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Wibu-Systems’ CodeMeter Provides Secure Storage for Intel SGX Native Enclaves (2018.03.07)
Wibu-Systems, the global leader in software protection, license lifecycle management, and device security for the embedded realm, has successfully completed the Intel Software Guard Extensions (Intel SGX) enablement process for CodeMeter on Windows platforms |
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High-power LED Package Products in Chinese Market Saw Slight Price Drop, Says TrendForce (2018.03.06)
The prices of most LED package products in the Chinese market remained stable in February 2018, and some of the products saw slight price drop as suppliers tried to clear inventory, says LEDinside, a division of TrendForce.
According to LEDinside analyst Terri Wang, a few of high-power ceramic-substrate LED package products have a slight price drop of 0 |
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Intel, Lenovo and Diaceutics Collaborate on Development of AI Technology in Patient Care (2018.03.06)
At the Healthcare Information and Management Systems Society (HIMSS) Conference 2018, Intel unveiled a collaboration with Lenovo and Diaceutics that will allow doctors and health care providers to harness the power of artificial intelligence (AI) to transform patient diagnostic testing and improve treatment |
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Two New FET Drivers Benefit Aanosecond LIDAR Applications and 50-MHz DC/DC Converters (2018.03.06)
Expanding on its industry-leading gallium nitride (GaN) power portfolio, Texas Instruments (TI) announced two new high-speed GaN field-effect transistor (FET) drivers to create more efficient, higher-performing designs in speed-critical applications such as light detection and ranging (LIDAR) and 5G radio-frequency (RF) envelope tracking |
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Agricultural Technology Transfer to Benefit Both of Malaysia and Taiwan (2018.03.05)
TAIPEI, Taiwan - Taiwan’s Agriculture Minister Lin Tsung-hsien on March 3 visited Taiwanese businesspeople-operated companies and retailers in Kuala Lumpur that have been selling Taiwan-produced agricultural products, hoping to expand the market share of halal market and to promote Taiwan-produced fertilizer, seeds, agricultural machines in Malaysia |
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ASE and TDK Establish Joint Venture to Provide Wearable Chip Package Solutions (2018.03.05)
TAIPEI, Taiwan - ASE yesterday announced together with TDK the joint establishment of ASE Embedded Electronics Incorporated, and in the future they will utilize TDK-authorized SESUB technology in the production of IC embedded substrates and provide mobile and wearable device products for the semiconductor industry |
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HOLTEK New HT67F5652 IR Temperature Sensing MCU (2018.03.05)
Holtek announced its new IR temperature sensing application specific MCU, the HT67F5652. This new device contains a fully integrated 24-bit Delta Sigma analog to digital converter and an operational amplifier making it suitable for use in many applications that require IR temperature sensing, such as ear thermometers, forehead thermometers and so on |
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New 1-MHz Active Clamp Flyback Chipset and Industry-First 6-A Three-level Buck Battery Charger (2018.03.05)
Texas Instruments (TI) introduced several new power management chips that enable designers to boost efficiency and shrink power-supply and charger solution sizes for personal electronics and handheld industrial equipment.
Operating at up to 1 MHz |
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TDK to Acquire Chirp Microsystems, Aiming for Leadership in Ultrasonic Sensing Solutions (2018.03.02)
TDK Corporation announced that it has reached an agreement with Chirp Microsystems, Inc., a pioneer in high-performance ultrasonic sensing, in which Chirp becomes a wholly owned subsidiary of TDK. TDK expects to close the acquisition within the coming days |
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92 IC Wafer Fabs Closed or Repurposed From 2009-2017 (2018.03.02)
Since the global economic recession of 2008-2009, the IC industry has been on a mission to pare down older capacity (i.e., ≤200mm wafers) in order to produce devices more cost-effectively on larger wafers. The spree of merger and acquisition activity and the migration to producing IC devices using sub-20nm process technology has also led suppliers to eliminate inefficient wafer fabs |
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Foxconn Returns to the First Place of TV OEM (2018.03.02)
TAIPEI, Taiwan - According to a survey conducted by Chinese market research institute Sigmaintell, in January 2018, the thirteen largest global television OEM manufacturers shipped out 8.02 million units, which was a yearly increase of 68 |
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Flexible AMOLED Market More Than Tripled to $12 Billion in 2017, IHS Markit Says (2018.03.01)
Shipment revenue of flexible active-matrix organic light-emitting diode (AMOLED) displays more than tripled in 2017, accounting for 54.6 percent of total AMOLED panel shipment revenue, according to business information provider IHS Markit |
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Intel Introduces ‘Intel AI: In Production’ Program with AAEON (2018.03.01)
Intel unveiled “Intel AI: In Production,” a new program that makes it easier for developers to bring their artificial intelligence prototypes to market. Since its introduction last July, the Intel Movidius Neural Compute Stick (NCS) has gained a developer base in the tens of thousands |
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Lowest-power Multi-standard, Multi-band MCUs (2018.03.01)
To meet growing connectivity needs for buildings, factories and the grid, Texas Instruments (TI) introduced its newest SimpleLink wireless and wired microcontrollers (MCUs).
These new devices offer industry-leading low power consumption and concurrent multi-standard and multi-band connectivity for Thread, Zigbee, Bluetooth 5 and Sub-1 GHz |
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u-blox Announces F9 High Precision Positioning Technology for Industrial and Automotive Applications (2018.02.27)
u blox has announced the u-blox F9 technology platform, delivering high precision positioning solutions for mass market industrial and automotive applications. The platform combines multi-band Global Navigation Satellite System (GNSS) technology with dead reckoning, high precision algorithms, and compatibility with a variety of GNSS correction data services to achieve precision down to the centimeter level |
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Mobile DRAM Revenues Grow Slower in 1Q18, Says TrendForce (2018.02.26)
Global mobile DRAM revenue hit a new high of US$8 billion in 4Q17, a robust sequential growth of 23.6%, says DRAMeXchange, a division of TrendForce. In 4Q17, the major suppliers raised their prices by 10-15% on average, driven by expected strong demand from the smartphone market during the traditional busy season, and continuing brisk demands from North American datacenters |
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Inova Semiconductors Announces Standalone LED Driver for In-car Lighting (2018.02.26)
Inova Semiconductors announces a new standalone smart RGB LED driver and controller, the INLC100Q16. This is the latest member of Inova’s ISELED family, a truly revolutionary concept for in-car LED lighting that substantially reduces costs, simplifies control and enables dynamically changing light |
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NEC and KT demonstrate 5G potential in PyeongChang (2018.02.26)
NEC today announced the successful conclusion of demonstration tests of safety-related services for the 5G era in PyeongChang together with KT Corporation (KT), a leading South Korea-based communications carrier. This initiative was carried out in February 2018 based on an agreement concluded by the two companies in August 2015 to collaborate in the field of 5G networks |
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MediaTek Unveils Helio P60, the First SoC Platform Featuring a Multi-core AI Processing Unit (2018.02.26)
MediaTek unveiled the MediaTek Helio P60 system-on-chip (SoC), the first SoC platform featuring a multi-core AI processing unit (mobile APU) and MediaTek’s NeuroPilot AI technology. Its Arm Cortex A73 and A53 processor mix delivers up to a 70 percent CPU performance boost over the Helio P23 and Helio P30, in addition to a 70 percent GPU performance enhancement |
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Samsung Announces New 3-Stack ISOCELL Image Sensor with Integrated DRAM (2018.02.26)
Samsung Electronics today introduced the newest addition to its ISOCELL image sensor family, the 3-stack ISOCELL Fast 2L3. The 1.4-micrometer (μm) 12-megapixel (Mp) image sensor with integrated dynamic random access memory (DRAM) delivers fast data readout speeds to capture both rapid movements in super-slow motion and sharper still photographs with less noise and distortion |
DOS-popular, accompanied from IBM personal PC's fame, however, to trace its origins from the earlier of the microprocessor era to begin with.