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ThroughTek Expands on IoT Solutions for Surveillance and Smart Home at MWC (2016.02.23)
TAIPEI, Taiwan － ThroughTek, a Taiwanese IoT platform solutions provider, worked with the Kalay Platform to showcase its IoT solutions for surveillance, smart Home and unveils future data initiatives at MWC 2016 in Barcelona |
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HTC Reveals Complete Vive System at MWC, Available for Pre-order (2016.02.23)
HTC handed with Valve, today unveiled the consumer edition of its Vive virtual reality system. This complete Vive system, powered by SteamVR, introduces yet another new technology, can be pre-ordered at priced of US$799 from 29th February 2016 |
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Taiwanese Companies Acer, ASUS, D-Link and ZyXEL Showcase Their Latest Products at MWC (2016.02.23)
The Taiwan Excellence Pavilion, an exclusive showcase of mobile communication technology of Taiwan, has been unveiled on the opening day of MWC 2016.
Including Acer, ASUS, D-Link and ZyXEL are demostraing their latest products at this showcase |
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Siemens, IBM Team on Next-gen of Cloud-based Building Energy Management Solutions (2016.02.23)
The Siemens Buildings Technologies Division and IBM announced today cloud-based solutions that will leverage Siemens’ building expertise and IBM Internet of Things (IoT) capabilities to maximize the potential of connected buildings and the data they create, helping corporate real estate owners across multiple industries drive business results and meet energy efficiency goals |
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China, India Forecast to Account for 45% of the Subscriber Increase in Mobile Network (2016.02.23)
Almost three-quarters of the world’s population will be connected to a mobile network by 2020, according to the latest study from GSMA Intelligence, the research arm of the GSMA. And China and India are forecast to account for 45 percent of the subscriber increase over the next five years |
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AAEON Exhibits Its Latest in Embedded World 2016 (2016.02.22)
AAEON will showcase a wide array of products for the burgeoning IoT paradigm at Embedded World 2016 in Nuremberg from February 23 – 25, 2016.
From modules to boards of varying form factors, embedded to rugged handheld devices |
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Helio P20, Ultra-power Saving SoC for Slim Smartphones (2016.02.22)
MediaTek today announced the MediaTek Helio P20 system-on-chip, an ultra-power saving SoC and the latest addition to its top-tier MediaTek Helio family of mobile processors.
The MediaTek Helio P20 brings new experiences to consumers and design freedom to device makers by combining impressive battery life, powerful performance and premium features for the next generation of smartphones |
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MediaTek Partners with NTT DOCOMO for 5G Technology Development and Trials (2016.02.22)
NTT DOCOMO, INC. and MediaTek today announced a joint effort to drive 5G technology development. The two companies will collaborate on developing new 5G air interface and chipsets required for 5G devices, raising spectrum efficiency and increasing data capacity |
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In-Flight Mobile Roaming Revenues to Reach $3Bn by 2020 (2016.02.22)
A new report from Juniper Research has valued operator in-flight roaming revenues at nearly $3 billion by 2020, doubling the value estimated for this year. This figure includes mobile voice, data and SMS.
However, in terms of total operator billed mobile roaming revenues, in-flight roaming will only represent around 5% of revenues globally by 2020 |
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Taiwanese Spent an Average of 19 Hours Watching On-line Video (2016.02.22)
TAIPEI, Taiwan － InsightXplorer and comScore announced the latest situation involving Internet users’ audio and video habits in Taiwan. In December 2015 there was a total of 11.593 million non-repeated Internet users, which comprised 87 |
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Acer Showcases Diverse BYOC Solutions at MWC (2016.02.22)
Acer is showcasing its latest BYOC (Build Your Own Cloud) developments at Mobile World Congress (MWC) 2016 in Barcelona, in the fields of connected car, smart home, business, and education.
Together with its partner ATS (Advanced Telematic Systems), Acer announces OTA+, an open-standards based solution facilitating over-the-air updates for connected vehicles |
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Samsung Announces Its New Exynos 7 Octa CPU Line-up, The Exynos 7 Octa 7870 (2016.02.22)
Samsung Electronics Co., Ltd., announced the newest member of its Exynos 7 Octa processor line-up, the Exynos 7 Octa 7870. Using 14-nanometer (nm) FinFET process technology, the Exynos 7 Octa 7870 is designed for next-generation mid-range smartphones and other mobile devices |
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ZTE, China Mobile Announce Latest 5G High-Frequency Prototype (2016.02.22)
ZTE Corporation, China Mobile, today officially announced their latest 5G high-frequency prototype and demonstrated 10 Gbps+ high bitrate, beam-tracking, and other key 5G technologies.
High-frequency communication is a critical area of technology in 5G |
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High Efficiency System Power Supply IC for Car Audio (2016.02.22)
To meet the expanding needs of the car audio market for multifunction power supplies, ROHM developed a system power supply IC that features the lowest power consumption in the industry.
The BD49101AEFS-M leverages ROHM's expertise in car audio power system design to achieve an optimized system based on a high-efficiency DC/DC converter |
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ROHM Establishes a New Production Facility for Discrete Semiconductors in Malaysia (2016.02.22)
ROHM have announced plans to build a new facility at its manufacturing subsidiary in Malaysia, ROHM-WAKO ELECTRONICS SDN.BHD (RWEM), to meet the need for increased production capability for discrete semiconductors, such as diodes |
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CleO, the Smart TFT Display for Arduino (2016.02.20)
FTDI Chip today announced its second crowdfunding projec: CleO, a maker device which based on the FTDI FT903 SuperBridge MCU & FT810 3-in-1 graphics controller, will be shown at Embedded World 2016.
Leveraging the processing power of both the FT903 and FT810 |
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Prices of Multi-Si Products to Go Flat Due to Major Changes in PV Demand after Chinese New Year (2016.02.20)
In China, more PV power plants are switching to mono-Si products. This factor and the impending end of the country’s installation rush have caused prices of multi-Si products (e.g. wafers, cells and modules) to level after the Chinese New Year holidays, said Corrine Lin, assistant research manager for EnergyTrend, a division of TrendForce |
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imec and iMinds to Merge and Create High-Tech Research Center Driving the Digital Economy (2016.02.20)
imec, and digital research and incubation center, iMinds, today announced that its respective board of directors have approved the intention to merge the research centers. Using the imec name, the combined entities will create a world-class, high-tech research center for the digital economy |
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Winjit to Showcase Its IOT GDM Capabilities at MWC 2016 (2016.02.20)
Winjit announced that the company would be demonstrating their advance IOT Gateway at the prestigious Mobile World Congress which opens on 22nd February at Barcelona.
Mr. Abhijit Junagade, Co-Founder, Winjit Technologies said “We are extremely excited, as the Winjit team travels to Barcelona this week to participate in the Mobile World Congress |
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An IoT Platform Enables Material Analysis of Food, Drugs (2016.02.19)
Analog Devices, Inc. (ADI) and Consumer Physics, Inc. (CP) today announced a collaboration to develop a sensor-to-cloud personal and industrial IoT platform that analyzes liquids and solids, including food, plants, drugs, chemicals, the human body, and a variety of other materials |
Transmission technology into the digital era, users and manufacturers are increasingly focusing on the quality requirements of the digital display, digital display interface standard combination of hardware graphics card, and therefore more subject to the attention of the progress of its development.