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Telink Semiconductor to Demonstrate Its Smart Solutions at Bluetooth Asia 2017 in Shenzhen (2017.09.18)
Telink Semiconductor, developer of highly integrated low power radio-frequency and mixed signal system chips for internet of things (IoT) applications, will be demonstrating a number of applications for smart lighting, smart home, retail and logistics based on its devices at the Bluetooth Asia 2017 conference taking place in Shenzhen, China on 26-27 September 2017 |
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AUO to Demonstrate Its LTPS Displays and AMOLED Technology at Touch Taiwan 2017 (2017.09.18)
AU Optronics Corp. (AUO) today announced its participation to Touch Taiwan 2017 from September 20 to 22. This year the exhibition highlights include AUO’s full range of LTPS displays, demonstrating the Company’s accomplishments in the field |
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Toshiba to Unveil Low Voltage 5GHz Receiver for Next-Generation Wireless LAN (2017.09.18)
Toshiba Electronic Devices & Storage Corporation (TDSC) announced development of a low voltage 5GHz receiver for the next-generation IEEE802.11ax1 wireless LAN. The company reported details of the technology on September 14th at the European Solid-State Circuits Conference in Belgium |
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Finance Is Moving to the Cloud Much Faster Than Expected, Gartner Says (2017.09.18)
According to Gartner, Inc. A recent Gartner survey of senior finance executives found that by 2020, 36 percent of enterprises will use the cloud to support more than half of their transactional systems of record.
Gartner sur |
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E Ink, Ueberall and the San Diego Airport to Introduce the World’s Largest e-Paper Media (2017.09.15)
E Ink Holdings, Ueberall International, and the San Diego International Airport, unveiled DAZZLE, a monumental public artwork featuring the largest deployment of E Ink’s Prism technology.
Located at the San Diego International Airport’s new Rental Car Center |
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New in the Portfolio: Cost-Effective Basler Lenses 2/3″ (2017.09.15)
After two successful years with the Basler Original lens series 1/2.5″, the family of Basler Lenses has new members: In addition to the Basler Original Equipment lenses with a resolution of 5 megapixels for sensors smaller than 1/2″, Basler now also offers lenses for sensors up to 2/3″ |
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Toshiba to Realize to the World’s Fastest Quantum Key Distribution Device (2017.09.15)
Toshiba Corporation and Toshiba Research Europe Limited’s Cambridge Research Laboratory in the UK have brought the enhanced security of quantum cryptography closer to practical realization with development of the world’s fastest quantum key distribution device |
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Strong Chinese Market to Push Annual Global Photovoltaic Demand, Says TrendForce (2017.09.15)
China will again take the leading share of the total annual photovoltaic (PV) demand worldwide in 2017, says the latest Gold Member Solar Report by EnergyTrend, a division of TrendForce.
China’s solar demand for this year has surpassed earlier expectations due to the surging installations of distributed PV systems |
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Toshiba Announces New Line-up of Stepping Motor Driver ICs with Anti-Stall Feedback Architecture (2017.09.14)
Toshiba Electronic Devices & Storage Corporation (TDSC) announced the addition of two stepping motor drivers, 4.5A “TB67S249FTG” and 2A “TB67S279FTG,” to its line-up of stepping motor drivers with innovative anti-stall feedback architecture, which realizes highly efficient motor control |
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TI Introduces Its First Educational Robot, the TI-Innovator Rover (2017.09.14)
Texas Instruments (TI) announced the TI-Innovator Rover, the company's first robotics solution for middle and high school students that makes learning STEM subjects a moving experience. Students can write programs on their TI graphing calculators that get Rover's wheels turning and their minds learning in a fun, interactive and hands-on way |
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Taiwan's ITRI Showcases Flexible Fan-out Panel Level Packaging Technology at SEMICON Taiwan (2017.09.14)
TAIPEI, Taiwan - Fan-Out Wafer Level Packaging technology can package different die in one chip, is a key technology of the development of ultra-thin devices. Taiwan's Industrial Technology Research Institute(ITRI) showcased its flexible Fan-Out 3 Layers RDL panel level packaging technology at this year's SEMICON Taiwan, which not only can reduce the thickness of chip and power consumption, but also can increase the output of chip packaging |
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ITRI and Japan’s LINTEC Codevelop Solution Coated Gas Barrier Technology (2017.09.14)
TAIPEI, Taiwan - ITRI and LINTEC have successfully developed the solution coated gas barrier technology that possesses outstanding gas barrier and optical properties. As opposed to the conventional PECVD process, this technology adopts a coating process that effectively reduces costs and time required in manufacturing and eases the mass production of flexible displays |
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eMemory Receives 2017 TSMC IP Partner Award (2017.09.14)
HSINCHU, Taiwan – eMemory announced today that it received TSMC’s Open Innovation Platform (OIP) “IP Partner Award” of 2017.
The company has been honored with this award in the “Specialty Embedded Memory IP” category every year from its inception in 2010 |
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ASUS Launches $50 Million Venture Capital Fund with Fenox Venture Capital (2017.09.14)
AsusTek Computer is partnering with Silicon Valley-based Fenox Venture Capital to launch a US$50 million venture fund. This partnership with Fenox Venture Capital will serve as a gateway for ASUS to access top technology startups through Fenox VC’s global network |
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MicroVision and WPG Holdings Enter Distribution Agreement for Asia (2017.09.14)
TAIPEI, Taiwan - MicroVision and WPG Holdings today announced that they have entered into an agreement for distribution of MicroVision’s line of PicoP scanning engines across Asia.
WPG will distribute MicroVision’s engine products in China, Taiwan, Japan, Korea, India and Southeast Asia through its subsidiaries AIT Group, WPG Korea and South Asia |
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Power Integrations Launches InnoSwitch3, a 94%-Efficient Offline Flyback Switcher IC Family (2017.09.13)
Power Integrations announced the release of its InnoSwitch3 family of offline CV/CC flyback switcher ICs. The new devices achieve up to 94% efficiency across line and load conditions, slashing power supply losses by a further 25% and enabling the development of compact power supplies up to 65 W without heatsinks |
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New Power Supply IC Featuring the Industry's Highest Step-Down Ratio (2017.09.13)
ROHM has recently announced the availability of a DC/DC converter with built-in MOSFET that achieves the highest step-down ratio in the industry (at 2MHz) required for 48V automotive systems such as mild hybrid vehicles.
The BD9V100MUF-C integrates ultra-high-speed pulse control technology (Nano Pulse Control) created by combining proprietary circuit design and layout with original processes, enabling low voltage 2 |
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2017 Fab Equipment Spending Expected to Increase by 37%, Reaching a New Record (2017.09.13)
The latest update to the World Fab Forecast report, published by SEMI, reveals record spending for fab equipment. The report shows 30 facilities and lines with over $500 million in fab equipment spending. 2017 fab equipment spending (new and refurbished) is expected to increase by 37 percent, reaching a new annual spending record of about US$55 billion |
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TSMC Nanjing Factory Starts Installing, Becomes China's First 16nm Base (2017.09.13)
TAIPEI, Taiwan - An installation ceremony was held yesterday for Taiwan Semiconductor Manufacturing Company, Limited's (TSMC) 12-inch chip manufacturing plant in Nanjing, China, with Chairman Morris Chang in attendance to deliver a speech |
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Asia Pacific Game Summit Unveils Further Insights into Japan's Gaming Industry (2017.09.13)
TAIPEI, Taiwan - Taiwan, with the unique geographic advantage, is the hub and business gateway to connecting Northeast and Southeast Asia. Taipei Computer Association (TCA) created Asia Pacific Game Summit (APGS) to facilitate exchanges among gaming industries across the Asia Pacific region |
Overall, the number of times the Bus specification standard is rising between mainframe computers and peripherals, data transfer speed, capacity and quality of the application process. Let's Introduction to several important bus application specifications.