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TrendForce Expects Prices of Lithium-ion Batteries to Increase by 5~15% in 3Q18 (2018.08.06)
Cobalt prices have reached another record high in 1Q18, according to the data from EnergyTrend, a division of TrendForce. As the result, the prices of lithium-ion battery cells are estimated to increase by 5~15% QoQ in 3Q18, but would have a chance to remain flat in the fourth quarter |
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Adopting Smart Digital Technologies Has Become Vital for Manufacturing Firms, Says GlobalData (2018.08.06)
At a time when increased visibility across factory floor and supply chain operations is gaining importance more than ever to boost productivity and gain competitive advantage, adopting smart digital technologies (smart manufacturing) has become imperative for manufacturing firms, says leading data and analytics company GlobalData |
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HOLTEK New Arm Cortex-M0+ based 32-bit Flash MCU Series HT32F502xx (2018.08.06)
Holtek announced the release of its new Arm Cortex-M0+ based 32-bit 5V wide voltage Flash MCU Series, the HT32F502xx. This new device series, includes the HT32F50220, HT32F50230, HT32F50231, HT32F50241, all of which have an operating speed of up to 20 MHz and a single power supply operating voltage range of 2 |
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Over 75% of Taiwanese Gamers Play Games on the Go: MIC (2018.08.06)
Taipei-based, government-backed IT research institute MIC (Market Intelligence & Consulting Institute) conducted a survey on Taiwanese gamers and the findings show that up to 75.5% of gamers play smartphones/tablet app games, followed by play PC online games (27 |
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UMC and Avalanche Technology Partner for MRAM Development and 28nm Production (2018.08.06)
HSINCHU, Taiwan - United Microelectronics Corporation and Avalanche Technology, Inc., the next generation STT-MRAM (Spin Transfer Torque Magnetic RAM) leader, today announced that they have entered a partnership for joint development and production of MRAM to replace embedded flash |
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Toshiba Memory Corporation Announces Merger with K. K. Pangea (2018.08.01)
Toshiba Memory Corporation today announced that it consummated the merger with K. K. Pangea which is its parent company on August 1, 2018.
The company name after the merger is Toshiba Memory Corporation. Today the company also introduces the executive officer system to improve the efficiency of business execution and strengthen the corporate governance |
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Global GDP Impact on Worldwide IC Market Growth Forecast to Rise (2018.08.01)
In its recently released Mid-Year Update to The McClean Report 2018, IC Insights forecasts that the 2018-2022 global GDP and IC market correlation coefficient will reach 0.95, up from 0.88 in the 2010-2017 time period. IC Insights depicts the increasingly close correlation between worldwide GDP growth and IC market growth through 2017, as well as its forecast through 2022 |
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Toshiba Develops 40V N-channel Power MOSFETs with Improved Thermal Performance (2018.07.31)
Toshiba Electronic Devices & Storage start mass production and shipments of “TPWR7904PB” and “TPW1R104PB”, 40V N-channel power MOSFETs for automotive applications. They are housed in the DSOP Advance(WF) packages that deliver double-sided cooling, low resistance, and small size |
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AAEON Partners Everlight to Create Taipei’s Smart Street Light System (2018.07.31)
TAIPEI, Taiwan – AAEON yesterday joined with Everlight Electronics to participate at Taipei City Government’s "Innovative Works Smart Taipei Taipei LED Street Light Results Presentation." The presentation showcased the latest smart street light solutions and highlighted the work being done to turn the city into a global leader for cost-effective energy efficiency |
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First congatec SMARC 2.0 Module with NXP i.MX8 Processor (2018.07.31)
congatec announces the conga-SMX8, the company's first SMARC 2.0 Computer-on-Module based on the 64-bit NXP i.MX8 multi-core ARM processor family. The ARM Cortex-A53/A72 based conga-SMX8 represents the new flagship module for ultra-low-power embedded computer designs, offering the recent best-in-class ARM processor with excellent performance, flexible graphics and numerous embedded features for all kind of IIoT applications |
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eMemory’s Reprogrammable eNVM Solution Available on TowerJazz BCD Platform (2018.07.31)
HSIHCHU, Taiwan – eMemory today announced its reprogrammable eNVM IP NeoMTP is qualified and now available for TowerJazz 0.18um BCD process, amid an increasing demand for the cost-effective memory solution from wireless charging and USB Type C customers |
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Sales Revenue of DRAM Modules for 2017 Recorded a Significant Growth of 69%, Says TrendForce (2018.07.30)
DRAMeXchange, a division of TrendForce, reports that the global sales revenue of DRAM modules for 2017 totaled US$11.7 billion, amounting to a significant growth of 69% compared with the result of the previous year. The high revenue is due to the nearly 50% YoY growth of DRAM ASP, although the contribution of the spot market to the total DRAM revenue is getting smaller |
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Toshiba Launches High Current Photorelays in DIP4 Package (2018.07.30)
Toshiba has launched two new high current photorelays that are fabricated using the latest U-MOS IX semiconductor process. Both devices are now shipping in production quantities.
The new “TLP3553A” and “TLP3555A” devices feature OFF-state output terminal voltage ratings of 30V and 60V, and ON-state continuous current ratings of 4A and 3A—higher than previous generation products |
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Bridgetek Helps Bring 3.5” HMI Display Shield Venture to Life (2018.07.30)
Bridgetek’s multi-award winning Embedded Video Engine (EVE) technology continues to gain traction within the global open source community, as well as with larger OEMs. The highly integrated graphics controller devices - which are able to take care of the display, touch and audio aspects of modern human machine interfaces (HMIs) - are featuring in a growing number of products being developed by small start-ups |
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ASE to Seize Opportunities in the Memory Market in China (2018.07.30)
TAIPEI, Taiwan - Taiwanese semiconductor testing and packaging company, ASE Technology Holding Co., Ltd. yesterday stated that they would increase the scale of their semiconductor development in Mainland China, and in addition to their factory in Fujian Province they would also be open to investment from Tsinghua Holdings to expand their production capacity |
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Edge Computing Will Drive the Growth of Micro Server and Server DRAM, Says TrendForce (2018.07.25)
DRAMeXchange, a division of TrendForce, estimates that x86-based solutions will continue to be the market mainstream in 2018, with a global shipment share of 97%. Intel and AMD will continue to lead the development of server. Particularly, in the sector of Internet Datacenter, solutions based on the x86 architecture will still dominate the market due to its wide product range |
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Toshiba Releases Compact Power MOSFET Gate Driver Intelligent Power Device (2018.07.25)
Toshiba Electronic Devices & Storage Corporation announces the availability of a new compact power MOSFET gate driver intelligent power device (IPD) for automotive 3-phase brushless motors. The device is intended for use in automotive motor drive applications, such as 12V electronic power steering (EPS), oil/ water pumps, fan motors and electric turbochargers |
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NVIDIA to Collaborate with DARPA to Develop Systems for Post-Moore’s Law Era (2018.07.25)
NVIDIA has been selected by the Defense Advanced Research Projects Agency (DARPA) to work with a team of university and industry researchers to enable near application-specific integrated circuit performance without sacrificing programmability for data-intensive algorithms |
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Intel to Collaborate with SiTime on MEMS Timing for 5G Modems (2018.07.25)
Intel and SiTime have announced that they will work together on robust, tiny and low-power microelectromechanical (MEMS) timing solutions for Intel’s 5G modem platforms.
SiTime’s MEMS solutions provide enhanced reliability and withstand environmental stressors |
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Intel looks to capitalize on future demand for IoTs and 5G, says GlobalData (2018.07.25)
Intel has been an integral part of telco networks seemingly since the beginning of time. However, changes in how networks are being built are creating new vulnerabilities for the American multinational tech giant as it looks to capitalize on future demand for Internet of Things (IoT) and 5G services, says GlobalData |
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