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CTIMES / Electronic Science and Technology
Science and Technology
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Internet leads and standard-ISOC

ISOC Internet SOCiety which means that is the full name of Internet society, is a not-for-profit network of technology research and development institutions from 150 organizations in 182 countries worldwide with 11,000 individual members of the group, its role is to lead the Internet orientation and establishment of Internet specifications.
Toshiba Launches 8TB HDD for NAS Applications (2017.02.08)
Toshiba Corporation’s Storage & Electronic Devices Solutions Company today announced the launch of a new line-up of HDDs, “MN Series”, for network attached storage (NAS) applications. Shipments start from today. The new “MN Series” HDD line-up delivers up to 8TB capacity in a 3
Winbond's 3x-nm DRAM to Begin Mass Deliveries in Q3 2017 (2017.02.08)
TAIPEI, Taiwan - Taiwanese memory manufacturer Winbond yesterday at a corporate briefing session announced that Windbond has completed client authentication for 3x nanometer DRAM that they developed themselves, and they expect to begin mass deliveries in the third quarter of this year
AMOLED Production Equipment Purchases to Reach Record High in 2017 (2017.02.08)
The flat-panel display (FPD) industry is in the midst of a historic wave of building new factories to manufacture active matrix organic light emitting diode (AMOLED) displays. This will drive $9.5 billion worth of AMOLED-specific production equipment purchases in 2017, according to IHS Markit
Imec, Holst Centre and Cartamundi Introduce Plastic NFC Tag Communicating with Smartphones (2017.02.08)
Today, at the 2017 International Solid-State Circuits Conference in San Francisco, imec and Holst Centre and Cartamundi demonstrate a world first thin-film tag on plastic, compatible with the near field communication (NFC) Barcode protocol, a subset of ISO14443-A, which is available as standard in many commercial smartphones
eMemory Qualified NeoFuse in TSMC 16FFC Process (2017.02.08)
HSINCHU, Taiwan – Taiwanese NVM IP provider eMemory announces the availability of NeoFuse technology, qualified in TSMC’s 16nm FinFET Compact (16FFC) process. Customers have already embedded the NeoFuse IP for product tape-out
8.4 Billion Connected "Things" Will Be in Use in 2017 (2017.02.07)
Gartner, Inc. forecasts that 8.4 billion connected things will be in use worldwide in 2017, up 31 percent from 2016, and will reach 20.4 billion by 2020. Total spending on endpoints and services will reach almost $2 trillion in 2017
Industry's First Zero-drift, Zero-crossover Operational Amplifier (2017.02.07)
Continuing to set the standard for precision amplifiers, Texas Instruments (TI) introduced the first operational amplifier (op amp) to offer both zero-drift and zero-crossover technology. The OPA388 op amp maintains high precision across the entire input range for a variety of industrial applications, including test and measurement, medical and safety equipment, and high-resolution data-acquisition systems
POCT Market to Expand Rapidly at a CAGR of 9.7% From 2015 to 2020, TrendForce Reports (2017.02.07)
The aging of the world's population has led to steady annual increases in the number of patients suffering chronic diseases. With demand for long-term care of chronic diseases on the rise, the point-of-care testing (POCT) market has also experienced a boom
Sony Develops 3-Layer Stacked CMOS Image Sensor with DRAM for Smartphones (2017.02.07)
Sony Corporation today announced the development of the industry's first 3-layer stacked CMOS image sensor with DRAM for smartphones. The new image sensor consists of a DRAM layer added to the conventional 2-layer stacked CMOS image sensor with a layer of back-illuminated structure pixels and a chip affixed with mounted circuits for signal processing
New Simulation Capabilities for Polyurethane Foaming (2017.02.07)
Polyurethane foam is a common thermoset plastic material used in automotive manufacturing. It is a porous, low-density and high-strength material, and these features make polyurethane foam a popular material that can be widely applied in producing various automotive parts
HOLTEK New HT67F370 1.8V~5.5V ADC with LCD Flash MCU (2017.02.06)
Following the successful previous release of its 1.8V low voltage HT69F3x0 series, Holtek announces the release of a new Flash MCU, the HT67F370, a device which is especially suited for battery powered portable products. Setting the device apart from its predecessors is its more abundant set of system resources
Panasonic, UMC to Develop Mass Production Process for New ReRAM (2017.02.06)
Panasonic Semiconductor Solutions has reached an agreement with United Microelectronics Corporation (UMC) on the joint development of mass production process for next generation 40nm ReRAM. The agreed cooperative project will enable the integration of 40nm ReRAM process technologies developed by PSCS with UMC's high-reliability CMOS process technologies
OPPO, Huawei, and vivo Lead Other Smartphone Brands in China in 2016 (2017.02.06)
According to IDC, the smartphone market in China saw a 19% YoY growth and 17% QoQ growth in 2016Q4. For the full year of 2016, the market grew by 9% with top Chinese smartphone vendors taking up a larger share of the market. The 4 Chinese vendors in the top five were the same in 2015, and their share grew from 46% in 2015 to 57% in 2016
COMPUTEX's InnoVEX 2017 to Focus on AI and IoT (2017.02.06)
TAIPEI, Taiwan- Taipei Computer Association (TCA), one of organizers of COMPUTEX, said that the InnoVEX 2017 startup exhibition will start from May 30 to June 1 at COMPUTEX at the Taipei World Trade Center (TWTC) for a period of three days
In-store Shopping Is Still Mainstream for Buying Apparel in APAC, YouGov Says (2017.02.06)
For consumers across the Asia Pacific, shopping in-store is still the dominant means of purchasing apparel; more than three-quarters of those polled (79%) have shopped in-store in the past year. Shopping in-store is particularly prevalent for shoppers in Hong Kong, Australia, and Malaysia, where 88%, 85% and 84% have done so, according to YouGov
Qualcomm and TDK Announce Launch of Joint Venture (2017.02.06)
Qualcomm Incorporated and TDK Corporation announced the completion of the previously announced joint venture under the name RF360 Holdings Singapore PTE. Ltd. (RF360 Holdings). The joint venture will enable Qualcomm’s RFFE Business Unit to deliver RF front-end (RFFE) modules and RF filters into fully integrated systems for mobile devices and fast-growing business segments
LCD TV Shipments Grew 1.6% Annually in 2016 (2017.02.02)
Global shipments of LCD TV sets for 2016 increased 1.6% annually to reach 219.2 million units, according to WitsView, a division of TrendForce. Shipment growth was attributed to the strong sales in North America’s distribution channels during the busy season, the increasing affordability of large-size TVs and the robust housing market in China
Raspberry Pi Easy-to-solder Prototyping Board for Engineers and Students (2017.02.02)
RS Components has launched a 40-pin solder-tag board for the highly popular Raspberry Pi credit-card sized computer board. Exclusively available from RS, the new RS Pro solder-tag board is ideal for electronics engineers developing prototypes based around the Raspberry Pi board, as well as being well suited for education and the training of students and electronics beginners
GUC Unveils SSD ASIC Capabilities targeting TSMC 28nm Process Technologies (2017.02.02)
HSINCHU, Taiwan - Global Unichip Corp. (GUC) today rolled out its complete portfolio of solid state drive (SSD) ASIC capabilities. The company's SSD solution covers application-specific front end design capabilities, advanced node design flow experience, robust manufacturing management, and a production-proven IP set targeting TSMC 28HPC+ process technologies
Samsung and Apple Continued to as Top Semiconductor Customers in 2016, Gartner Says (2017.02.02)
Samsung Electronics and Apple remained the top two semiconductor chip buyers in 2016, representing 18.2 percent of the total worldwide market, according to Gartner, Inc. Samsung and Apple together consumed $61.7 billion of semiconductors in 2016, an increase of $0

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4 Grundfos and YCM Partner to Accelerate Smart and Energy-Efficient Machine Tool
5 ITRI to Cultivate Green Talents and Bridge Taiwan's Power Gap
6 u-blox CEO on IoT Innovation in Taiwan
7 Accuron Technologies, Hyundai CRADLE Co-Invest in Xnergy
8 Aerotech Expands XA4 PWM Servo Drive Series
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