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Antenova Shipping Its Ultra-small GNSS Active Antenna Module with LNA and SAW (2018.09.06)
Antenova is now shipping its latest module for tiny positioning devices – the RADIONOVA M20047-1. This is an active antenna module for GNSS applications in the 1559-1609 MHz satellite bands using GPS, GLONASS, GALILEO or BeiDou |
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HOLTEK New BS45F3833 Atomiser MCU (2018.09.06)
Holtek announces the release of a new addition to its Atomiser Flash MCU range with the new BS45F3833. This new device uses a new type of touch water detection which greatly improves the precision of water shortage protection/detection |
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Fingerprints Brings Touch Sensors to the Automotive Industry (2018.09.06)
Fingerprints has launched its first AEC-Q100 compliant biometric capacitive fingerprint sensor, meeting rigorous automotive industry standards.
Automakers are keen to integrate biometric-based driver authentication into vehicles to improve vehicle security, cabin personalization, and securely authorize in-vehicle payments |
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ITRI, SEMI, CGU and NTSU Jointly Develop Flexible Hybrid Electronics Technology for Precision Sports (2018.09.06)
TAIPEI, Taiwan - To promote precision sports, ITRI, SEMI, Chang Gung University, and National Taiwan Sport University signed an agreement to jointly develop flexible hybrid electronics and to formulate a developmental blueprint for related industrial technology |
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Less Price Erosion to Lift MEMS Sensor/Actuator Growth, IC Insights Says (2018.09.05)
Products built with microelectromechanical systems (MEMS) technology are forecast to account for 73% of the $9.3 billion semiconductor sensor market in 2018 and about 47% of the projected 24.1 billion total sensor units to be shipped globally this year, according to IC Insights |
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Appier: Indonesia Ranks First In Terms of AI Implementation (2018.09.05)
TAIPEI, Taiwan - Appier has announced findings from a commissioned study conducted by Forrester Consulting on behalf of Appier. The study, Artificial Intelligence Is Critical To Accelerate Digital Transformation In Asia Pacific |
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ASIX Exhibits New AX58100 EtherCAT Slave Controller at 2018 IAS (2018.09.05)
ASIX Electronics announced that the company is going to exhibit its new AX58100 2/3-Port EtherCAT Slave Controller solution at China International Industry Fair (Shanghai) - Industrial Automation Show 2018 (IAS).
Compared to other EtherCAT slave controller solutions |
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Panasonic Commercializes Granular EMC Semiconductor Encapsulation Materials for FOWLP and PLP (2018.09.04)
Panasonic Corporation announced that it has commercialized a granular semiconductor encapsulation material designed specifically for fan-out wafer-level package (FOWLP) and panel level packaging (PLP). Sample production is scheduled to start in September 2018 |
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ITRI Showcases 7H External Folding AMOLED Panel at Touch Taiwan 2018 (2018.09.04)
TAIPEI, Taiwan - Having engaged in the development of flexible AMOLED displays and soft electronic technology for a decade, the Industrial Technology Research Institute (ITRI) this year showcased their latest external folding AMOLED soft display panel module |
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BIOSTAR Introduces H310MHC2 and H310MHD PRO2 for Improved Gaming and VR Performance (2018.09.04)
BIOSTAR introduces the H310MHC2 and H310MHD PRO2 entry-level motherboards with a new BOS for improved performance in gaming and VR with Windows 7 compatibility. Powered by the Intel H310 chipset, the motherboards offer gamers a well-balanced set of premium features typically found in higher-end motherboards such as a high-speed 10Gb/s M |
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Flex Power Modules Debuts Ultra-efficient 700W Half-brick DC/DC Converters (2018.09.04)
Flex Power Modules announced the release of the PKJ4000 series of DC/DC converters primarily targeting radio frequency power amplifier (RFPA) applications within the telecom market segment. The PKJ4000 series delivers 28V DC or 50V DC at up to 700W of power from an input voltage range of 36V to 75V |
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Taiwan Communications Industry Shipment Value to Reach US$116B in 2019 (2018.09.03)
Taipei-based, government-backed IT research institute MIC (Market Intelligence & Consulting Institute) predicted that shipment value of the Taiwanese communications industry will grow 6.2% year-on-year to NTD 3.4 trillion in 2018, further to NTD 3 |
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Intel and Ericsson Accomplish First 3GPP NR-Compliant End-to-End Data Call over 39 GHz Spectrum (2018.09.03)
Intel and Ericsson delivered a first 3GPP New Radio (NR) 5G-compliant live data call operating over the 39 GHz band using Intel’s RF mm-Wave chip with Ericsson Radio System commercial equipment including the 5G NR radio AIR 5331, baseband and Intel 5G Mobile Trial Platform |
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Huawei Secured No. 2 Smartphone Vendor Spot, Surpassing Apple in 18Q2, Gartner Says (2018.09.03)
In the second quarter of 2018, Huawei surpassed Apple to secure the No. 2 worldwide smartphone vendor position for the first time ever, according to Gartner, Inc. Apple moved into the No. 3 spot. Overall, sales of smartphones to end users grew 2 percent in the second quarter of 2018 to reach 374 million units |
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LG, Google, and Innit Unveil Breakthrough Smart Kitchen Integration at IFA 2018 (2018.09.03)
LG Electronics, Google, and Innit unveiled a joint solution for the Smart Kitchen that enables hands-free voice control, step-by-step guided cooking, and automated expert cook programs on premium SIGNATURE KITCHEN SUITE ovens and ranges |
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ITRI’s Tech Showcase Shines at IFA 2018 (2018.09.03)
At IFA 2018, Industrial Technology Research Institute (ITRI), Taiwan’s largest and one of the world’s leading high-tech applied research institutions, for the first time exhibits at this grand event, in conjunction with its spinoffs ELECLEAN Co |
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STUDER Wins User Satisfaction Award in China (2018.08.31)
The Swiss grinding machine manufacturer, Fritz Studer AG, wins a user satisfaction award in China. This prize was awarded by the "AI Automobile Production" magazine during the Chinese Engineering Fair CIMES in Beijing. In total, 38 products and solu-tions for the automotive industry won awards |
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Huawei’s Server Shipment to China to Reach a New Record High due to Surging Demand in China (2018.08.30)
According to the latest report by DRAMeXchange, a division of TrendForce, the Chinese market has witnessed a surging demand for servers in 2018. The number of servers shipped to China will increase by 23% YoY in 2018, and account for 25 |
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HOLTEK New HT45F0074 Half-bridge Induction Cooker MCU (2018.08.30)
Holtek announced the release of its dedicated half-bridge induction cooker Flash MCU, the HT45F0074. This new device provides multiple hardware protection mechanisms, preventing the product’s power IGBT from burning out. Other features include an integrated 12-bit A/D Converter |
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Taiwan Semiconductor Industry Growing Steadily in 2018, Up 8.1% to USD82.8 Billion (2018.08.30)
The Taiwanese semiconductor industry is expected to have a shipment value of NTD 2.5 trillion in 2018 and grow by 8.1% year-on-year, slightly lower than the global average of 10.1%, according to Taipei-based, government-backed IT research institute MIC (Market Intelligence & Consulting Institute) |
IEEE1394 is a common interface standard that allows interconnected communication between computers and peripheral equipment. So rapidly the efficiency of the transmission speed, it is often applied in connection high density of signal transmission, the transmission quantity of peripheral devices.