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ST Collaborates with iFLYTEK for Chinese Voice-Recognition Cloud Services (2017.03.17)
STMicroelectronics and iFLYTEK, one of the leading voice-recognition cloud service providers in China, have introduced the market's first IoT development platform that enables voice-recognition cloud services in Chinese.
The new platform combines ST's SensorTile multi-sensor module, STM32 ODE (Open Development Environment), and Open |
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HOLTEK New BC68F2130/2140 Sub-1GHz RF Transmitter OOK/FSK SoC Flash MCU (2017.03.17)
Holtek announced its new RF transmitter SoC Flash MCUs, the BC68F2130 and BC68F2140, which are specifically designed for use in the Sub-1GHz RF application area.
The integrated RF transmitter can operate at the 315MHz, 433MHz, 868MHz and 915MHz frequency bands and support OOK/FSK modulation types |
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U.S. Companies Still Hold Largest Share of Fabless Company IC Sales (2017.03.17)
According to IC Insights that fabless IC suppliers represented 30% of the world’s IC sales in 2016 (up from only 18% ten years earlier in 2006). As the name implies, fabless IC companies do not have an IC fabrication facility of their own |
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SMIC Signs License Agreement For Invensas’ DBI Technology (2017.03.15)
Semiconductor Manufacturing International Corporation ("SMIC") has executed a technology transfer and license agreement for Invensas’ Direct Bond Interconnect (DBI) technology. Through this agreement, SMIC will be able to offer this bonding technology for use by image sensor manufacturing customers |
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Bosch Announces AI Self-Driving Computer with NVIDIA (2017.03.15)
Bosch today announced it is working with NVIDIA to develop artificial intelligence self-driving systems for mass market cars.
Bosch CEO Dr. Volkmar Denner unveiled the collaboration during his keynote address at Bosch Connected World, in Berlin, at Bosch Group's annual Internet of Things conference |
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Intel Acquires Mobileye in Anticipation of Self-Driving Cars in 2021, Says TrendForce (2017.03.15)
Intel on March 13 announced that the company will purchase Mobileye, a global provider of advanced driver assistance system (ADAS). This deal is worth US$15.3 billion and is another indication that major semiconductor manufacturers are aggressively jockeying for a favorable position in the fast growing automotive electronics market |
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Portwell's New Module Solution with the 7th Intel Mobile H Series CPU in Basic Size (2017.03.15)
Portwell announces the release of the PCOM-B643VG, a COM Express Type 6 Basic Module(125mm x 95mm) based on the 7th Generation Intel Core mobile processor (codenamed Kaby Lake-H) and Intel QM175 and CM238 express chipset. This module includes Intel Turbo Boost Technology for faster processing, Intel vPr Technology for superior remote capabilities and Intel Hyper-threading Technology for multithreading |
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UMC and Synopsys Collaboration Speeds 14-nm Custom Design (2017.03.15)
HSINCHU, Taiwan - United Microelectronics Corporation (UMC) and Synopsys today announced that the two companies have worked together to enable Synopsys Custom Compiler and Laker custom design tools to be used with UMC's 14-nanometer (nm) FinFET process |
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Uwin Nanotech and Xin Ye Industry Assisting the Philippines in Establishing Green Mining Procedures (2017.03.14)
TAIPEI, Taiwan – Taiwanese environmentally-friendly precious metals recycling solutions provider Uwin Nanotech and Philippines Xin Ye Industry, Ltd. Inc. are currently collaborating with the Philippines government to establish environmentally-friendly and efficient mining procedures for the Philippines' mining industry |
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New tinyAVR MCUs Increase System Throughput While Lowering Power Consumption (2017.03.14)
Microchip Technology has further expanded its AVR microcontroller (MCU) portfolio by adding three new devices to the tinyAVR MCU family. The new ATtiny1617 series of MCUs expand the range of AVR devices that feature Core Independent Peripherals (CIPs), which help increase system throughput while lowering overall power consumption |
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Marvell Introduces Its New Prestera PX Passive Intelligent Port Extender (PIPE) Family (2017.03.14)
Marvell introduced its new Prestera PX Passive Intelligent Port Extender (PIPE) family, designed to dramatically reduce power consumption, complexity and cost in the data center. Until now, data centers with 10GbE and 25GbE port speeds have been challenged with achieving lower operating expense (OPEX) and capital expenditure (CAPEX) costs as their bandwidth needs increase |
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ST and DSP Concepts to Give STM32 Users Free Access to Advanced Audio Design Tool (2017.03.14)
ST has worked with DSP Concepts, creator of the Audio Weaver design suite, to present a free version of the tool - ST-AudioWeaver - for developers using its 32-bit ARM Cortex-M based STM32 microcontrollers.
Audio Weaver enables product designers to build complex digital audio applications without coding |
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Analog Bits Announces Mixed Signal Design Kits for 7nm at TSMC Technology Symposium (2017.03.14)
Analog Bits today announced availability of front-end design kits which enable use of low power IP on TSMC's latest 7nm process nodes. These design kits provide customers with early access to Analog Bits' latest low-power IP for SERDES, PLL, PVT sensors and POR - which are already shipping in other TSMC nodes such as 16FFC and 16FFP which will be demonstrated at the Symposium |
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India to Overtake Japan as the Third Largest Solar Market (2017.03.14)
The global solar market has yet to show signs of turnaround after going through the turbulent 2016. The latest Gold Member Solar Report by EnergyTrend, a division of TrendForce, forecasts that the global PV demand for 2017 will total just 73 |
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u-blox Introduces the Most Secure Wi-Fi Modules for Industrial Markets (2017.03.14)
u-blox announced two new Wi-Fi modules for industrial markets. NINA-W131 and NINA W132 are ultra low power Wi-Fi modules supporting 802.11 b/g/n in the 2.4GHz ISM band. They are the first two variants of the new NINA-W1 module series |
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Tight NAND Flash Supply to Cause Prices of Mainstream SSDs to Jump by More Than 10% in Q1 (2017.03.13)
DRAMeXchange, a division of TrendForce, reports that client-grade SSDs of mainstream capacities continue to see rising contract prices in the PC-OEM market during this first quarter. On average, contract prices of MLC-based client-grade SSDs are projected to go up by 12~16% compared with the fourth quarter of last year, while prices of TLC-based products are expected to increase by 10~16% sequentially |
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Mitsubishi Electric Finishes Construction of Superconducting-magnet Plant (2017.03.13)
Mitsubishi Electric Corporation announced that it has completed construction of a superconducting-magnet manufacturing plant at its Transmission and Distribution Systems Center in Ako, Hyogo Prefecture, Japan.
The Ako plant will increase the company’s capacity to produce superconducting magnets used in magnetic resonance imaging (MRI) machines, semiconductor-manufacturing equipment and other sophisticated apparatus |
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Samsung Electronics Completes Acquisition of HARMAN (2017.03.13)
Samsung Electronics today announced it has completed the previously announced acquisition of Harman International Industries, Incorporated. Under the terms of the merger agreement, HARMAN stockholders will receive $112.00 per share in cash |
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WiseChip Is Showcasing Its Innovative Applications of PMOLED at embedded world 2017 (2017.03.13)
TAIPEI, Taiwan – PMOLED technology is showing its potentiality in various industries. And WiseChip Semiconductor, a Taiwanese OLED solutions provider, who fully displays the unlimited border of applications of the PMOLED technology |
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COMPUTEX Issues Last Call for Tech Companies to Submit Innovations for 2017 d&i awards (2017.03.10)
TAIPEI, Taiwan - COMPUTEX TAIPEI today announced last call for companies to submit their newest ICT products for the tenth annual d&i (design and innovation) awards. The awards are organized by the Taiwan External Trade and Development Council (TAITRA) and Germany’s International Forum Design (iF) |
One wants to meet different market needs of general-purpose interface Bus standards, can continue to upgrade transmission speeds and greater bandwidth, to achieve speed, capacity, quality and other multivariate integration, enhance the effectiveness of desire?