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Toshiba Unveils Industry's First SSDs Utilizing 96-Layer, 3D Flash Memory (2018.07.24)
Toshiba Memory Corporation today announced the launch of the industry’s first SSDs utilizing 96-layer, 3D flash memory. Sample shipments to OEM customers start today in limited quantities, and Toshiba Memory Corporation will gradually increase shipments from the fourth calendar quarter of 2018 |
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TSMC 7-nm Process Experiencing Heavy Market Demand (2018.07.24)
TAIPEI, Taiwan - Taiwan Semiconductor Manufacturing Company, Limited (TSMC) last Thursday at a legal briefing stated that their 7-nm chip process has already gone into mass production. They estimate that during the third quarter it will account for 10% of their revenue and then increase to account for 20% of their revenue in the fourth quarter |
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Toshiba Memory Starts Construction of the First Fabrication Facility in Kitakami City, Iwate Prefect (2018.07.24)
Toshiba Memory Corporation today held a groundbreaking ceremony for the first semiconductor fabrication facility (fab), called K1, in Kitakami, Iwate prefecture, in northeastern Japan. On its completion in autumn 2019, the facility will be one of the most advanced manufacturing operations in the world, dedicated to production of 3D flash memory |
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Cloud Service Providers to Put More Emphasis on Edge Computing, Says TrendForce (2018.07.23)
Cloud computing platforms have fueled the digital transformation of enterprises in recent years. Public cloud has been playing a key role during the process. While applications of IoT and AI grow increasingly popular, the ecosystem of cloud services and the integration of cloud and edge have emerged as weak points of the market, says TrendForce |
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NEC Provides Demo System Utilizing MEC to DOCOMO 5G Open Lab Yotsuya (2018.07.23)
NEC Corporation announced the provision of a demo system for intrusion detection solutions utilizing Multi-access Edge Computing (MEC), a network architecture concept for next-generation communications, to DOCOMO 5G Open Lab Yotsuya, a 5G technology verification center run by NTT DOCOMO, INC |
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Sony Releases Stacked CMOS Image Sensor for Smartphones with 48 Effective Megapixels (2018.07.23)
Sony Corporation today announced the upcoming release of the IMX586 stacked CMOS image sensor for smartphone cameras. The new sensor features 48 effective megapixels, the industry’s highest pixel count.
The new product achieved a world-first ultra-compact pixel size of 0 |
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Cloud-to-edge AI Chip Kunlun Repositions Baidu in AI Market, says GlobalData (2018.07.23)
Search engine giant Baidu has recently unveiled China’s first cloud-to-edge artificial intelligence (AI) chip—Kunlun—at Baidu Create 2018. The move repositions the company in not only the Chinese market but also globally, says GlobalData |
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Chinese Maintains Lead in Global Solar Investment (2018.07.19)
TAIPEI, Taiwan - The Photonics Industry & Technology Development Association (PIDA) yesterday pointed out that demand in the global solar energy market is continually increasing. In 2017 nearly 100GW of solar energy equipment was installed globally; however, the primary market is still in Mainland China |
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Long-Term Oversupply of Large TFT LCD Panels to Prompt Restructuring of Older Fabs, IHS Markit Says (2018.07.19)
Large thin-film transistor liquid crystal display (TFT LCD) panel makers are expected to reduce production of comparatively smaller sized 32-, 40- and 43-inch panels, helping to stabilize panel prices in the third quarter of 2018 |
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Reduce Costs and BOM with Single Power Monitoring IC that Measures Power from 0V to 32V (2018.07.19)
Microchip Technology introduced new two- and three-channel power monitoring devices that measure from 0V to 32V on a single chip, offering designers solutions that are easy to adopt and improve power measurement accuracy. The two-channel device is also the industry’s first with native 16-bit resolution, providing leading flexibility across a wide measurement range |
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Renesas Announces New Scalable Digital Controllers (2018.07.19)
Renesas Electronics announced two new PMBus compliant, fully digital DC/DC controllers that provide single output point-of-load (POL) conversions for FPGAs, DSPs, ASICs, network processors and general purpose system rails. The ISL68300 with integrated MOSFET drivers and ISL68301 with PWM output simplify designing power supplies for data center, wired and wireless communications, and factory automation equipment |
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Semi Content in Electronic Systems Forecast to Reach 31.4% in 2018 (2018.07.19)
In its upcoming Mid-Year Update to The McClean Report 2018 , IC Insights forecasts that the 2018 global electronic systems market will grow 5% to $1,622 billion while the worldwide semiconductor market is expected to surge by 14% this year to $509 |
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Upcoming 802.11ax Represents Significant Selling Point for Wi-Fi Gear Vendors, Says GlobalData (2018.07.19)
Just as cellular vendors are working to deliver 5G innovations like multiple antennas and ‘millimeter wave’ technologies, Wi-Fi is poised for its own 5G-like upgrade with the introduction of the 802.11ax standard due this year |
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Sony Releases the Latest SXRD, the World's Smallest Full HD Reflective LCD Device (2018.07.18)
Sony Corporation today announced the upcoming release of the SXRD (Silicon X-Tal (crystal) Reflective Display) SXRD241A, the world's smallest reflective display device in full HD resolution designed for portable projectors, and the CXD3554GG, a dedicated drive LSI equipped with a high-definition signal processing function |
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Smart TV Share Jumps to 70% of TV Shipments in 2018, IHS Markit Says (2018.07.18)
The global unit-share of smart TVs rose from 45 percent of total TV shipments in 2015 to 64 percent in 2017. It is expected to reach 70 percent of all TV shipments in 2018. Global TV shipments are recovering in 2018, due to increased price erosion from declining LCD TV panel prices, with shipments rising 3 |
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Avalue Introduces EMX-SKLGP, a Thin Mini ITX 6th Gen Intel Embedded Industrial Motherboards (2018.07.18)
Avalue Technology is unveiling EMX-SKLGP based on Intel 6th Generation Core and Celeron Processors.
EMX-SKLGP, a Thin Mini ITX board with 6th Gen Intel Core i3/i5/i7 and Celeron SoC Processor, the new range covers a full spectrum of the Intel processor from Core i7 to Celeron, which is "up to 10% faster" and offering graphics that are "up to 34% faster" than the previous generation |
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eCloudvalley, The First and Only Publicly Listed Born-in-the-Cloud MSP (2018.07.18)
TAIPEI, Taiwan - Starting from July 17th, 2018, eCloudvalley is successfully listed on the Emerging Stock Board of Taipei Exchange (TPEx) as the first and only publicly listed born-in-the-Cloud MSP.
Founded in 2014 as a born-in-the-cloud partner, eCloudvalley has grown to over 200 employees in 4 years time with geographic footprints for over 10 regions like Taiwan, Hong Kong, Beijing, Shanghai and Manila |
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Keysight Joins 5G Device Forerunner Initiative Led by China Mobile (2018.07.17)
Keysight Technologies announced that it has signed a Memorandum of Understanding (MoU) with CMCC (China Mobile Communication Corporation) in support of the 5G Device Forerunner Initiative project. The program’s large-scale 5G trials aim to accelerate development and industry maturity of 5G devices |
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Micron and Intel Announce Update to 3D XPoint Joint Development Program (2018.07.17)
Micron and Intel today announced an update to their 3D XPoint joint development partnership, which has resulted in the development of an entirely new class of non-volatile memory with dramatically lower latency and exponentially greater endurance than NAND memory |
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First Double Choke with Molding Technology (2018.07.17)
Würth Elektronik eiSos unveils WE-MCRI - a novel double choke: It is the first of its kind on the market with molding technology. With its soft saturation characteristics, a WE-MCRI is above all suited for DC/DC converter applications |
