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Mitsubishi and the University of Tokyo Reducing SiC Power Semiconductor Resistance by Two-Thirds (2017.12.05)
Mitsubishi Electric Corporation and the University of Tokyo announced today that they believe they are the first to quantify the impacts of three electron-scattering mechanisms for determining the resistance of silicon carbide (SiC) power semiconductor devices in power semiconductor modules |
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Samsung Starts Producing First 512GB Universal Flash Storage (2017.12.05)
Samsung Electronics today announced that it has begun mass production of the industry’s first 512-gigabyte (GB) embedded Universal Flash Storage (eUFS) solution for use in next-generation mobile devices. Utilizing Samsung’s latest 64-layer 512-gigabit (Gb) V-NAND chips, the new 512GB eUFS package provides unparalleled storage capacity and outstanding performance for upcoming flagship smartphones and tablets |
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TSMC to Hold Supply Chain Forum This Week to Announce 7nm Manufacturing Process Schedule (2017.12.05)
TAIPEI, Taiwan - Taiwan Semiconductor Manufacturing Company, Limited (TSMC) on December 7 of this week will hold a supply chain forum. It is unusual for TSMC to hold this kind of event twice in a year. At the supply chain forum this time, co-CEO Mark Liu will deliver a keynote speech, and he is expected to announce both the 7nm volume production process as well as the 5nm progress of 5nm trial production and production |
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Semiconductor Industry Continues Upward Trend Toward Record Year, IHS Markit Says (2017.12.04)
The semiconductor industry continued its upward trend in the third quarter of 2017, notching 12 percent sequential growth with strength across all application markets, according to IHS Markit. Global revenue totaled $113.9 billion, up from $101 |
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World’s First Stereo-AEC Linear Far-field Voice Kit for Smart Devices (2017.12.04)
XMOS announced the XVF3500 voice processor which supports stereo-AEC, along with the world’s first stereo AEC far-field linear microphone array solution, the VocalFusion Stereo Evaluation Kit (XK-VF3500-L33).
The XVF3500 voice processor delivers 2-channel full duplex acoustic echo cancellation (AEC) |
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China's BOE Pushing Positively to Supply Its OLED Panels to Apple (2017.12.04)
TAIPEI, Taiwan - According to Economic Daily News, Beijing Oriental Enterprise (BOE), the LCD panel factory in China positively contacts with Apple, illustrating the latest progress of its OLED factory, and desire to get adopted by Apple |
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Mini LED sees Potential in Backlighting and Digital Display, TrendForce Says (2017.12.04)
LEDinside, a division of TrendForce, points out that LED manufacturers have turned to research and development of Mini LED, due to Micro LED’s technological bottlenecks which make it harder to realize commercialization in short term |
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Industrial 3D Printer Market Growing 27% in 2017, Says The Information Network (2017.12.04)
Industrial 3D printers are slated to grow 27% in 2017, lifted by sales by Hewlett-Packard, according to the Information Network, a New Tripoli-based market research company.
3D printers are segmented in this report as Industrial and Consumer |
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Synopsys Delivers a Complete HDMI 2.1 IP Solution with HDCP 2.2 Content Protection (2017.12.01)
Synopsys announced its complete DesignWare HDMI 2.1 IP solution with High-Bandwidth Digital Content Protection (HDCP) 2.2 consisting of controllers, PHYs, verification IP, IP Prototyping Kit, and IP Subsystem as well as Linux software drivers |
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Toshiba Memory Corporation Unveils 2TB NVMe SSD (2017.11.30)
Toshiba Memory Corporation has enhanced its line-up of client SSDs with the launch of premium models in its XG5-P series. The new NVM Express (NVMe) client SSDs improve on the performance of the current XG5 series models and double the maximum capacity to 2TB |
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Vesper Launches High Performance VM2000 Microphone for Smart Speakers (2017.11.30)
Vesper introduced the VM2000, the only MEMS microphone that maintains high system performance over the life of a product. Targeting voice-activated systems such as smart speakers, smart home and Internet of Things (IoT) products — which use microphone arrays to enhance voice capture and clarity — the VM2000 solves a critical need for stable, reliable and accurate microphone arrays that do not degrade over time |
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Vangochip Technology Delivers Wi-SUN Certified Sub-GHz RF Platform (2017.11.29)
HSINCHU, Taiwan - Vangochip Technology today announced its first-gen sub-GHz RF family VC7000 passed the Wi-SUN Alliance PHY Certification.
Wi-SUN Alliance PHY Certification Program includes: PHY Conformance Testing based on IEEE 802 |
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DENSO and NEC Establish a JV to Develop Essential Connectivity Technologies for Cars (2017.11.29)
DENSO and NEC Platforms, Ltd., a subsidiary of NEC Corporation, today unveiled a new joint venture, DENSO NEXT CO., LTD. The company will develop in-vehicle information and communications equipment critical for fostering a truly connected environment inside vehicles |
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Toshiba Memory Unveils UFS Devices Utilizing 64-Layer, 3D Flash Memory (2017.11.29)
Toshiba Memory Corporation started sampling Universal Flash Storage (UFS) devices utilizing Toshiba Memory Corporation’s cutting-edge 64-layer, BiCS FLASH 3D flash memory. The new UFS devices meet performance demands for applications that require high-speed read/write performance and low power consumption, including mobile devices such as smartphones and tablets, and augmented and virtual reality systems |
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Samsung Starts Mass Production of Its 2nd Generation 10nm FinFET Process Technology (2017.11.29)
Samsung Electronics today announced that its Foundry Business has commenced mass production of System-on-Chip (SoC) products built on its second generation 10-nanometer (nm) FinFET process technology, 10LPP (Low Power Plus).
10LPP process technology allows up to 10-percent higher performance or 15-percent lower power consumption compared to its first generation 10nm process technology, 10LPE (Low Power Early) |
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Four Macronix Technical Papers Selected for 2017 IEDM (2017.11.29)
HSINCHU, Taiwan - Macronix International today announces that it has four technical papers selected for presentation at 2017 IEEE International Electron Devices Meeting (IEDM) which is taking place in San Francisco, USA from December 2-6 |
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Canadian Solar to Establish Factory in Taiwan (2017.11.29)
TAIPEI, Taiwan - Global top five solar modular manufacturer Canadian Solar will establish a factory in Taiwan, which will possibly be located in Houkou Township, Hsinchu with a production capacity of approximately 500 million watts(MW) module capacity |
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DOCOMO Develops Multi-Profile SIM for Smartphones and Tablets (2017.11.28)
NTT DOCOMO announced today that in collaboration with Gemalto, it has developed the world's first multi-profile SIM for use through multi-carrier collaborations that can allow users to switch between profiles, which include data such as contract information and telephone numbers, on their smartphone or tablet in each country |
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ASE to Enlarge High-End Packaging Plant in Kaohsiung (2017.11.28)
TAIPEI, Taiwan - The ASE Group is the largest semiconductor packaging manufacturer globally and will expand their high-end packaging production capacity in their planned Kaohsiung high-end packaging plant. Furthermore, they have already formally submitted their requirements for land to the Ministry of Economic Affairs and Kaohsiung City Government |
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Hyundai Mobis Develops Autonomous Reverse-Driving Technology (2017.11.28)
Hyundai Mobis announced that it had developed reverse driving support technology that autonomously steers when a car goes back without the driver having to operate the steering wheel.
Though there is already a function called Parking Assist (PA), which autonomously steers a car in reverse parking, this is the first time that a technology has been specifically developed to support reverse driving |
IBM's AIX, Sun's Solaris, HP's HP-UX, or Linux, etc., are from 1969, AT & T Bell Laboratories (Bell Labs) developed Unix reviewing this history, MULTICS (MULTiplexed Informationand Computing Service) plan is an important key. .