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Commodity-filled Discretes Devices Accounted for 44% of All Semiconductor Unit Shipments in 2016 (2017.03.10)
Annual total semiconductor unit shipments (integrated circuits and opto-sensor-discrete, or O-S-D, devices) are forecast to continue their upward march in the next five years and are now expected to top one trillion units for the first time in 2018, according to the IC Insights |
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Alibaba Collaborating with Intel on an FPGA-based Cloud Services Solution (2017.03.10)
Alibaba Cloud (Aliyun), has announced a pilot program with Intel for a cloud-based FPGA (field programmable gate array) acceleration service with the goal of enabling customers to have virtual access to powerful compute resources in the cloud to help them manage business, scientific and enterprise data application workloads more effectively |
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Apple Pay to Tremendously Penetrate into Taiwan Local Market, Says TrendForce (2017.03.09)
Apple Pay is set to arrive in Taiwan this year, making the island the 14th market in its global expansion. Kelly Hsieh, senior research manager of TrendForce, stated that that iPhone devices currently has nearly a third of the smartphone market share in Taiwan, and this will help Apple Pay tremendously in |
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NVIDIA, Microsoft Launch Industry-Standard Hyperscale GPU Accelerator for AI Cloud Computing (2017.03.09)
NVIDIA with Microsoft today unveiled blueprints for a new hyperscale GPU accelerator to drive AI cloud computing.
Providing hyperscale data centers with a fast, flexible path for AI, the new HGX-1 hyperscale GPU accelerator is an open-source design released in conjunction with Microsoft's Project Olympus |
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E Ink and DNP Announce New Point-of-Purchase Advertising Tool (2017.03.09)
Dai Nippon Printing Co., Ltd. (DNP), in conjunction with E Ink today announced the development of a new point-of-purchase (POP) advertising tool capable of changing colors and patterns in line with consumer shopping behaviors |
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New Line-up of 9- and 24-channel Output ICs Realizes Downsizing of Various LED Modules (2017.03.09)
Toshiba Corporation's Storage & Electronic Devices Solutions Company today announced the launch of “TB62D787FTG,” a new LED driver IC with a single-wire input and 24-channel output, for amusement equipment and LED illumination applications |
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ST Announces Volume Production of Industry-Unique Satellite Demodulator with Lead Customer Newtec (2017.03.09)
STMicroelectronics announced the volume production of the world's first 500Mbaud High Symbol Rate (HSR) integrated tuner-demodulator chip, selected by its lead customer Newtec, a specialist in designing, developing, and manufacturing equipment and technologies for satellite communications |
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The Latest Release of Moldex3D R15.0 Streamlines Simulation Workflow (2017.03.09)
CoreTech System (Moldex3D), the global leading provider of plastic injection molding simulation solutions, today introduced the latest release of Moldex3D R15.0. This newest version offers enhanced performance, accuracy and efficiency to streamline simulation workflow and provide faster turnaround times |
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Greenvity Wideband PLC Chips Provide True Energy Savings for Next Generation of Smart Meters (2017.03.09)
Greenvity Communications announces the Hybrii-LB GV7013LB, an innovative system-on-chip (SoC) with Wideband Power Line Communication (WB PLC) technology that provides high speed, reliable and extended range communication for next-generation smart meter applications |
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TI Introduces Industry's First 4-20mA DAC with Integrated Buck/Boost Converter (2017.03.08)
Texas Instruments (TI) introduced a digital-to-analog converter (DAC) that combines industry-leading precision performance with simpler power-supply design. The 16-bit DAC8775 operates from a single, wide 12- to 36-V power rail, leveraging an integrated buck/boost converter to generate all of the required internal power supplies to save designers time, cost and significant board space |
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China to Dominate 4K and 8K TV Shipments Through 2020, IHS Markit Says (2017.03.08)
China will continue to dominate the 4K TV market, with 42 percent of all TVs in 2017 expected to ship with 4K panels, according to a white paper released by IHS Markit.
In 2016, more than 25 million 4K TVs shipped in China. By 2020, that number is expected to almost double to 44 million, the same as the next two regions (Western Europe and North America) combined |
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600V/500V High Voltage Intelligent Power Devices for Fan Motors (2017.03.08)
Toshiba Corporation’s Storage & Electronic Devices Solutions Company today announced the launch of a new line-up of high voltage intelligent power devices (IPDs) in small-size packages for use in various fan motors including air conditioners, air cleaners and pumps |
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Prices of LED Light Bulbs Fell in February, Says TrendForce (2017.03.08)
LEDinside, a division of TrendForce, reports that the global average sales price (ASP) of 40-watt equivalent LED replacement light bulbs came to US$6.8 this February, down 0.6% from the prior month. As for 60-watt equivalent counterparts, their global ASP in the same month stood at US$8 |
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M31 Deploys a Full Range of IP for TSMC 16nm FFC Process (2017.03.08)
HSINCHU, Taiwan - H.P. Lin, Chairman of M31 Technology today announced that it deploys a full range of silicon IP in TSMC's 16nm FFC (FinFET Compact) process technology.
The advanced 16nm FFC process not only enables more IC functions with less space, but also dramatically enhances the circuits by reducing leakage currents |
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eMemory’s NeoFuse Implemented in HV Process for OLED Application (2017.03.08)
HSINCHU, Taiwan – NVM IP provider eMemory announces today its NeoFuse IP has been extensively implemented in High Voltage(HV) platforms across all process nodes from 0.11um to 40nm in six leading foundries responding to the rising demand for Organic Light Emitting Diode (OLED) display applications |
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NAND Flash Revenue Grew 17.8% Sequentially in Fourth Quarter of 2016, TrendForce Says (2017.03.07)
DRAMeXchange, a division of TrendForce, reported that in the fourth quarter of 2016, the NAND Flash market was at its most severe phase of shortage for the year while shipments in the end device markets were robust. Consequently, average sales prices (ASPs) of NAND Flash products rose significantly, and the fourth-quarter global NAND Flash revenue registered a large sequential increase of 17 |
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New UFS 2.1 Controller Family from Silicon Motion (2017.03.07)
Silicon Motion Technology Corporation announced the launch of its new UFS (Universal Flash Storage) 2.1 controller family, a complete product line supporting UFS HS-Gear3x1L and HS-Gear3x2L, enabling high-performance, high capacity and low power embedded memory for mobile phones |
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100V No-Opto Flyback Regulator Operates at 150°C Delivering up to 24W (2017.03.07)
Linear Technology Corporation announces the H-grade versions of the LT8304/-1, monolithic flyback regulators with guaranteed operation for junction temperatures as high as 150°C. By sampling the isolated output voltage directly from the primary-side flyback waveform, the part requires no opto-coupler or third winding for regulation |
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Keysight Technologies Works with Huawei on Phase II of China 5G Technology R&D Trial (2017.03.07)
Keysight Technologies today announced that it has begun working with Huawei on phase II of the China 5G Technology R&D Trial. Using its industry-leading UXA N9040B signal analyzer and 89601B VSA signal analysis software, Keysight has conducted the first integration tests with Huawei’s 5G prototype base station |
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Silicon Labs Announces Micrium OS and New Platform Builder (2017.03.07)
Silicon Labs announced that Micrium OS, the latest evolution of the proven embedded µC/OS real-time operating system (RTOS), is now available. Micrium OS comes with an optimized RTOS kernel, communication stacks, file system and graphical user interface |
Overall, the number of times the Bus specification standard is rising between mainframe computers and peripherals, data transfer speed, capacity and quality of the application process. Let's Introduction to several important bus application specifications.