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Electronic Science and Technology |
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Science and Technology
Allusion |
Unix is how come?
IBM's AIX, Sun's Solaris, HP's HP-UX, or Linux, etc., are from 1969, AT & T Bell Laboratories (Bell Labs) developed Unix reviewing this history, MULTICS (MULTiplexed Informationand Computing Service) plan is an important key. .
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Global Smartphone Production Growth to Drop to 5% in 2018, Says TrendForce (2018.01.03)
According to the latest research by TrendForce, Chinese smartphone brands have continued the prior year’s strong growth momentum in 2017, bringing the global smartphone production to 1.46 billion units, an increase of 6.5% compared with 2016 |
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SEMI Data Projects New Highs in Fab Equipment Spending; Samsung to Increase 128% (2018.01.03)
The year-end update to the SEMI World Fab Forecast report reveals 2017 spending on fab equipment investments will reach an all-time high of $57 billion. High chip demand, strong pricing for memory, and fierce competition are driving the high-level of fab investments, with many companies investing at previously unseen levels for new fab construction and fab equipment |
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HOLTEK New HT45FH23A/HT45FH24A Smoke Detector MCUs with Power Line Transceiver (2018.01.02)
Holtek announces the release of its low power consumption fire protection application Flash MCU series, the HT45FH23A and the HT45FH24A. With their two line transceiver function, the devices are especially suitable for use in network type fire protection terminals such as smoke detectors, temperature detectors, electrical fire detectors, fire door monitors in addition to many others |
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The Top 10 Key ICT Trends to Observe in 2018 (2018.01.02)
TAIPEI, Taiwan - While the ICT industry will move towards new aspects of intelligence, openness, service, and integration, 10 key trends are to reshape the landscape of the industry in 2018, according to Taipei-based and government-backed IT research institute MIC (Market Intelligence & Consulting Institute) |
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STMicroelectronics’ Single-Chip Balun for sub-1GHz Radio (2017.12.29)
STMicroelectronics has introduced a matched balun for its S2-LP 868-927MHz low-power radio transceiver to help engineers save board space and minimize RF-circuit design challenges in size- and cost-conscious products like IoT sensors, smart meters, alarms, remotes, building automation, and industrial controls |
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Macronix to Increase Its Advanced Process Manufacturing Capacity Next Year (2017.12.29)
TAIPEI, Taiwan - Taiwanese memory solution provider Macronix announced today that its board of directors had approved its capital expenditure budget for next year, totaled NT$ 3.89 billion yuan, an increase of more than 60% over this year |
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The Industry's First Dual-Mode Battery Charge ICs (2017.12.29)
ROHM has recently announced the availability of dual-input boost-buck charging ICs that support 1 to 4 battery cells for notebook PCs, smartphones, and power banks that utilize the latest charging technologies such as wireless and USB Power Delivery (USBPD) |
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HOLTEK New High Noise Immunity BS83B04C/08C/12C/16C Touch Flash MCUs (2017.12.29)
The BS83xxxC series of devices are Holtek's newly released Touch Key Flash MCUs. In addition to including all the advantages of the BS83BxxA touch key Flash MCUs, this new series has better noise immunity, allowing them to resist various types of noise interference such as power noise, RF interference, power fluctuations, etc |
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ATOUN to Launch New Power Assist Suits with 40% Weight Reduction for the Hip, Suitable for Caregivin (2017.12.29)
In April 2018, ATOUN Inc. will begin selling the all new Power Assist Suit for the hip "ATOUN MODEL Y," which is 40% lighter in weight than the current model.
ATOUN developed the new "ATOUN MODEL Y" by reexamining the design and control from scratch based on user feedback of the current model, and also successfully reduced weight by 40% by replacing the metal frame with one made of resin, and making the motors and batteries more compact |
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Chinese Vendors Value the Development of Service Robots over Industrial Robots (2017.12.27)
The service robots on exhibition in the WRC 2017 could be roughly grouped into three categories: consumer/domestic robots, customer service robots, and logistics robots, according to Taipei-based IT research institute MIC (Market Intelligence & Consulting Institute) |
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HOLTEK New BH66F5232 24-bit A/D MCU (2017.12.27)
Holtek announced the release of a new addition to its 24-bit Delta Sigma A/D Flash type range, the BH66F5232.
The device has the advantage of excellent anti-RF interference capability, making it very suitable for use in poor 24-bit A/D measurement application environments |
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Taiwan's ITRI Creates 3D Printed Bone Material for Ethnic Chinese People (2017.12.27)
TAIPEI, Taiwan - The Industrial Technology Research Institute of Taiwan has integrated 3D printing layered manufacturing with metal and composite materials and bionic bone structures to research and develop bone material especially designed for ethnic Chinese people |
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36.9% of Taiwanese Internet Users Have Done Cross-border Shopping, MIC Says (2017.12.25)
The online shopping value of internet users who have crossed the border to do shopping tends to be higher than those who haven't had, according to Taipei-based IT research institute MIC (Market Intelligence & Consulting Institute) |
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LEDs Took Half a Billion Tons of Carbon Dioxide From the Sky in 2017, IHS Markit Says (2017.12.22)
The use of LEDs to illuminate buildings and outdoor spaces reduced the total carbon dioxide (CO2) emissions of lighting by an estimated 570 million tons in 2017. This reduction is roughly equivalent to shutting down 162 coal-fired power plants, according to IHS Markit |
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SEGA Entertainment and Acer’s StarVR Introduce Premium VR Arcade Experiences to Japan (2017.12.22)
SEGA Entertainment and premium Virtual Reality (VR) solutions provider StarVR today announced its collaboration to bring StarVR arcade experiences to existing SEGA Game Center locations throughout Japan.
StarVR will work with SEGA Entertainment to roll out its industry-leading headset and VR arcade experiences across the country, at three SEGA arcade locations by March 2018 and at more than ten locations by the end of the year |
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China’s JHICC, Innotron Memory and Tsinghua Unigroup Emerge As Major Domestic Suppliers (2017.12.21)
TrendForce’s latest report outlines the landscape of China’s dynamic and fast-growing semiconductor industry, and reveals that the memory segment will be a focus for the industry, considering that China now heavily relies on imported semiconductor components, and that semiconductor is a sensitive sector which may have potential applications in national security |
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Global Mobile Industry Ready to Start Full-Scale Development of 5G NR (2017.12.21)
Today the 3GPP TSG RAN Plenary Meeting in Lisbon successfully completed the first implementable 5G NR specification. AT&T, BT, China Mobile, China Telecom, China Unicom, Deutsche Telekom, Ericsson, Fujitsu, Huawei, Intel, KT Corporation, LG Electronics, LG Uplus, MediaTek, NEC, Nokia, NTT DOCOMO, Orange, Qualcomm Technologies, Inc |
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Broadcom Announces Industry’s First Silicon-Proven 7nm IP for ASICs in Deep Learning and Networking (2017.12.21)
Broadcom today announced the industry’s first silicon-proven 7nm intellectual property (IP) for an ASIC platform targeting deep learning and networking applications. Based on TSMC 7nm process technology, the platform offers best-in-class IP cores which include high speed SerDes, HBM PHY, Die2Die PHY, mixed-signal IP, and foundation IP such as standard cells, SRAM, TCAM memory, and I/O cells |
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UMC Announces Availability of 40nm SST Embedded Flash Process, Toshiba Expected to Utilize (2017.12.21)
HSINCHU, Taiwan - United Microelectronics Corporation today announced the availability of the company’s 40nm process platform that incorporates Silicon Storage Technology’s (SST) embedded SuperFlash non-volatile memory. The newly available 40nm SST process features a 20% reduction in eFlash cell size and 20-30% macro area over UMC’s mass production 55nm SST technology |
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TriLumina to Demonstrate 3D Solid-State LiDAR Using Its VCSEL Illumination Solutions at CES 2018 (2017.12.21)
At CES 2018, TriLumina will demonstrate multiple use cases for its innovative 940 nm VCSEL illumination modules, including a novel solid-state 3D LiDAR system powered by its illumination modules, which will be showcased at the company's Suite at the Westgate Hotel as well as in the Leddar Ecosystem Pavilion |
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