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HOLTEK New HT68F2422 IR Driver MCU (2018.07.09)
Holtek announced the release of its new IR driver MCU, the HT68F2422, especially designed for use in IR remote controller and IR transmission related product applications. This new device includes an integrated high precision oscillation circuit with a frequency tolerance of ±0 |
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CTIMES Explores the Current State of Industry 4.0 in Taiwan (2018.07.09)
TAIPEI, Taiwan - CTIMES held the “Smart Manufacturing of Electronic Components Forum” in which specialists in related industries were invited to Industrial Technology Research Industry (ITRI) to share their thoughts and explain the current state of entering technology 4 |
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New Current Sense Transformers Now Available at Wurth Electronics Midcom (2018.07.05)
Wurth Electronics Midcom announced the release of additional Current Sense transformers to the MID-SNS family.
“These surface mount transformers are designed to operate between 50khz to 500khz and sense up to 40A of current |
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Unleash Maximum Airflow with Lian Li PC-011 Air Chassis (2018.07.05)
Lian Li Industrial announced its ultimate platform for cooling with the Lian Li PC-O11 Air high-airflow chassis. Bearing the same multi-chamber design as the PC-O11 Dynamic, the PC-O11 Air takes that design and maximizes it for the best amount of airflow and cooling ever |
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Toshiba Announces New Analog Output IC Photocoupler for Automotive Applications (2018.07.05)
Toshiba Electronic Devices & Storage Corporation announces the launch of a new analog output IC photocoupler that enables high-speed communications in automotive applications – especially electric vehicles (EV) and hybrid electric vehicles (HEV) |
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With ECC Memory, the COM-APLC6 can be Relied On to Perform in any Environment (2018.07.04)
AAEON launches the COM-APLC6, a powerful COM Express Type 6 module. Responding to customer requirements and market trends, the innovative tech giant has fitted its latest module with a series of features designed to strengthen applications and speed up development processes |
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Trigence Introduces Full Digital Driver DN3013 for High-Res Audio (2018.07.04)
Trigence Semiconductor Inc., the revolutionary digital audio IC and solution provider, today introduced the latest full digital driver IC, DN3013, for high-resolution audio, suitable for USB powered headsets, wireless speakers, sound bars and headphones for personal computers |
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Chinese Suppliers May Start Selloff of Modules Due to the Oversupply, Says TrendForce (2018.07.04)
According to the latest research of EnergyTrend, a division of TrendForce, Chinese domestic solar market has been shirking after the release of new PV policy. Faced with the oversupply, Chinese module makers will seek ways to export the excessive products, or even sell off the products to overseas markets |
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Synopsys and Siemens Team Up to Expand and Extend Electronic Design Automation Collaboration (2018.07.04)
Synopsys and Siemens PLM Software today announced that they have agreed to collaborate on a wide range of electronic design automation (EDA) product interoperability projects for the benefit of their mutual customers. The collaboration spans a number of EDA domains from design to verification |
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Baidu to Integrate Mobileye’s Responsibility Sensitive Safety Model Into Apollo Program (2018.07.04)
Baidu today announced that it plans to work with Mobileye to integrate and commercially deploy Mobileye’s Responsibility Sensitive Safety (RSS) model in both the open source Project Apollo and commercial Apollo Pilot programs |
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Attendance at MWC Shanghai 2018 Tops 60,000 Visitors (2018.07.02)
The GSMA today reported that more than 60,000 unique visitors1 from 112 countries and territories attended the 2018 GSMA Mobile World Congress Shanghai, held 27-29 June in Shanghai. In addition to this business-to-business audience |
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UNITED GRINDING Group Add a New Owner (2018.07.02)
The UNITED GRINDING Group, a leading machine tool manufacturer, announced that the company has a new owner. The new owner structure comprises a strategically aligned pool of investors organized by the Swiss BZ Bank Aktiengesellschaft |
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Microsoft and Chung Hua University Establish Taiwan’s First AI+ Experience Center (2018.07.02)
TAIPEI, Taiwan - Microsoft Taiwan announced that they have joined forces with Chung Hwa University to establish the first AI+ experience center in all of Taiwan, where they will set up context experiences for smart access, smart hotels, and smart retail |
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UMC Board Approves 100% Acquisition of MIFS Fab from Fujitsu (2018.07.02)
HSINCHU, Taiwan - United Microelectronics Corporation announced that its Board of Directors has approved for the company to fully acquire Mie Fujitsu Semiconductor Limited (MIFS), a 12-inch wafer foundry based in Mie, Japan, from Fujitsu Semiconductor Limited (Fujitsu Semiconductor) |
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Panasonic’s PLC Technology Approved as Baseline Specification by IEEE P1901.3 Working Group (2018.07.02)
Panasonic Corporation announced that it has presented its fourth-generation scalable HD-PLC technology to IEEE Standardization Working Group. This technology enables communications over longer distances and improves communication speeds by controlling the range of frequencies in use |
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UMC Acquires 100% Ownership of Mie Fujitsu Semiconductor (2018.07.02)
HSINCHU, Taiwan - Fujitsu Semiconductor and United Microelectronics Corporation ("UMC") announced that UMC will acquire all of the shares of Mie Fujitsu Semiconductor Limited (MIFS), a 300mm wafer foundry joint venture between both companies |
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Portwell Anniunces New COM Express 3.0 Evaluation Board with 10GbE Solutions (2018.06.28)
Portwell announces the launch of PCOM-C700, Type 7 COM Express carrier board in its COM Express portfolio. At a mere 304.8mm x 243.8mm (12˝ x 9.6˝), the carrier board-compliant PICMG COM Express 3.0 integrates the new Type 7 pinout type for a new generation design based on ATX form factor |
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Price Decline Will Continue in NAND Flash Market in 2H18, Says TrendForce (2018.06.28)
The growth momentum for 2H18 NAND Flash market is expected to be weak, according to the latest report of DRAMeXchange, a division of TrendForce. Coupled with continuous improvements in yield rate and output of 64/72-layer 3D NAND Flash, DRAMeXchange expects the market to approach a balance between supply and demand, the contract prices of NAND Flash products are expected to decline further |
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Xiaomi Launches Its Mi Laptop Air in Spain (2018.06.28)
Xiaomi, a Chinese brand for electronic products, released its Mi Laptop Air 13.3” at Palacio Neptuno in Madrid of Spain.
Mi Air 13.3” is a combination of light and performance. The laptop comes with all-metal body which merely weighs 1 |
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The Global Semiconductor Industry Reached $115.8 Billion in Q1 2018 (2018.06.28)
Global semiconductor industry revenue declined 3.4 percent in the first quarter of 2018 falling to $115.8 billion. Semiconductor industry performance was negatively affected by the declining sales and first-quarter seasonality in the wireless communications market |
