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MediaTek’s 10nm Helio X30 Chip Is Entering Mass Production (2017.02.28)
MediaTek announced at 2017 MWC that its Helio X30 SoC mobile processor is entering the mass production stage, the first smartphone equipped with this flagship chip will be introduced in the second quarter of this year.
MediaTek X30 is a high-end mobile CPU equipped with ten cores and three clusters architecture of computing, which is the first chip in the market using 10 nanometer process technology |
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ZTE Launches Industry's First IP+Optical 5G Flexhaul Transport Solution (2017.02.28)
ZTE Corporation today released at Mobile World Congress, Barcelona, the industry's first IP+Optical 5G Flexhaul solution, a fronthaul and backhaul integrated solution based on Internet protocol (IP)+Optical technology.
By adopting the new IP+Optical architecture |
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MediaTek, Nokia Collaborate to Enable First Wave of 5G Networks and Devices (2017.02.28)
MediaTek and Nokia announced plans to collaborate on the design of a next-generation mobile communication system for 5G technology. Both companies are contributing actively to 5G standardization in line with the Third Generation Partnership Project (3GPP) |
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Taiwan Excellence Presents the Acer, Advantech, D-Link, and IEI Integration Latest Products at MWC (2017.02.28)
Taiwan and implemented by the Taiwan External Trade Development Council (TAITRA) , the exclusive showcase of innovation and excellence in the ICT industry will be unveiled on the opening day of MWC 2017. This dedicated event for experts in the ICT industry on 27 th February will give firsthand news from four Taiwanese companies - Acer, Advantech, D-Link, and IEI Integration regarding their latest products |
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Smartphone Takes Up Nearly 40% of the Global DRAM Market in 2H 2016 (2017.02.28)
According to Taipei-based IT research institute MIC (Market Intelligence & Consulting Institute). Worldwide smartphone shipments hit 1.43 billion units for the full year of 2015 and are expected to have reached 1.5 billion units in 2016 |
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PlayStation VR Sells Over 915,000 Units Worldwide, Sony Says (2017.02.28)
Sony Interactive Entertainment (SIE) today announced that PlayStationVR (PS VR) has cumulatively sold through 915,000 worldwide as of February 19, 2017.
“Since its October launch, PS VR continues to be well received by people around the world thanks to the high quality, revolutionary VR experience it offers |
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TSMC's 5nm Process Scheduled to Enter Risk Production in 2019 (2017.02.24)
TAIPEI, Taiwan - TSMC Co-CEO Mark Liu said yesterday that TSMC will take the lead in providing the 5nm node process technology. The company is officially entering the technology development stage and scheduled to enter risk production in the first half of 2019, at least six months ahead of original schedule |
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ASRock Launches New AMD Ryzen Motherboards (2017.02.24)
ASRock announced the launch of its series of AMD AM4 socket based X370 and B350 motherboards – celebrating AMD’s return to the CPU arena with the all-new, high-performance Ryzen processor. ASRock has created distinctive X370 motherboards to match all your needs, with unique features and a full range of products for gamers, power users, tech geeks and even DIY beginners |
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Taiwan Maintains Largest Share of Global IC Wafer Fab Capacity, IC Insights Reports (2017.02.24)
According to IC Insights’ latest report that Taiwan led all regions/countries in wafer capacity with 21.3% share, a slight decrease from 21.7% in 2015 when the country first became the global wafer capacity leader.
IC Insights noted that Taiwan was only slightly ahead of South Korea, which was in second place |
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Contract Prices of SSDs and eMMCs to Increase 5~10% in Q2, TrendForce Forecasts (2017.02.23)
The global supply of 2D-NAND Flash will remain tight going into the second quarter of 2017, according to the latest analysis from DRAMeXchange, a division of TrendForce. Also, major smartphone brands will soon begin their first wave of new product release for the year after the Mobile World Congress in Spain |
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NEC Plans to Reorganize Business Structure (2017.02.23)
NEC Corporation today announced plans to reorganize its business structure as of April 1, 2017 in order to further contribute to the resolution of social issues facing regions across Japan through its Solutions for Society, which leverage ICT to create advanced social infrastructure |
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AUO Expands 8.5G Production Capacity to Occupy 65” TV Market (2017.02.23)
TAIPEI, Taiwan - Taiwanese display panel manufacturer AUO stated that in order to satisfy the global demand for large-sized LCD television panels, they will begin the second phase of expansion of their 8.5 generation production lines |
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GTOP Launches Titan X1, The Smallest Multi-interface GNSS Patch Antenna Module (2017.02.23)
GlobalTop Technology announces the launch of Titan X1, a state of the art Multi-GNSS Patch module with an ultra-compact size, especially designed for applications where small foot-print, ease-of-integration and flexible interface options are essential in addition to robust positioning performance |
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Samsung Launches Premium Exynos 9 Series Processor Using10nm FinFET Process Technology (2017.02.23)
Samsung Electronics today announced the launch of its latest premium application processor (AP), the Exynos 9 Series 8895. This is Samsung’s first processor chipset to take advantage of the most advanced and industry leading 10-nanometer (nm) FinFET process technology with improved 3D transistor structure, which allows up to 27% higher performance while consuming 40% less power when compared to 14nm technology |
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HOLTEK New HT66F4530/4540/4550 Flash MCUs with 4-level Adjustable Bandwidth OPAs (2017.02.23)
Holtek announced the release of its new A/D with OPA Flash MCUs, the HT66F4530, HT66F4540 and HT66F4550. One of the chief features of these devices is in their 4-level adjustable bandwidth integrated operational amplifiers. This feature makes these devices especially suitable for use in sensor related applications which have low power consumption requirements or demand short response times, such as smoke detectors, PM2 |
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Clientron to Showcase Its POS Solution at EuroShop 2017 (2017.02.23)
TAIPEI, Taiwan - Clientron will display its latest POS solution to the retail market at the world’s leading retail show, EuroShop 2017, on the 5th to 9th March 2017 in Dusseldorf, Germany.
During this trade show, Clientron will introduce all its new POS terminals and various built-in POS peripherals that are featured with the benefits of Green, Reliability, and Efficiency in order to meet the demands of Retail 4 |
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Toshiba to Ship Samples of 64-Layer, 512-gigabit 3D Flash Memory this Month (2017.02.22)
Toshiba Corporation has today unveiled the latest addition in its industry-leading line-up of BiCS FLASH three-dimensional flash memory with a stacked cell structure, a 64-layer device that achieves a 512-gigabit (64-gigabytes) capacity with 3-bit-per-cell (triple-level cell, TLC) technology |
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Global Smartphone/Mobile Phone Market Share Expected to Reach Nearly 80% in 2017 (2017.02.22)
Global mobile phone market volume reached 1.96 billion units in 2016 and is estimated to grow by 0.5% to 1.97 billion units in 2017. Of the total mobile phones sold in 2017, smartphones will account for nearly 80% or 1.56 billion units, up 5 |
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Amazon Introduces Latest Generation Fire TV Stick in the UK, Germany, and Japan (2017.02.22)
Amazon has announced that the latest generation Amazon Fire TV Stick is now available for customers in the UK, Germany, and Japan. Read the press release announcing Fire TV Stick with Alexa Voice Remote in the UK, Germany, and the Fire TV Stick with Voice Remote in Japan |
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Xilinx Unveils New All Programmable RFSoC for 5G Wireless (2017.02.22)
Xilinx announced a disruptive integration and architectural breakthrough for 5G wireless with the infusion of RF-class analog technology into its 16nm All Programmable MPSoCs. Xilinx's new All Programmable RFSoCs eliminate discrete data converters, providing 50-75% power and footprint reduction for 5G massive-MIMO and millimeter wave wireless backhaul applications |
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