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Prices of Low-End Smartphone Panels Up 10% in March, TrendForce Says (2016.03.10)
Prices of panels for smartphone displays were in an uptrend from the start of the fourth quarter of 2015 to just before the Chinese New Year holidays this year. Sales of smartphone panels during the period benefitted from strong export demand for Chinese panel products and clients stocking up for Chinese New Year sales events |
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Billion’s LCMS System Adopted by the Taipei City in a Freeway Smart LED Street Light Project (2016.03.10)
TAIPEI, Taiwan － Billion Electric announced that its LCMS (Smart Street Light Control and Management System) has been adopted by the Taipei City Government to complete a freeway Smart LED Street Light project in Taipei.
In the cooperation with the Taiwanese Ministry of Economy |
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Scale of the Telehealth Market in Particular Will Exceed US$7 Billion by 2020 (2016.03.10)
TrendForce reported that the medical device industry has huge growth potential due to advances in information communication technology (ICT). And the scale of the telehealth market in particular will exceed US$7 billion by 2020
“New technologies have significantly enhanced the capabilities of medical devices,” said Jason Huang, TrendForce’s research manager for the healthcare industry |
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New Open Modular Architecture for Industrial Cloud Computing (2016.03.10)
ADLINK Technology introduced Modular Industrial Cloud Architecture (MICA). This new industrial IOT architecture for commercial off-the-shelf (COTS) platforms features a design aimed at optimizing performance, cost and space requirements for the next generation of industrial IOT solutions |
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Compact, High Power Synchronous Boost DC/DC Converter (2016.03.10)
ROHM has recently announced the availability of a compact, high-efficiency, high power synchronous boost DC/DC converter IC optimized for single-cell battery applications.
Many of today's portable devices (i.e. smartphones and tablets) are driven by single-cell li-ion batteries that deliver an output of approximately 4 |
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3D Printing Spending in Asia Pacific to Grow at 23% CAGR by 2019 (2016.03.10)
According to the new Worldwide 3D Printing Spending Guide from International Data Corporation (IDC), 3D printing spending in Asia Pacific excluding Japan (APeJ) will grow at a 23% compounded annual growth rate (CAGR) from $1.5 billion to $4 |
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Keysight, SGS Partner on LTE-Advanced 3DL CA Conformance Test System (2016.03.10)
Keysight Technologies today announced a partnership with SGS in Taiwan for LTE-A 3DL CA conformance test cases validation for GCF and PTCRB approval.
Keysight recently introduced a new test platform, the TP195, to support the evolution of LTE standards |
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High Density Storage Server Chassis with 12Gb/s SAS Expander Fits 24 Hot Swappable 2.5” HDD (2016.03.10)
Chenbro announces its new high performance 2U server/storage chassis - RM23624. Features 24 hot swappable 2.5” drive bays for HDDs or SSDs and a 12Gb/s SAS expander that provides higher performance and reliability that data centers demand |
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All-Flash Storage Product from Wiwynn with Leading-edge NVMe Technology (2016.03.10)
Wiwynn announces the All-Flash Storage product, ST7110-30P, leveraging SSDs with leading-edge NVMe technology at the OCP U.S Summit 2016. Wiwynn is an OCP platinum member with extensive experience in developing OCP products for computing servers and storages |
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12 Megapixel Smartphones Image Sensor with Dual Pixel Technology (2016.03.09)
Samsung Electronics announced its newest 12 megapixel (Mp) image sensor for smartphones, which will elevate the quality of mobile phone pictures.
Already in mass production, this 1.4μm-pixel-based image sensor is equipped with Dual Pixel technology that has been reserved for DSLR cameras |
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Lite-On Displays NVMe M.2 PCIe SSD at the OCP Summit 2016 (2016.03.09)
Lite-On Storage Group announced today that the company will showcase its latest enterprise and client storage solutions at the San Jose Convention Center this year for the Open Compute Project (OCP) U.S. Summit.
The Open Compute Project (OCP) is specifically designed to standardize hyperscale solutions, building the most efficient servers, storage, and data center infrastructure with the greatest operational cost savings |
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Apacer Vying for Cloud and IoT Business Opportunities (2016.03.09)
TAIPEI, Taiwan － Taiwanese memory solution provider Apacer yesterday announced their business operations outlook for 2016. They pointed out that because cloud and Internet of Things (IoT) have produced massive information storage and application requirements, Apacer wil develop potential applications such as information retrieval, information analysis, information control, and information sharing |
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eMemory Announces Specialty NeoFuse IP for Cryptographic Security (2016.03.09)
HSINCHU, Taiwan – eMemory today announces its specialty NeoFuse IP for cryptographic security. This logic NVM solution is based on NeoFuse technology and offers a truly random physical source with high immunity to temperature and voltage variation |
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DNP, E Ink Announces a Strategic Partnership to Co-develop Products (2016.03.09)
Dai Nippon Printing, one of the world’s largest printing companies, and E Ink announced a strategic partnership to co-develop and co-market products using E Ink epaper. The collaboration will focus on expanding these businesses in the Japanese and Southeast Asia market |
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IBM Opens First Cloud Data Center in South Africa (2016.03.09)
IBM announced today that it is opening a new IBM Cloud Data Center in Johannesburg, South Africa. The new cloud center is the result of a close collaboration with Gijima and Vodacom and is designed to support cloud adoption and customer demand across the continent |
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TCI to Showcase Total Digital Signage Solutions at DSE 2016 (2016.03.09)
TAIPEI, Taiwan － The Digital Signage Expo (DSE) will be held on March 15 and 18 of this year in Las Vegas, U.S.A. Taiwanese touch solutions provider, Twinwill Communtech Inc.(TCI), will unveil their comprehensive solutions at the exhibition, which include large- sized 4K touch panel, high brightness LCD display, and a smart digital signage management system to satisfy the diverse requirements of different industrial applications |
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18-Bit, 8-Channel, 1Msps Multiplexed SAR ADC (2016.03.08)
Linear Technology Corporation introduces the LTC2335-18, an 18-bit, 8-channel 1Msps multiplexed input successive approximation register (SAR) ADC with independently configurable input ranges. Each SoftSpan input can be software configured on a conversion-by-conversion basis to accept ±10 |
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Thailand's Semiconductor Sector to Tap US$280B Global Automotive Electronics Industry (2016.03.08)
According to SEMI, constituting a nearly USD$100 billion industry, Thailand's E&E sector has played a vital role in growing the country's economy as a major export earner and positioning Thailand as one of the semiconductor leaders in the Southeast Asia region |
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New Ultra-efficient ARM Cortex-A32 Processor Expands Embedded and IoT Portfolio (2016.03.08)
ARM announces the latest addition to the family of ultra-efficient ARM application processors, the ARM Cortex-A32 processor, targeting next-generation embedded products. The Cortex-A32 processor brings the benefits of the ARMv8-A architecture into power-constrained, 32-bit embedded applications |
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KOOV, A New Educational Kit for Robotics and Programming (2016.03.08)
Sony Global Education today unveiled its new educational kit called "KOOV", a program which takes a fresh approach to learning robotics and programming.
KOOV is the first offering in Sony Global Education's "STEM101" curriculum that it announced last autumn |
Overall, the number of times the Bus specification standard is rising between mainframe computers and peripherals, data transfer speed, capacity and quality of the application process. Let's Introduction to several important bus application specifications.