 |
Samsung Announces Mass Production of 256GB Embedded Memory Based on V-NAND Flash (2016.02.25)
Samsung Electronics announced today that it is now mass producing the industry’s first 256-gigabyte (GB) embedded memory based on the Universal Flash Storage (UFS) 2.0 standard, for next-generation high-end mobile devices. T
The new Samsung UFS memory satisfies needs for ultra-fast speed, large data capacity and compact chip size in high-end smartphones |
|
Sharp Agrees to Be Acquired But Foxconn Says Not Yet (2016.02.25)
TAIPEI, Taiwan － Sharp announced today that the comoany agreed to accept Hon Hai/ Foxconn’s reconstruction program of JP¥700 billion, and to be auguired by Foxconn. However, Foxconn said that the two sides have not reached a consensus |
 |
LED-Compatible Materials for Light Engines (2016.02.25)
DELO Industrial Adhesives has tested and released 14 adhesives for use in LED lighting. Ten products have received approval for direct LED contact, and an additional four were certified for indirect contact. They allow for durable, high-intensity LED modules and light engines |
|
Qualcomm Founder Irwin Mark Jacobs to Donate NT$60M to Assist Taiwan’s Academic Innovation (2016.02.25)
TAIPEI, Taiwan － According to Taiwan's Economic Daily News, Qualcomm founder Irwin Mark Jacobs will donate NT$60 million to Taiwan National Tsing Hua University for developing the academic innovation. This is the first time for Irwin Jacobs to contribute Taiwan’s universities in capital donation |
|
Visualizing Warpage Behavior during Post-mold Cure Stage in IC Packaging Using Advanced CAE Technolo (2016.02.25)
Epoxy Molding Compounds (EMC) are thermosetting plastic materials that are commonly used in the IC encapsulation process. During the filling stage of the encapsulation process, the cross-linking of polymer chains occurs as the temperature increases; when the cross-linking reaction reaches a certain degree, the EMC encapsulates will start to cure, which ultimately leads to better mechanical properties and stability of the finished products |
|
R&S TS7124 RF Shielded Box and R&S CMW100 Test Set (2016.02.25)
A compact, flexible turnkey solution consisting of the R&S CMW100 communications manufacturing test set and the R&S TS7124 RF shielded box offers unprecedented flexibility and measurement accuracy while reducing manufacturing line test time for all production test cases: calibration, verification or functional tests |
|
FT260: HID Class USB Device Bridges to I2C and UART Interfaces (2016.02.25)
The FT260 offers a new era in easy bridging of different protocols to USB. Operating as a HID (Human Interface Device) class USB device, this is the first FTDI solution that does not require specifc vendor class drivers to be loaded to enable operation, simplifying the user experience even more than before |
|
HOLTEK HT66F0186 A/D Flash MCU with internal 4K Bytes EEPROM (2016.02.25)
Holtek announces the release of an addition to its A/D type Flash MCU range with the new HT66F0186. As an extension product of the HT66F0185, the new device provides abundant system resources and with its internal 1K bytes of SRAM and 4K bytes of EEPROM, the device is suitable for security product applications with large EEPROM size requirement such as gas alarms |
|
Acer Monitors Rank No. 1 in North American Retail Market of more Than 20% in 2015 (2016.02.25)
TAIPEI, Taiwan － Acer was the No. 1 ranking brand for LCD monitors in the US retail market for year 2015, according to global information company, The NPD Group.
Acer led the market with more than 20 percent market share and grew 26 percent year-on-year for unit shipments, far exceeding the industry average of 6 percent |
|
ZTE and Korea Telecom Showcase Pre5G at MWC 2016 (2016.02.24)
ZTE today announced its joint demonstration with Korea Telecom at Mobile World Congress 2016. The companies will exhibit a Pre5G Massive multiple input multiple output (MIMO) base station demonstrating their latest cooperative achievements in the 5G field |
|
Tsinghua Unigroup to Adjust Its Approach to Get NAND Flash Technology After Terminating the WD Deal (2016.02.24)
Unisplendour, the Hong Kong-based subsidiary of Chinese technology conglomerate Tsinghua Unigroup, announced on February 23 that its board decided to terminate their investment plan in U.S. data storage company Western Digital (WD) |
|
AUO Lifts New Display Products for 2016; AMOLED Lights Up (2016.02.24)
TAIPEI, Taiwan － AUO(AU Optronics Corp) yesterday held new products and technologies announcement conference at its headquarters in Hsinchu, Taiwan, where the company showcased a new 65-inch borderless flat ALCD TV panel, Free-form Cutting curved 25-inch automotive touch panel, 12 |
|
Advantech Partners with Industrial Leaders on Promoting Open IoT Sensing Platform (2016.02.24)
TAIPEI, Taiwan － Advantech on February 24 at Embedded World held the M2.COM open standard IoT sensing platform launching ceremony. ARM, Bosch Sensortec, Sensirion, and Texas Instruments were also in attendance at the event to collectively promote the M2 |
|
Industry’s Highest Performing 8-bit tinyAVRs with 1kB Flash (2016.02.24)
At Embedded World 2016, Atmel announced the world’s highest performing, low power, 8-bit MCUs with 1kB Flash memory.
The new ATtiny102/104 MCUs run up to 12MIPS and integrate features previously only available in larger more expensive MCUs, making them ideal for smaller applications including logic replacement and the latest cost-optimized applications in the consumer, industrial and home automation markets |
|
Astro Carrier, Deployment-ready Carrier Board for NVIDIA Supercomputing Module (2016.02.24)
Connect Tech Inc. (CTI), an Ontario, Canada-based embedded-computing group, has launched the Astro Carrier for Jetson TX1. It’s the first commercially available, deployment-ready carrier board for NVIDIA supercomputing module |
|
New Wireless SoC Portfolio Provides Scalable Solutions Supporting IoT Connectivity (2016.02.24)
Silicon Labs has introduced its Wireless Gecko portfolio of multiprotocol system-on-chip (SoC) devices, providing flexible connectivity and price/performance options for Internet of Things (IoT) devices.
Silicon Labs’ new Wireless Gecko SoCs integrate a powerful ARM Cortex-M4 core, energy-friendly Gecko technology, a 2 |
|
GSMA: Digital Literacy, Local Content Are Key to Connecting Latin America and the Caribbean (2016.02.24)
According to a series of new reports commissioned by GSMA’s Connected Society and produced by GSMA Intelligence, tackling digital literacy and ensuring that locally relevant content and services are available will be key to connecting the estimated 363 million citizens in Latin America and the Caribbean |
|
MediaTek’s First Bio-sensing Analog Front-end Chip, MT2511 (2016.02.23)
MediaTek announced the MT2511, MediaTek’s first bio-sensing analog front-end (AFE) chip designed for health and fitness devices. The MT2511 enables bio signal acquisition through electrocardiography (ECG) and photoplethysmography (PPG) simultaneously |
|
Nordic nRF52832, The Most Advanced Bluetooth Smart Single Chip on the Market (2016.02.23)
Nordic Semiconductor announces that the first nRF52832 member of its latest nRF52 Series Systems-on-Chip (SoCs) – the most advanced Bluetooth Smart single-chip available on the market today.
The mass production version of the nRF52832 is certified to the latest Bluetooth v4 |
|
Development Kit for Integrated 2D PCAP and 3D Gestures on Displays (2016.02.23)
Microchip Technology announced the industry’s first development kit for integrated 2D projective capacitive touch (PCAP) and 3D gesture recognition on displays – the 2D/3D Touch and Gesture Development Kit (DV102014).
The kit will provide designers easy access to Microchip’s patented 2D and 3D GestIC® sensing technology, allowing them to easily integrate 2D multi-touch and 3D hand gesture recognition into their display applications |
IBM's AIX, Sun's Solaris, HP's HP-UX, or Linux, etc., are from 1969, AT & T Bell Laboratories (Bell Labs) developed Unix reviewing this history, MULTICS (MULTiplexed Informationand Computing Service) plan is an important key. .