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TI Introduces the Most Accurate Single-Chip Ultrasonic Sensing MCU for Smart Water Meters (2017.09.27)
Texas Instruments (TI) unveiled a new family of MSP430 microcontrollers (MCUs) with an integrated ultrasonic sensing analog front end that enables smart water meters to deliver higher accuracy and lower power consumption. In addition, TI introduced two new reference designs that make it easier to design modules for adding automated meter reading (AMR) capabilities to existing mechanical water meters |
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NVIDIA Expands Deep Learning Institute AI Training Partnerships in China (2017.09.27)
NVIDIA is expanding its Deep Learning Institute initiative in China by partnering with Tencent and Leadtek to provide hands-on AI training to developers, researchers and data scientists.
The partnerships were announced at GTC China, in Beijing, where more than 3,500 developers, corporate executives and entrepreneurs are gathered to discover how GPU technologies are creating breakthroughs in AI, intelligent machines and self-driving cars |
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NAND Flash Market to Regain Balance in 2018 with Annual Bit Supply Growing by 42.9%, TrendForce Says (2017.09.27)
Demand has exceeded supply in the global NAND Flash market for six consecutive quarters since the third quarter of 2016, according to the latest research from DRAMeXchange, division of TrendForce. During this 2017, NAND Flash demand continues to expand because of the increase in average memory content of smartphones and the strong server market |
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Faraday Launches SoReal! 2.0 Virtual Platform to Support Its FPGA Board (2017.09.27)
HSINCHU, Taiwan - Faraday Technology Corporation today announced the availability of its SoReal! 2.0 Virtual Platform. The upgraded solution enables Faraday’s SoCreative! FPGA board to connect to the customized SoC virtual platform, becoming a mixed prototyping approach |
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Portwell Launches the WEBS-13D1 Rugged Fan-less Embedded System Featuring Intel Atom E3900 Family (2017.09.27)
Portwell announces the launch of the WEBS-13D1 fan-less embedded system featuring Intel Atom processor E3900 product family (codenamed Apollo Lake). Its rugged and compact design, plus low power consumption, makes WEBS-13D1 a perfect solution to support applications for kiosk, image processing, digital signage, medical and the harsh environments of factory automation |
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Avalue Introduces Pico-ITX Industrial Motherboards, EPX-APLP (2017.09.27)
Avalue Technology is unveiling EPX-APLP Pico-ITX industrial motherboards , based on Intel Celeron N3350 Processor Processors. The Pico-ITX SBC provides system developers and OEMs with an ultra-compact yet highly integrated platforms that deliver excellent computing performance to meet customer's demands in compact-size, fanless operation, low power consumption and versatile I/O |
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AMBER Wireless Presents Its Design kit for Raspberry Pi: AMBER PI (2017.09.26)
AMBER wireless GmbH offers a design kit with which developers can realize applications for wireless connection in the sub-GHz band. AMBER PI is a plug-on board for the Raspberry Pi 3B. Besides the power-saving sub-GHz wireless interface from AMBER wireless, the board is equipped with integrated sensors for temperature, humidity, air pressure and movement |
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Toshiba Launches 10-terabyte Enterprise Capacity HDD (2017.09.26)
Toshiba Electronic Devices & Storage Corporation announced the addition of an 10-terabyte (TB) SATA model to its MG06 series of 3.5-inch, enterprise capacity class hard disk drives (HDD). Shipments start from today.
The continuing progress of digitization |
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Taiwan’s CPT Successful Lights QLED Display Technology (2017.09.26)
TAIPEI, Taiwan - AMOLED self-illuminating display panels have been pushed to the limit of thinness and have become the top choice for high-end display panels on mobile devices. However, this technology is now faced with a new contender |
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Broadcom Introduces World’s First Dual Frequency GNSS Receiver (2017.09.25)
Broadcom Limited announced the world’s first mass-market, dual frequency GNSS receiver device, the BCM47755, designed to enhance location based services (LBS) applications for mobile phones, tablets and fitness wearables.
Equipped with the latest GNSS innovations |
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Intel Unveils the 8th Gen Intel Core Processor Family for Desktop Featuring Best Gaming Ability (2017.09.25)
Intel today announced that its new family of 8th Gen Intel Core desktop processors will be available for purchase beginning Oct. 5, 2017.
The new desktop processor family is built for gamers, content creators and overclockers who require premium performance |
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HOLTEK New BA45F0082/BA45FH0082 Fire Protection Application MCUs (2017.09.25)
Holtek announces the release of its new low power consumption fire protection application Flash MCU series, the BA45F0082 and the BA45FH0082. These devices will find excellent use in fire protection peripheral product applications such as independent temperature detecting alarms, Input/Output modules, temperature detectors, electrical fire detectors, acousto-optical alarms, fire door monitoring in addition to many others |
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New High Speed Signal Transmission Photorelays From Toshiba with Industry's Smallest Footprint (2017.09.25)
Toshiba Electronic Devices & Storage Corporation (TDSC) announced the launch of two high speed signal transmission photorelays, “TLP3475S” and “TLP3440S,” that realize the industry’s smallest footprint. Shipments start today |
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RTI and NEC Announce the SEA-US Submarine Cable Is Ready for Commercial Service (2017.09.25)
RAM Telecom International, Inc. (RTI) and NEC Corporation announced that the Southeast Asia - United States Cable System (SEA-US) is ready for commercial service following acceptance by the SEA-US consortium, and that construction has commenced on the Hong Kong - Guam Cable System (HK-G) extension |
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North American Semiconductor Equipment Industry Posts $2.18B in Billings in August (2017.09.25)
North American Semiconductor Equipment Industry Posts $2.18B in Billings in August
North America-based manufacturers of semiconductor equipment posted $2.18 billion in billings worldwide in August 2017 (three-month average basis), according to the August Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI |
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Over 30% of Smartphones Shipped in 2018 to Carry OLED Panel as iPhone X Revealed, TrendForce Says (2017.09.22)
WitsView, a division of TrendForce, anticipates OLED’s representation in the smartphone market will increase substantially following the release of iPhone X. With Apple expected to support this display technology in the future, the percentage of OLED models in the total annual smartphone shipments worldwide is projected to climb from 28% this year to 33% in 2018 |
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ASUS Announces ZenFone 4 Family in Europe (2017.09.22)
Today, in Rome, ASUS CEO Jerry Shen unveiled the ZenFone 4 smartphones — ZenFone 4 Pro with gigabit connectivity, ZenFone 4, ZenFone 4 Selfie Pro, ZenFone 4 Selfie and ZenFone 4 Max — during the We Love Photo press event. ZenFone 4 is the first family of smartphones to all feature dual rear or dual front cameras, enabling users to capture the best photos in any scenario, at any distance, and in any lighting conditions |
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Toshiba Machine Opens New Technical Center for Machine Tools in Gotemba Plant (2017.09.22)
Toshiba Machine announced the opening of a new technical center for machine tools in its Gotemba plant in Japan that incorporates numerous features for developing machine tool businesses. The Technical Center conducts test ma |
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Mitsubishi Electric Develops SiC Power Device with Record Power Efficienc (2017.09.22)
Mitsubishi Electric Corporation announced that it has developed a silicon carbide (SiC) power device with what is believed to be the world’s highest power efficiency in a device of its type.
The newly-developed unit is designed to be installed in power modules, and does not require a high-speed protection circuit to interrupt supply when excess current is detected |
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New Camera and Display Mirrors Enhance Vehicle Safety and Fuel Efficiency, IHS Markit Says (2017.09.21)
Rear-view and side-view mirrors on new vehicles will begin to see major changes over the next decade, according to new analysis from business information provider IHS Markit. Combining high-definition cameras and displays in place of – or to complement – traditional mirror designs offers a compelling case for automakers to improve on fuel efficiency and battery range |
IEEE1394 is a common interface standard that allows interconnected communication between computers and peripheral equipment. So rapidly the efficiency of the transmission speed, it is often applied in connection high density of signal transmission, the transmission quantity of peripheral devices.