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Intel and Mobileye Offer Formula to Prove Safety of Autonomous Vehicles (2017.10.18)
Mobileye and Intel today announced a formal, mathematical formula to ensure that a self-driving vehicle operates in a responsible manner and does not cause accidents.
Speaking today at the World Knowledge Forum in Seoul, South Korea, professor Amnon Shashua, Mobileye CEO and Intel senior vice president, offered the autonomous driving industry a way to prove the safety of autonomous vehicles |
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Power Integrations Opens New Production-Support and R&D Center in Malaysia (2017.10.18)
Power Integrations announced the opening of a new location in Penang, Malaysia. The facility will serve as a production-support and R&D center as well as an operations hub from which the company will manage its Asian supply chain |
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Samsung Completes Qualification of 8nm LPP Process (2017.10.18)
Samsung Electronics announced today that 8-nanometer (nm) FinFET process technology, 8LPP (Low Power Plus), has been qualified and is ready for production.
The newest process node, 8LPP provides up to 10-percent lower power consumption with up to 10-percent area reduction from 10LPP through narrower metal pitch |
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Merger of Gintech, NSP and Solartech Will Contribute to Taiwan’s Solar Industry, Says TrendForce (2017.10.17)
Three solar companies Gintech, Neo Solar Power (NSP) and Solartech signed an MOU on October 16 announcing their intention to merge as one single corporate entity by the third quarter of 2018. According to EnergyTrend, a division of TrendForce, the combined production capacity for photovoltaic (PV) cells of these three companies is projected to reach 5 gigawatts (GW) |
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STMicroelectronics' Advanced Automotive Processors with Built-In Security Set (2017.10.17)
STMicroelectronics announced its latest automotive processors that feature a dedicated, built-in security module.
The new Telemaco3P telematics and connectivity processors (STA1385 and its variants) are the first automotive microprocessors to integrate a powerful, dedicated, isolated Hardware Security Module (HSM), which acts like an independent security guard to watch data exchanges and encrypt and authenticate messages |
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Worldwide Device Shipments to Increase 2.0% in 2018, Gartner Says (2017.10.17)
Worldwide shipments of PCs, tablets and smartphones are predicted to exceed 2.35 billion units in 2018, an increase of 2.0 percent from 2017, according to Gartner, Inc. This would be the highest year-over-year growth since 2015 |
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Molex Introduces Pico-EZmate Slim 1.2mm Pitch Wire-to-Board Connection System (2017.10.17)
Molex introduces the Pico-EZmate Slim 1.2mm Pitch Wire-to-Board Connector, designed to provide reliable connection in a compact profile that improves both reliability and assembly speed.
“As consumer electronics products get more compact, manufacturers are looking to reduce the overall device size while not sacrificing reliability or production flexibility,” said Rick Lee, global product manager, Molex |
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TrendForce Maintains 4Q17 NAND Flash Market Outlook After Toshiba’s Capacity Rumors (2017.10.17)
Despite lower-than-expected output caused by certain problems in production lines, Toshiba will be able to deliver its NAND Flash shipments as per the dates and volumes in its fourth-quarter contracts, says DRAMeXchange, a division of TrendForce |
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Mitsubishi Electric Field Testing xAUTO Autonomous-Driving Test Vehicle (2017.10.17)
Mitsubishi Electric Corporation announced today that it has been conducting expressway-based field testing of its xAUTO vehicle and related autonomous-driving technologies for self-sensing and network-based driving, since May 2016 |
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AUO Delivers All-Round Solar Power Plants Ranging from Rooftop, Ground Mount and Floating Types (2017.10.17)
HSINCHU, Taiwan – In response to the Taiwan government’s “2-Year Solar Power Promotion Plan", AU Optronics Corp. (AUO) has been continuously accelerating its pace in developing solar power systems in recent years. In addition to focusing on rooftop solar power plants, the Company has extended its reach to the ground mount and floating solar power markets to demonstrate its comprehensive capability for solar power plant development |
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40VIN, 2A Silent Switcher µModule Regulator in 6.25mm x 4mm BGA Package (2017.10.16)
Analog Devices, Inc., which recently acquired Linear Technology Corporation, announces the LTM8063, a 40VIN, 2A µModule step-down regulator in a tiny 6.25mm x 4mm BGA package. The package size is 75% smaller than the existing equivalent product |
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Mitsubishi Electric Unveils EMIRAI 4 Smart Mobility Concept Car (2017.10.16)
Mitsubishi Electric Corporation today unveiled its EMIRAI 4 concept car featuring next-generation driving-assistance technology, which is expected to help reduce traffic accidents and contribute to increasingly safe, convenient and environmentally friendly transportation |
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BIOSTAR Launches Flagship RACING Z370GT7 for Intel’s 8th Gen Core Desktop CPUs (2017.10.16)
BIOSTAR introduces its flagship Intel Z370 motherboard under the third generation RACING series, the BIOSTAR RACING Z370GT7. This motherboard supports the latest 8th generation Intel Core processors also known as Coffee Lake.
The RACING Z370GT7 sports premium features that gamers, overclockers, professional content creators, and modders demand |
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Smart Application Trends are Significant – Holtek Promotes 32-bit MCU Products (2017.10.16)
TAIPEI, Taiwan - Internet of Things (IoT) and smart trends continue to drive the growth of microcontroller (MCU) chips with both the vastness of applications and performance simultaneously experiencing rapid growth. MCU chip provider Holtek Semiconductor today at a yearly presentation for new products launched several types of 32-bit MCU products with applications that include wireless charging |
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ST Cooperates with Alibaba Cloud to Provide Cloud-to-node IoT Solution to the Market (2017.10.16)
STMicroelectronics announced its cooperation with Alibaba Cloud to provide a complete cloud-to-node IoT solution to the market. The cooperation will allow any designer to easily create IoT nodes and gateways using ST's key semiconductor building blocks for the IoT, run Alibaba's IoT operating system AliOS on the node, and seamlessly connect with the Alibaba Cloud for faster time-to-market of large-volume IoT applications |
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300mm Wafer Fabs Expected to Increase Each Year by 2021, IC Insights Says (2017.10.13)
With the prospects of large 450mm wafers going nowhere, IC manufacturers are increasing efforts to maximize fabrication plants using 300mm and 200mm diameter silicon substrates. The number of 300mm wafer production-class fabs in operation worldwide is expected to increase each year between now and 2021 to reach 123 compared to 98 in 2016, according to the forecast in IC Insights |
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Acer Wins Eight 2017 Good Design Awards (2017.10.13)
TAIPEI, Taiwan – Acer announced today that eight of its products have been honored with a 2017 Good Design Award for outstanding product design. The award-winning Acer products include a 360-degree camera, 360-degree dash cam, indoor air quality monitor, all-in-one desktop PC, and four notebooks |
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Spirent and China Mobile Partner to Run the 5G C-RAN Project (2017.10.12)
Spirent Communications announced today it has signed an agreement to partner with the China Mobile 5G Joint Innovation Center Project.
As part of the first phase of the 5G C-RAN project, Spirent and the China Mobile 5G C-RAN Working Group successfully completed automated performance testing |
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Worldwide Semiconductor Revenue to Reach $411 Billion in 2017, Gartner Says (2017.10.12)
Worldwide semiconductor revenue is forecast to total $411.1 billion in 2017, an increase of 19.7 percent from 2016, according to Gartner, Inc. This represents the strongest growth since the 2010 recovery from the financial crisis when revenue increased by 31 |
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Mobile DRAM Prices to Go Up by 10~15% in 4Q17, Says TrendForce (2017.10.12)
DRAMeXchange, a division of TrendForce, estimates that mobile (LPDDR) DRAM products will see sequentially quarterly price increases in the average range of 10~15% in the fourth quarter of 2017. This price hike is attributed to DRAM suppliers seeking to correct price differences among various applications as well as the year-end busy season in the smartphone market |
IEEE1394 is a common interface standard that allows interconnected communication between computers and peripheral equipment. So rapidly the efficiency of the transmission speed, it is often applied in connection high density of signal transmission, the transmission quantity of peripheral devices.