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Trina Solar Launches New Smart PV Solution (2018.03.26)
Trina Solar Limited launched a new smart PV solution, TrinaPro, at its global headquarters in Changzhou, China.
TrinaPro is designed for utility-scale ground mounted PV systems. It is the result of Trina Solar's full cooperation agreement with Huawei Technologies Co |
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Toshiba Releases Small MOSFET with High ESD Protection to Drive Headlight LED (2018.03.26)
Toshiba Electronic Devices & Storage Corporation has released a dual MOSFET “SSM6N813R” with high ESD protection positioned for use in automotive applications, including as a driver IC for headlight LEDs, which require a high withstand voltage and a small footprint |
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Microchip’s New Automotive MEMS Oscillators (2018.03.26)
Microchip Technology has unveiled the new DSA family of automotive-grade Micro-Electro-Mechanical Systems (MEMS) oscillators that provide 20 times better reliability, 500 times better tolerance to shock and five times better vibration resistance than traditional quartz-based crystal devices |
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G4 and Collaborative Partners Exhibit Smart Vision Technology (2018.03.26)
TAIPEI, Taiwan - G4 Technology on March 23 held a seminar on the topic of smart vision with one hundred semiconductor industry and academic research institute technical personnel in attendance. In addition to sharing basic knowledge of key machine vision products, G4 also introduced technologies which are indispensable to smart vision, including 2D/3D sensors, infrared sensors, high-speed cameras, and artificial intelligence software |
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North American Semiconductor Equipment Industry Posts February 2018 Billings (2018.03.26)
North America-based manufacturers of semiconductor equipment posted $2.41 billion in billings worldwide in February 2018 (three-month average basis), according to the February Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI |
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Third Generation Semiconductor Materials Show Market Potential Due to 5G and Automotive (2018.03.26)
5G is expected to enter commercial operation in 2020, while vehicles become more intelligent, networked and electric, driving the development of SiC and GaN, the third-generation semiconductor materials. TrendForce estimates that the revenue for SiC substrates and GaN substrates will be US$180 million and US$3 million respectively in 2018 |
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ITRI Collaborates with Merck to Enhance New Drug Manufacturing (2018.03.26)
HSINCHU, Taiwan - ITRI and international pharmaceutical and chemical company Merck signed an MOU today (Mar. 26), announcing the establishment of Taiwan-Merck Biopharma R&D & Training Collaboration Program at ITRI Guangfu Innovation Campus in Hsinchu |
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Taiwan Captured 16% Share of Total Fabless Company IC Sales in 2017 (2018.03.23)
Research included in the March Update to the 2018 edition of IC Insights’ McClean Report shows that fabless IC suppliers accounted for 27% of the world’s IC sales in 2017—an increase from 18% ten years earlier in 2007. As the name implies, fabless IC companies do not operate an IC fabrication facility of their own |
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Gartner Says Worldwide IoT Security Spending Will Reach $1.5B in 2018 (2018.03.22)
Gartner, Inc. forecasts that worldwide spending on IoT security will reach $1.5 billion in 2018, a 28 percent increase from 2017 spending of $1.2 billion.
"In IoT initiatives, organizations often don't have control over the source and nature of the software and hardware being utilized by smart connected devices," said Ruggero Contu, research director at Gartner |
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Micro LED & Mini LED Technology Will Account for 11.4% of Worldwide LED Wafer Volume by 2022 (2018.03.22)
While conventional LED components are used for backlight, Micro LED and Mini LED technology have been used for self-emitting in displays of consumer electronics. Every LED will then stand for a pixel, increasing the number of LED wafers used by companies |
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Toshiba Expands New Packaging Option for SO6L IC-Output Photocouplers (2018.03.22)
Toshiba Electronic Devices & Storage Corporation is expanding its line-up of SO6L IC-output photocouplers with a new wide leadform package type SO6L(LF4). Shipments start today.
The SO6L(LF4) package has a creepage distance of 8mm, which meets the industry’s standard creepage distance for SO6L |
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APeJ Mobile Solutions Spending Expected to Be More Than $540.7 Billion in 2018 (2018.03.22)
APeJ spending on mobility solutions is expected to grow 5.3% year over year in 2018, reaching more than $540.7 Billion, according to the IDC Worldwide Semiannual Mobility Spending Guide. This growth is expected to continue through 2021 with spending on mobility-related hardware, software, and services surpassing $1 |
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Samsung Annouces Its New AP Exynos 7 Series 9610 (2018.03.22)
Samsung Electronics announced the availability of its latest application processor (AP), the Exynos 7 Series 9610. The Exynos 9610, built on Samsung’s 10-nanometer (nm) FinFET process, elevates the multimedia experience in high-end smartphones with premium-level features such as deep learning-based image processing for ultimate picture-taking experiences and stunning slow motion video recording at 480 frames per second (fps) |
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Marvell Introduces Industry's First NVMe Chipset Solutions (2018.03.21)
Marvell announced that it is launching innovative NVM Express (NVMe)-based chipset solutions that will accelerate the time to market for application-optimized data center SSD implementations. These new, highly-versatile building blocks can optimally address current and emerging workload storage requirements, spanning capacity, latency, performance, power and cost, to enable tailored SSD solutions for specific cloud and enterprise workloads |
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Acer Reports 2017 Consolidated Revenues of NT$237.28 Billion, Up 2% YoY (2018.03.21)
TAIPEI, Taiwan - Acer announced today the financial results for fiscal 2017 and the fourth quarter ended December 31, 2017, following approval by its Board of Directors.
Acer reported for the full year of 2017 consolidated revenues of NT$237 |
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AI Items Added to COMPUTEX BC Awards (2018.03.21)
TAIPEI, Taiwan - The COMPUTEX TAIPEI computer exhibition will be held from June 5-9, and one of the co-organizers, Taipei Computer Association (TCA) stated that AI and Big Data items will be added to the competition events for the official COMPUTEX Best Choice Awards |
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UK Chief Scientific Adviser launches UK-Taiwan Innovative Industries Programme (2018.03.21)
Professor Robin Grimes, Chief Scientific Adviser of the UK Foreign & Commonwealth Office, today launches the ‘UK-Taiwan Innovative Industries Programme’ (UKTW I2P) together with Vice President of Taiwan Dr. Chen Chien-Jen |
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Global Smart Lighting Market to Reach a Value of US$13.4 Billion in 2020, Says TrendForce (2018.03.20)
Smart lighting has been developed for years, but products and applications are not really used widely. In 2017, however, smart lighting has begun to escalate with diversification of products, continuous improvements of technology, maturing ecosystem of industry chain, and active promotion of manufacturers |
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IHS Markit Identifies Eight Global Solar and Energy Storage Market Trends to Watch (2018.03.20)
Annual solar installations grew almost 20 percent year over year in 2017, and the solar industry is also edging within 100 gigawatts, a milestone the industry will reach this year, according to IHS Markit.
“Remarkable expansion has occurred against a backdrop of trade disputes and far-reaching policy changes on the one hand |
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Toshiba Memory Releases Enhanced Data Center SSD Line-up with 64-Layer 3D Flash Memory (2018.03.20)
Toshiba Memory Corporation announced its latest line-up of NVM Express (NVMe) and SATA data center solid-state drives (SSDs) in multiple form factors. The new SSDs offer cloud data centers robust performance and reliability, and deliver lower operating power for read-intensive applications such as NoSQL databases, big data analytics and streaming media |
