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Learn About the Key Production Bottleneck for Micro LED – Mass Transfer (2018.01.24)
TAIPEI, Taiwan - If you look at single technical specifications and concepts, Micro LED is undoubtedly the display technology with the greatest potential in the coming years. However, there are still a number of breakthroughs that need to be made in order to break through bottlenecks, and finding a method of entering into mass production is one of the main challenges |
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North American Semiconductor Equipment Industry Posts December 2017 Billings of $2.39 Billion (2018.01.24)
North America-based manufacturers of semiconductor equipment posted $2.39 billion in billings worldwide in December 2017 (three-month average basis), according to the November Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI |
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SDK to Re-expand Capacity to Produce High-Grade SiC Epitaxial Wafers (2018.01.23)
Showa Denko has decided to re-expand its capacity to produce high-quality-grade silicon carbide (SiC) epitaxial wafers for power devices, which have already been marketed under the trade name of "High-Grade Epi" (HGE), in addition to currently conducted expansion work of HGE production facilities |
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Acer Debuts Stylish Convertible Acer Chromebook Spin 11 at Bett 2018 (2018.01.23)
Acer has announced its new Acer Chromebook Spin 11 (CP311-1H/CP311-1HN) at The Bett Show in London. Designed for families, students and individuals who want to embrace the ease and security of Chrome, the new convertible Acer Chromebook Spin 11 features a stylish design that can be used in four versatile usage modes |
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Global TV Panel Shipments for 2017 Grew by 1.3%; LGD, BOE, Innolux Took Top 3 Positions (2018.01.23)
WitsView, a division of TrendForce, reports that global LCD TV panel shipments increased quarter by quarter in 2017. 1H17 showed less momentum for holiday sales due to the high prices, but shipments rebounded in 2H17 as the prices declined and TV makers prepared for the year-end sales |
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World’s Smallest LTE Cat M1 and NB-IoT Multimode Module with Quad Band 2G Fallback (2018.01.23)
u blox announced the SARA R412M, an LTE Cat M1, NB-IoT, and quad band 2G (EGPRS) module with worldwide coverage. Measuring just 16 x 26 mm, the module is the world’s smallest to provide both LTE and quad band EGPRS support in a single design |
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Demand for Driverless Cars and Smart Driver Assistance Systems Expands Facial Recognition Applicatio (2018.01.22)
In line with the megatrend towards smarter and informative vehicles, automakers have aggressively developed new technologies and solutions to address three major issues: the connection between the driver and the road conditions like driving safety and traffic jams |
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GUC Celebrates Two Decades of Innovation & Lofty Dreams (2018.01.22)
HSINCHU, Taiwan - Global Unichip Corporation (GUC) today celebrates its 20th anniversary with a party at its Hsinchu, Taiwan headquarters themed around "Celebrate Two Decades of Innovation and Lofty Dreams". The company was established on January 22, 1998 |
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They Are Resources, Not Trash! Implementing a Circular Economy with E-Sources (2018.01.22)
TAIPEI, Taiwan - They should be called E-Resources rather than E-Waste. If viewed in terms of economic value, in the coming ten years and even for the next century, they will be one of the sources of precious metals that humanity relies upon, and just like ecological resources, they will serve as a key to sustainability for human society |
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Microsoft Sets Up an AI R&D Center in Taiwan (2018.01.19)
Microsoft announced that they establish an artificial intelligence (AI) research and development (R&Q) Center in Taiwan. They expect to invest NT$1 billion (about 34 million US dollars) in the coming two years to recruit researchers and engineers, fostering an AI R&D team of over 200 people within five years |
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Alliance Memory Launches New 256Mb High-Speed CMOS SDRAMs in the 54-Pin TSOP II Package (2018.01.18)
Alliance Memory extended its offering of 256Mb high-speed CMOS SDRAMs with new x8 and x4 devices in the 54-pin 400-mil plastic TSOP II package.
"Alliance Memory is the market's SDRAM leader, offering the broadest product lineup of any vendor, with densities from 16Mb to 512Mb in a wide range of configurations and packages," said TJ Mueller, Vice President of Marketing at Alliance Memory |
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NEC Highlights 5G Deployment for Creating a Future Deyond Imagination at MWC 2018 (2018.01.18)
NEC today announced the presentation of technologies and solutions for working together with telecom carriers in the co-creation of new business models and the implementation of 5G solutions at Mobile World Congress (MWC) 2018 at the Fira Gran Via, Barcelona, from February 26 to March 1, in Hall 3, stand #3M30 |
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Samsung Electronics Starts Producing Industry’s First 16-Gigabit GDDR6 (2018.01.18)
Samsung Electronics today announced that it has started mass production of the industry’s first 16-gigabit (Gb) Graphics Double Data Rate 6 (GDDR6) memory for use in advanced graphics processing for gaming devices and graphics cards as well as automotive |
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China’s Production Capacity of 300mm Wafer Will Approach 700,000 Pc/Month, Says TrendForce (2018.01.17)
According to TrendForce’s latest report, Breakdown Analysis of China’s Semiconductor Industry, many fabs are being built in China with high capital expenditures, attracting attention from the industry. In particular, new fab construction projects like Silan Microelectronics and CanSemi etc |
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LCD TV Panel Demand Expected to Go Through a Correction in Q1 2018, IHS Markit Says (2018.01.17)
Demand for liquid crystal display (LCD) panels from South Korean and Chinese TV makers was strong in the fourth quarter of 2017, but implementation of their panel purchasing strategies for the first quarter of 2018 may result in a correction as demand expectations change |
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Mitsubishi Electric Develops Object-recognition AI Camera for Coming Mirrorless Cars (2018.01.17)
Mitsubishi Electric Corporation announced today that it has developed what is believed to be the industry’s highest performing automotive camera technology that detects various object types at distances of up to about 100 meters, which will enable drivers to receive advanced warning for enhanced driving safety in coming mirrorless cars |
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The World’s Most Advanced COM Express Type 10 Module Released by AAEON (2018.01.17)
AAEON launches the NANOCOM-KBU, the world’s first COM Express Type 10 board to be powered by a 7th Gen Intel Core U Processor. With its powerful CPU, the trailblazing NANOCOM-KBU has onboard 4GB DDR4 memory and a graphics engine that supports 4K applications |
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HTC to Showcase Vive Pro and Wireless Module at 2018 TGS (2018.01.17)
TAIPEI, Taiwan - HTC announced that they will participate in the 2018 Taipei Game Show and showcase the newest Vive member, the Vive Pro, as well as the Vive wireless module which was developed in collaboration with Intel. The two products will make their debut in Taiwan |
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ASE Named 2018 Thomson Reuters Top 100 Global Technology Leader (2018.01.17)
TAIPEI, Taiwan - Advanced Semiconductor Engineering, Inc. was today recognized by Thomson Reuters as a 2018 Top 100 Global Technology Leader. The inaugural program identifies the tech industry’s most operationally sound and financially successful organizations |
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PC Shipments Declined 2% in 4Q17 and 2.8% for the Year, Gartner Says (2018.01.17)
Worldwide PC shipments totaled 71.6 million units in the fourth quarter of 2017, a 2 percent decline from the fourth quarter of 2016, according to preliminary results by Gartner, Inc. For the year, 2017 PC shipments surpassed 262 |
