u-blox has announced the ALEX-R5, a miniature cellular module that integrates low power wide area (LPWA) connectivity and global navigation satellite system (GNSS) technology into an ultra-small system-in-package (SiP) form factor...
. SnapEDA & Switchcraft Collaborate to Make Electronics Design Faster & More Efficient (2021.01.28)
  SnapEDA and Switchcraft are collaborating to distribute digital models for Switchcraft’s products, to help engineers bring new products to life faster. As the world continues to move at an increasing pace, engineers continue to seek out faster and more efficient ways of realizing their designs...
. TraceParts and SnapEDA Partner to Offer Unified UX to Source Free PCB Footprints (2021.01.20)
  TraceParts, one of the world's leading providers of 3D digital content for engineering, and SnapEDA, the creators of the first search engine for electronics design, are announcing a strategic content syndication partnership. The new partnership helps electronics engineers and designers source PCB footprints, schematic symbols, and 3D CAD models at their fingertips, for millions of electronic components...
. PICMG Announces Officers for 2021-2022 Term (2021.01.20)
  PICMG, a not-for-profit 501(C) consortium of companies and organizations that collaboratively develop open specifications, held its bi-annual election for officers. The group elected four officers to lead the organization through 2022...
. Shortage Caused by Explosive Growth in Mini LED Demand to Result in 5-10% Price Hike for LED Chips (2021.01.20)
  While major OEMs such as Apple and Samsung prepare to release their new notebook computers, tablets, and TVs that are fully equipped with Mini LED backlights this year, various companies in the LED supply chain began procuring Mini LED chips ahead of time in 4Q20...
. MediaTek Launches 6nm Dimensity 1200 Flagship 5G SoC (2021.01.20)
  HSINCHU, Taiwan – MediaTek today unveiled its new Dimensity 1200 and Dimensity 1100 5G smartphone chipsets with unrivaled AI, camera and multimedia features for powerful 5G experiences. The addition of the 6nm Dimensity 1200 and 1100 chipsets to MediaTek’s 5G portfolio gives device makers a growing suite of options to design highly capable 5G smartphones with top of the line camera features, graphics, connectivity enhancements and more...
. ST Partners with Schneider Electric on Carbon Neutrality and Energy-Efficient Solutions (2021.01.14)
  TAIPEI, Taiwan – STMicroelectronics has selected Schneider Electric as a strategic partner to support its goal to reach carbon neutrality by 2027. Schneider Electric, the leader in the digital transformation of energy management and automation, will support ST in this next stage of its ongoing efforts to reduce its global environmental footprint...
. u-blox SARA-R5 LTE-M Modules Distinguished as a CES Innovation Awards Honoree (2021.01.14)
  u-blox has announced that its SARA-R5 LTE-M modules with IoT Security-as-a-Service have been distinguished as a CES 2021 Innovation Awards Honoree. The CES Innovation Awards program, owned and produced by the Consumer Technology Association (CTA), is an annual competition honoring outstanding design and engineering in consumer technology products across 28 product categories...
. Taiwan Government Leading 100 Startups For CES2021 (2021.01.14)
  TAIPEI, Taiwan - In 2020, the global economy faced the impacts of the COVID-19 pandemic and the US-China trade war. While the economies around the world were critically affected, Taiwan was able to break through the predicament and make extraordinary performances in foreign trade and industry development...
. TSMC to Kick off Mass Production of Intel CPUs in 2H21, Says TrendForce (2021.01.13)
  TAIPEI, Taiwan - Intel has outsourced the production of about 15-20% of its non-CPU chips, with most of the wafer starts for these products assigned to TSMC and UMC, according to TrendForce’s latest investigations. While the company is planning to kick off mass production of Core i3 CPUs at TSMC’s 5nm node in 2H21, Intel’s mid-range and high-end CPUs are projected to enter mass production using TSMC’s 3nm node in 2H22...
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