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ASE Showcases Its Leading IC Assembly Technology at SEMICON China 2016 (2016.03.15)
TAIPEI, Taiwan － Advanced Semiconductor Engineering, Inc (ASE), announced it will be showcasing its System in Package (SiP) solutions in consumer and automotive applications at SEMICON China, scheduled to take place in Shanghai, China, from March 15 to 17, 2016 |
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Global AMOLED Panel Production Capacity to Increase 19.1% YoY in 2016, TrendForce Says (2016.03.15)
According to WitsView, a division of TrendForce, the global AMOLED panel production capacity by area will reach 7.9 million square meters in 2016, representing a 19.1% year-on-year increase. As panel makers worldwide continue to expand their AMOLED production, the total capacity for 2018 is forecast at 14 |
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Lattice, MediaTek Joint Release the Most Power Efficient 4K Video Solution Over USB Type-C (2016.03.14)
Lattice Semiconductor Corporation and MediaTek today announced the joint release of power-efficient reference designs that drive 4K UHD over a USB Type-C connector.
Lattice’s USB Type-C port controllers and MHL transceivers can easily be paired with MediaTek’s Helio X20, the world’s first mobile processor with Tri-Cluster CPU architecture and ten processing cores (Deca-core) |
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Small LES, COB LED Solutions with Advanced Color Quality for Premium Commercial LED Lighting (2016.03.14)
Samsung Electronics introduced new color quality improvements for its small LES (light-emitting surface) chip-on-board (COB) package LC series: LC010, LC020 and LC040.
Samsung’s small LES LC series offers three alternatives: the LC010C with an operating wattage of 10W and an LES diameter of 6mm; the LC020C with 20W and an 8mm LES diameter; and the LC040C with 40W and an 11mm LES diameter |
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M31 Announces Its Release of TSMC's 28HPC+ ULL SRAM Compilers for the Smart Devices (2016.03.14)
HSINCHU, Taiwan — M31 Technology Corporation announced today its release of TSMC's 28HPC+ ULL SRAM Compilers for the Intelligent Device Market. These IP cores will enable designers to realize the features and benefits of a low power, high performance, and cost effective SoC design |
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Automobile CMOS Sensor Market is Rapidly Growing (2016.03.14)
TAIPEI, Taiwan － According to Photonics Technology & Industry Devlopment Association (PIDA) statistics, in 2014 the total global CMOS sensor shipments amounted to 4.65 billion units. Chinese manufacturer Galaxycore was the top company, accounting for 21% of the shipments; whereas Japan’s Sony and the United States’ Omnivision made the second highest number of shipments at 19% |
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AIPTEK to Unveil Its Solution for Interactive Touchscreen projection at CeBIT 2016 (2016.03.14)
Taiwanese company AIPTEK International GmbH announced that the company is to unveil its solution for interactive touchscreen projection and a combined portable HD projector and Bluetooth speaker system with integrated battery at CeBIT 2016 in Hannover, Germany |
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Smallest, Most Stable 32 kHz Super-TCXO with In-System Auto-Calibration (2016.03.14)
SiTime Corporation, a MEMS and analog semiconductor company and a wholly owned subsidiary of MegaChips Corporation, introduced the SiT156x/7x families of 32 kHz Super-TCXOs.
These timing solutions are available in a tiny, 1 |
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LED Beam Control Modules for Medium and High Power Lighting Applications (2016.03.14)
Plessey announced that it will be releasing its LED beam control module, which they are branding Stellar at the Light and Building event from 13-18 March 2016 at the Fair and Exhibition Centre in Frankfurt, Germany.
Dr. Keith Strickland, Plessey's CTO, said, "As part of our chip scale optics development we have developed a variety of solutions for beam control off the LED chip |
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Intelligent Power Devices with Low On-Resistance (2016.03.14)
Renesas Electronics announced the availability of six new intelligent power devices (IPDs) for automotive motor and heater control applications. The devices provide an extremely reliable, high-performance solution compared with mechanical relays that switch the current flow on and off in electronic control units (ECUs) |
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eMemory Announces Industry’s First 16nm FinFET Compact Process Verified OTP Silicon IP (2016.03.14)
HSINCHU, Taiwan – eMemory announces today that its OTP technology NeoFuse has been verified in 16nm FinFET Compact process (16FFC), marking an important milestone as the world’s first IP provider to deliver a logic NVM solution in the cutting-edge 16FFC process platform |
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SEMI Taiwan Highlights Industry 4.0 at Semiconductor Smart Manufacturing Forum (2016.03.14)
Ideas about smart factories and Industry 4.0 have become one of the most important issues in Taiwan high-tech industry, and how to introduce these ideas into the production flows of various sectors will be a big challenge for the island in years to come |
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Imec Opens New 300mm Cleanroom Serving the Global Semiconductor Industry (2016.03.12)
imec announced the opening of its new 300mm cleanroom. With this 4000m2 new facility, imec’s state-of-the-art semiconductor research cleanrooms now totals 12,000m2, one of the most advanced research facilities in the world dedicated to scaling IC technology beyond 7nm |
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New 48V Solution Reduces Data Center Power Loss (2016.03.11)
Data center operators can now get closer to an ideal power usage effectiveness (PUE) of 1.00 using the 48V Point of Load (PoL), single-stage DC/DC regulator from Maxim Integrated Products, Inc.
Power delivery efficiency in data center equipment is at an inflection point |
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Big Data Applications Expected to Flourish in Sync with China's Smart City Development (2016.03.11)
The development of smart cities and big data will move in sync in China due to two factors, according to MIC (Market Intelligence and Consulting Institute), an ICT research institute based in Taiwan.
First, a smart city project generally lasts for three years |
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ASRock Rack to Showcase High-density 1U Solution and SoC Platform at WHD 2016 (2016.03.11)
ASRock Rack announced that th company will showcase its latest products at WorldHostingDays.global 2016 (WHD) in Rust, Germany, to share experiences with other greatest hosting and cloud services industry.
With high demand of bigger storage and consideration of limited space, ASRock Rack will demonstrate the best solution for temporal data management on cloud-based datacenter and warehousing environments, 1U2FH-8S2E and 1U12LX-14S |
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Scalable, Isolated Power Conversion Architecture of New 48V Power Architecture (2016.03.11)
STMicroelectronics(ST) today announced a new family of power-conversion ICs dedicated to 48V power architectures.
To meet ever-growing performance demands, servers and processors have ratcheted up their compute power-and power consumption-with multicore chips |
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PV Cell Prices Falling Faster Than Expected, TrendForce Reports (2016.03.11)
EnergyTrend, a division of TrendForce, reports that the global PV market is seeing slowing demand after the Chinese New Year holidays. Peak installation seasons in the U.S. and Japan have passed, and the demand related to China’s efforts to connect its PV power plants to the grid is also subsiding as this mission is set to be completed at the end of June |
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X-FAB Announces 6-inch SiC Production in Texas, United State (2016.03.11)
X-FAB Silicon Foundries announced the availability of its silicon carbide (SiC) offering from its wafer fab in Lubbock, Texas.
X-FAB Texas has heavily upgraded its manufacturing resources in order to make them “SiC-ready” |
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Acer Leads Ahead of Multiple Products in The Philippines (2016.03.11)
TAIPEI, TAIWAN －Acer success acrossed multiple product lines in the Philippines. According to IDC, Acer has led the notebook market for a decade (2006-2015) with between 28-35% market share, and has been the leader in total PCs for seven consecutive years (2009 – 2015) with 15-21% market share |
The highly integrated chipset, but only in recent years happened, if the CPU is the brain of the computer, Chipsets can be regarded as the heart of the computer.